GeIL to Showcase Extended New and Enhanced Memory Products at COMPUTEX 2024
GeIL will feature at Computex 2024 the EVO V series and TUF GAMING ALLIANCE MEMORY with an Active Dual Fan Cooling System, ensuring optimal stability and performance. GeIL enhances memory stability and reliability with CKD (Client Clock Driver) chips in CUDIMM and CSODIMM products. The CAMM2 and LPCAMM2 modules offer faster speeds and larger capacities for next-gen compact devices, ideal for AI PCs and server applications requiring high capacity and quick access.
GeIL TUF GAMING ALLIANCE MEMORY
In addition to the well-known EVO V series, GeIL TUF GAMING ALLIANCE MEMORY includes the Active Dual Fan Cooling System design, which greatly helps heat dissipation. The enhanced cooling efficiency ensures optimal stability and performance under the most demanding conditions. To provide users with a variety of product options, GeIL TUF GAMING ALLIANCE MEMORY also offers an RGB SKU without fans. Both models will be demonstrated at GeIL's booth at Computex 2024.
GeIL TUF GAMING ALLIANCE MEMORY
In addition to the well-known EVO V series, GeIL TUF GAMING ALLIANCE MEMORY includes the Active Dual Fan Cooling System design, which greatly helps heat dissipation. The enhanced cooling efficiency ensures optimal stability and performance under the most demanding conditions. To provide users with a variety of product options, GeIL TUF GAMING ALLIANCE MEMORY also offers an RGB SKU without fans. Both models will be demonstrated at GeIL's booth at Computex 2024.