ASUS today announced Zenbook S 14 (UX5406), one of the thinnest and most portable 14-inch new-era ASUS AI PCs on the market, blending performance with sophistication. The premium Zenbook S 14 showcases a new functional aesthetic, and has been completely redesigned inside and out. The chassis features the new, innovative ASUS Ceraluminum, a high-tech ceramic hybrid material available in a range of nature-inspired colors. This industry-first material offers exceptional strength, effortlessly resisting scratches and wear.

Zenbook S 14 is powered by up to the latest AI-enabled Intel Core Ultra 9 processor (Series 2) and Intel Arc graphics, delivering up to 48 NPU TOPS. Advanced CNC milling enables the integration of an ultraslim vapor chamber in the ultra-quiet ambient cooling system—unique for such a thin device—ensuring up to 28-watt CPU TDP performance with minimal noise. The functional design features a dedicated Copilot key and an enlarged 16:10 seamless touchpad that supports smart gestures.

AMD is readying a major update to its category-defining Ryzen Z-series SoCs, with the new Ryzen Z2. Designed for handheld game consoles, the Ryzen Z-series chips are typically power-optimized variants of its mobile processors designed for ultra-low board footprint, allowing PC OEMs to build handheld game consoles with them. Facing competition from Intel's upcoming Core Ultra 200V "Lunar Lake-MX" SoCs in this segment, AMD is readying the Ryzen Z2 chip. The Z2 is based on the 4 nm "Strix Point" silicon, which gives it a significantly updated iGPU, as well as a higher core-count CPU.

Perhaps the biggest sub-system performance uplift console designers can expect from the Ryzen Z2 is graphics—AMD has given the "Strix Point" a larger iGPU with 16 compute units in place of 12 on "Phoenix," which is a 33% increase in just numerical terms. Then there's also the update to the newer RDNA 3.5 graphics architecture, which incorporates several architecture-level performance and battery-efficiency improvements. It's also better optimized for LPDDR5 memory. With CPU, AMD has given "Strix Point" a heterogeneous multicore setup with four "Zen 5" and eight "Zen 5c" cores. At this point, we don't know if all 12 cores are enabled on the Z2. ASUS is designing its next generation of ROG Ally consoles powered by the Ryzen Z2, and its designers hint that the console should be able to offer over 1 hour of "Black Myth: Wukong" gameplay on a full charge of battery—something current-gen ROG Ally X powered by the Z1 doesn't.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Acer today unveiled the new TravelMate P6 14 AI, leading the market with Copilot+ PCs under 1 kg. This new Windows 11 Pro laptop delivers exceptional performance, mobility and AI capabilities for businesses and institutions. It is powered by Intel Core Ultra processors (Series 2) with a built-in NPU boasting up to 120 total platform TOPS AI performance in a compact, carbon fiber chassis.

This latest TravelMate boasts a stunning 14-inch WQXGA+ (2880x1800) 16:10 display with IPS technology or WUXGA (1920x1200) panel featuring high 400 nit brightness and 100% sRGB color gamut, supporting outstanding picture quality. Thin bezels and a high 82% screen-to-body ratio maximize the screen area for more immersive viewing experiences.

Acer today launched new Swift 14 AI and Swift 16 AI Copilot+ PCs, its first Swift models powered by new Intel Core Ultra processors (Series 2). The ultra-sleek, striking laptops are equipped with the latest in all-new processing capabilities and deliver up to 48 Trillions of Operations Per Second (TOPS) NPU AI performance to handle power-demanding AI workloads.

Powerful AI Processing with Advanced Security Features
The new Acer Swift 14 AI (SF14-51/T) and Swift 16 AI (SF16-51/T) deliver best-in-class AI performance with new Intel Core Ultra processors that optimize processing across the CPU, built-in Intel Arc graphics, and next-gen neural processing unit (NPU) to accelerate AI workloads. As a result, the new laptops can accelerate generative AI tasks and creations with ease. They also feature new P-cores and E-cores designed for uncompromised performance while delivering exceptional power efficiency and battery life.

AMD "Strix Halo" isn't just a mobile processor with an oversized iGPU meant to power "gaming ultraportables," it has other potential applications such as game consoles (both handheld and standalone). Not willing to cede this market to AMD, Intel is reportedly readying its own such chip, which is being reported as the "Arrow Lake Halo" for the lack of an official name. This chip will feature a large iGPU based on the Xe2 "Battlemage" graphics architecture, the variant of Xe2 Intel plans to use for its next-generation Arc discrete GPUs. The CPU compute complex will be carried over from the regular "Arrow Lake" chips, and feature a mix of "Lion Cove" P-cores, and "Skymont" E-core clusters.

To meet the higher memory bandwidth demand that arises from a high-performance iGPU and CPU, AMD designed the RDNA 3.5 graphics architecture to be more LPDDR5-aware, since at the physical layer, LPDDR operates differently from GDDR. Intel will probably do something similar, and deploy a 256-bit wide LPDDR5/x memory interface replacing the 128-bit wide interface the regular "Arrow Lake" mobile chips come with. Whether "Arrow Lake Halo" and "Strix Halo" remain competitive will depend a lot on which gaming experiences the two companies want to sell. The way the iGPU of "Strix Halo" is rumored to be specced suggests something that is 1440p-capable, or 4K-capable with FSR 3.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of the JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, consistent with the updated contents of JESD401-5B DDR5 DIMM Label and JESD318 DDR5/LPDDR5 Compression Attached Memory Module (CAMM2) Common Standard.

JESD406-5 documents the contents of the SPD non-volatile configuration device included on all JEDEC standard memory modules using LPDDR5/5X SDRAMs, including the CAMM2 standard designs outlined in JESD318. The JESD401-5B standard defines the content of standard memory module labels using the other two standards, assisting end users in selecting compatible modules for their applications.

SK hynix has returned to Santa Clara, California to present its full array of groundbreaking AI memory technologies at FMS: the Future of Memory and Storage (FMS) 2024 from August 6-8. Previously known as Flash Memory Summit, the conference changed its name to reflect its broader focus on all types of memory and storage products amid growing interest in AI. Bringing together industry leaders, customers, and IT professionals, FMS 2024 covers the latest trends and innovations shaping the memory industry.

Participating in the event under the slogan "Memory, The Power of AI," SK hynix is showcasing its outstanding memory capabilities through a keynote presentation, multiple technology sessions, and product exhibits.

ASUS is betting bigger on game consoles or PCs built like consoles. The company in 2023 introduced the first ROG Z13 Flow, a gaming-grade tablet, powered by a 13th Gen Core "Raptor Lake" processor and mid-tier RTX 40-series "Ada" discrete mobile GPU. The 2025 ROG Z13 Flow is a 13-inch, 16:10 tablet with an integrated kickstand. You can use it like a handheld with touch controls, or place it on a surface and use conventional gaming peripherals, such as keyboard+mouse, or a game controller. Since the device is meant to provide a AAA gaming experience, it packs some serious kit.

Apparently, the 2025 ASUS ROG Z13 Flow will implement AMD's upcoming "Strix Halo" processor that packs up to 16 "Zen 5" CPU cores, and an oversized iGPU with 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5 memory interface, besides a 50 TOPS-class NPU to qualify for Copilot+ AI PC rating. Such a chip would meet the hardware goals of the ROG Z13 Flow, and eliminate the need for a discrete GPU, letting ASUS reduce the mainboard size. The power management of "Strix Halo" would see the CPU and SoC given a roughly 30 W budget, and the iGPU roughly 80 W. Its cooling solution focuses squarely on the "Strix Halo" chip, with no other major chip on the device (the SoC is wired out to serve all chipset functions, no FCH needed).

Qualcomm has started accepting preorders for its Snapdragon Dev Kit for Windows, based on the Snapdragon X Elite processor. Initially announced in May, the device is now available for preorder through Arrow at a competitive price point of $899. Despite its relatively high cost compared to typical mini PCs, it undercuts most recent laptops equipped with Snapdragon X processors, making it an attractive option for both developers and power users alike. Measuring a mere 199 x 175 x 35 mm, it comes equipped with 32 GB of LPDDR5x RAM, a 512 GB NVMe SSD, and support for the latest Wi-Fi 7 and Bluetooth 5 technologies. The connectivity options are equally robust, featuring three USB4 Type-C ports, two USB 3.2 Type-A ports, an HDMI output, and an Ethernet port.

This mini PC's heart lies the Snapdragon X Elite (X1E-00-1DE) processor. This chip houses 12 Oryon CPU cores capable of reaching speeds up to 3.8 GHz, with a dual-core boost potential of 4.3 GHz. The processor also integrates Adreno graphics, delivering up to 4.6 TFLOPS of performance, and a Hexagon NPU capable of up to 45 TOPS for AI tasks. While similar to its laptop counterpart, the X1E-84-100, this version is optimized for desktop use. It can consume up to 80 watts of power, enabling superior sustained performance without the constraints of battery life or heat dissipation typically associated with mobile devices. This dev kit is made primarily to optimize x86-64 software to run on the Arm platform; hence, removing the power limit is beneficial for translating the code to Windows on Arm. The Snapdragon Dev Kit for Windows ships with a 180 W power adapter and comes pre-installed with Windows 11, making it ready for immediate use upon arrival.

The first die shot of AMD's new 4 nm "Strix Point" mobile processor surfaced, thanks to an enthusiast on Chinese social media. "Strix Point" is a significantly larger die than "Phoenix." It measures 12.06 mm x 18.71 mm (L x W), compared to the 9.06 mm x 15.01 mm of "Phoenix." Much of this die size increase comes from the larger CPU, iGPU, and NPU. The process has been improved from TSMC N4 on "Phoenix" and its derivative "Hawk Point," to the newer TSMC N4P node.

Nemez (GPUsAreMagic) annotated the die shot in great detail. The CPU now has 12 cores spread across two CCX, one of which contains four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The two CCXs connect to the rest of the chip over Infinity Fabric. The rather large iGPU takes up the central region of the die. It is based on the RDNA 3.5 graphics architecture, and features 8 workgroup processors (WGPs), or 16 compute units (CU) worth 1,024 stream processors. Other key components include four render backends worth 16 ROPs, and control logic. The GPU has its own 2 MB of L2 cache that cushions transfers to the Infinity Fabric.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

AMD presented a closer look at the Radeon 890M iGPU powering the Ryzen AI 300 series "Strix Point" mobile processor. The iGPU introduces the new RDNA 3.5 graphics architecture, with several architecture-level improvements built around the existing RDNA 3 SIMD, to yield performance/Watt improvements that AMD could trade in to increase the SIMD muscle for its processors, and proportionately increase performance. The iGPU features one Shader Engine with 8 workgroup processors (WGPs), which amount to 16 CU (compute units), for a total of 1,024 stream processors, 32 AI accelerators, and 16 Ray accelerators. The iGPU also has 4 render backends+, for 16 ROPs. It is specced with a maximum engine clock of 2.90 GHz, which yields over 11 TFLOP/s of FP32 throughput, which is around 30% higher than the iGPU of "Phoenix" (12 CU, RDNA 3), at comparable power.

AMD goes into the finer points of how it yielded the performance/Watt gains. The company worked on the texture subsystem to double the texture sampler rate, and introduced point-sampling acceleration. The shader sub-system features interpolation and comparison rate doubling. The raster sub-system introduces sub-batching of batch raster operations, with a programmable bin order, for the hardware to be more efficient. Lastly, AMD worked on the iGPU's memory-management, to be more aware of LPDDR5 (which has a different physical layer or way of writing/fetching than GDDR6). The company worked on improving the memory compression technologies, to improve performance, and reduce the iGPU's memory footprint.

TrendForce's latest report on the memory industry reveals that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

Furthermore, industry revenues are projected to continue growing in 2025, with DRAM expected to increase by 51% and NAND Flash by 29%, reaching record highs. This growth is anticipated to revive capital expenditures and boost demand for upstream raw materials, although it will also increase cost pressure for memory buyers.

CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of the new CTL Chromebook PX141E Series. This series equips educators, staff, and students with the powerful performance and connectivity they need for all-day productivity. Easy ChromeOS device manageability combined with CTL's lifecycle services reduces the burden on IT departments.

"We are excited to refresh our product line with the next-generation 14" Chromebook. As the new powerhouse performer in our Chromebook lineup, we know our education and enterprise customers will appreciate the upgraded power, Wi-Fi, memory, and storage to support all day teaching and learning, while new conveniences such as the webcam privacy shutter and additional USB-A port enhance useability," said Erik Stromquist, CEO of CTL.

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

DFI, the world's leading brand in embedded motherboards and industrial computers, introduces its latest innovation: the ASL9A2 System-on-Module (SoM). With an Intel Atom processor, the ASL9A2 achieves speeds up to 3.6 GHz and is based on Intel's Gracemont architecture. Designed for high-performance, low-power, and ruggedized edge applications, the ASL9A2 is perfect for continuous 24/7 operation, supporting a wide range of Internet of Things (IoT) solutions at the edge.

As reported by The Business Research Company, the SoM market has experienced robust growth, increasing from 2.22 billion in 2023 to 2.43 billion in 2024, with a CAGR of 9.6%. From DFI's business viewpoint, a variety of SoM projects are yielding positive results. Furthermore, DFI enhances its Intel x86 COM Express modules with value-added enhancements to improve customers' applications efficiency, earning praise from customers.

During Computex 2024, Intel announced the next-generation compute platform for the notebook segment in the form of the Core Ultra 200V series, codenamed Lunar Lake. Set for release in September 2024, these processors are generating excitement among tech enthusiasts and industry professionals alike. According to the latest leak by VideoCardz, Intel plans to unveil nine variants of Lunar Lake, including Core Ultra 7 and Core Ultra 5 models, with a single high-end Core Ultra 9 variant. While exact specifications remain under wraps, Intel's focus on artificial intelligence capabilities is clear. The company aims to secure a spot in Microsoft's Copilot+ lineup by integrating its fourth-generation Neural Processing Unit (NPU), boasting up to 48 TOPS of performance. All Lunar Lake variants are expected to feature a hybrid architecture with four Lion Cove performance cores and four Skymont efficiency cores.

This design targets low-power mobile devices, striking a balance between performance and energy efficiency. For graphics, Intel is incorporating its next-generation Arc technology, dubbed Battlemage GPU, which utilizes the Xe2-LPG architecture. The leaked information suggests that Lunar Lake processors will come with either 16 GB or 32 GB of non-upgradable LPDDR5-8533 memory. Graphics configurations are expected to include seven or eight Xe2 GPU cores, depending on the model. At the entry level, the Core Ultra 5 226V is rumored to offer a 17 W base power and 30 W maximum turbo power, with performance cores clocking up to 4.5 GHz. The top-tier Core Ultra 9 288V is expected to push the envelope with a 30 W base power, performance cores boosting to 5.1 GHz, and an NPU capable of 48 TOPS. You can check out the rest of the SKUs in the table below.

KLEVV by Essencore had a formidable lineup of high-end gaming PC memory and SSDs at Computex 2024. We were greeted at the booth with an Essencore-branded LPCAMM2 module with 32 GB density, and LPDDR5-8533 speeds on tap. The Genuine G560 (it's named Genuine) is a modern M.2 NVMe Gen 5 SSD with a fanless heatsink. It comes in capacities of 1 TB, 2 TB, and 4 TB; with sequential speeds ranging between 13 GB/s to 14 GB/s reads, and 9.5 GB/s to 12 GB/s writes; and depending on the capacity, the endurance is between 700 TBW to 3000 TBW. The CRAS C930 is a premium M.2 Gen 4 SSD, with 1 TB and 2 TB models available, sequential read speeds of up to 7.4 GB/s, and sequential write speeds between 6.4 GB/s to 6.8 GB/s. Endurance ranges between 750 TBW for the 1 TB model, and 1500 TBW for the 2 TB.

At the value end of KLEVV's SSD lineup is the CRAS C925, which offers mostly similar performance numbers to the C930, but with slightly different endurance ratings. It ranges between 500 GB and 2 TB; with the same 7.4 GB/s maximum read speeds, but slightly lower maximum write speeds of 6.2 GB/s for the 500 GB model, 6.3 GB/s for the 1 TB, and 6.5 GB/s for the 2 TB model; and endurance rated at 600 TBW, 1200 TBW, and 2400 TBW, respectively.

MSI, a world leader in AI PC and AIoT solutions, is going to participate in COMPUTEX 2024 from 6/4 to 6/7. With cutting-edge skills, MSI's AIoT team has been focusing on product development and hardware-software integration for AI applications in recent years, achieving great results on application development in various fields. MSI will create an exclusive exhibition area for Smart City to introduce AIoT application scenarios which have five topics including AI & Datacenter, Automation, Industrial Solutions, Commercial Solutions, and Automotive Solutions.

The most iconic products this year are diverse GPU platforms for AI markets and a new CXL (Compute Express Link) memory expansion server which was developed by the cooperation of key players in the CXL technology field, including AMD, Samsung, and Micron. Besides, the latest Autonomous Mobile Robot (AMR) powered by NVIDIA Jetson AGX Orin is also one of the major highlights. For new energy vehicles, we will first disclose the complete AC/DC chargers coupled with MSI E-Connect dashboard (EMS) and AI-powered car recognition applications to show the one-stop service of HW/SW integration.

ASUS today announced the ASUS Chromebook CR series of laptops, tailored to meet the needs of K-12 students. The ASUS Chromebook CR Series stands out as the ideal companion for students, whether engaged in in-person classroom learning or remote education. The rugged and modular design, featuring replaceable internal parts, guarantees both durability and longevity. With 11.6-inch or 12.2-inch Corning Gorilla Glass touchscreens and a 180° lay-flat or 360°-flippable hinge, the laptops offer flexibility for enriched educational experiences. This design fosters the adventurous mindset of modern students, ensuring an enjoyable and secure learning journey, whether they're engaging in online courses or in-class sessions—ready for every learning journey.

A trusted study partner
For K-12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CR series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus speed of LPDDR5 on LPCAMM2 modules is expected to peak at 9.2 GT/s based on JEDEC specifications, but LPDDR6 will extend this to 14.4 GT/s or roughly a 50 percent increase. However, today the fastest and only LPCAMM2 modules on the retail market which are using LPDDR5X, comes in at 7.5 GT/s, which suggests that launch speeds of LPDDR6 will end up being quite far from the peak speeds.

There will be some other interesting changes to LPDDR6 CAMM2 modules as there will be a move from 128-bit per module to 192-bit per module and each channel will go from 32-bits to 48-bits. Part of the reason for this is that LPDDR6 is moving to a 24-bit channel width, consisting of two 12-bit sub channels, as mentioned in yesterday's news post. This might seem odd at first, but in reality is fairly simple, LPDDR6 will have native ECC (Error Correction Code) or EDC (Error Detection Code) support, but it's currently not entirely clear how this will be implemented on a system level. JEDEC is also looking at developing a screwless solution for the CAMM2 and LPCAMM2 memory modules, but at the moment there's no clear solution in sight. We might also get to see LPDDR6 via LPCAMM2 modules on the desktop, although the presentation only mentions CAMM2 for the desktop, something we've already seen that MSI is working on.

During the COMPUTEX 2024 exhibition from June 4th to 7th, Mnemonic Electronic Co., Ltd. (hereinafter referred to as Mnemonic), Longsys's Taiwan subsidiary, will showcase a series of high-capacity SSD products under the theme "Embracing the Era of High-capacity SSDs," providing solutions for global users of high-capacity SSD products.

The lineup of high-capacity products presented by Mnemonic includes the ORCA 4836 series enterprise NVMe SSDs and the UNCIA 3836 series enterprise SATA SSDs. These products are equipped with the latest enterprise-grade 128-layer TLC NAND flash memory, offering high performance, low latency, adjustable power consumption, and high reliability storage solutions for enterprise-grade users such as servers, cloud computing, and edge computing, with a maximum capacity of up to 7.68 TB.

TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50-60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.