Although AMD didn't provide too many details during its Computex 2022 keynote speech about the upcoming AM5 platform, the company did announce that there will be at least three chipsets for the platform and showed pictures of some upcoming motherboards. ASUS has kindly filled in some more details about its upcoming ROG Crosshair X670E Extreme, which will be one of its higher-end models. Sadly the pictures posted are kind of tiny and the company didn't provide a shot of the rear I/O. That said, ASUS did point out some of its new features that we can expect to find on the ROG Crosshair X670E Extreme.

For starters, the board will have a pair of PCIe 5.0 x16 slots, although each slot is likely to only have eight lanes each, when both slots are in use, but ASUS doesn't mention any details here. The board has support for up to five M.2 NVMe SSDs, four of which support PCIe 5.0. Only two are onboard, with the other three being via ASUS' proprietary ROG PCIe 5.0 M.2 card and ROG GEN-Z.2 card. ASUS also promises USB4 support, as well as a USB 3.2 Gen 2x2 header with Quick Charge 4+ as well as up to 60 W charging support, for cases with a front USB-C port. On top of the rear I/O is an AniMe Matrix LED display that can be user customised.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to present the latest gaming products at COMPUTEX 2022. The innovations include its flagship gaming solutions powered by Intel 12th gen processors. The perfect combination of the IF Design Awarded Z690 AORUS XTREME motherboard, high-end key components, and big size monitors provide remarkable gaming experience. The Project Stealth kit enables an easy and simple assembly experience with special interface and cables hidden design while further enhances the system airflow for optimized cooling effect. Meanwhile, the new gaming PC, Model S delivers powerful, cool, and silent operation even on 3A games with its slick and neat aesthetics.

Moreover, the latest AMD Socket AM5 motherboards including gaming series of X670 AORUS XTREME, MASTER, PRO AX and X670 AERO D for designers will be first exposed in this exhibition as well. Users can take a sneak peek at the advanced design and extensive features of PCIe 5.0 graphics slot, M.2 Gen5 interface, exclusive PCIe/M.2 EZ-latch on GIGABYTE motherboards.

Phison Electronics Corp., a leading provider of NAND controller and flash storage solutions, announced today a strategic collaboration with AMD and Micron to build a cooperative PCIe Gen5 ecosystem of compatible products that elevate the gaming and creator experience. Phison's role includes delivering a class-leading PCie Gen5 SSD controller - PS5026-E26 - that features nearly a 2x performance increase over the previous generation flagship while adhering to the same power limitations of the M.2 form factor.

"We are pleased to announce our cooperative effort with Micron and AMD to advance the technological development of PCIe Gen5 storage offerings, as this validates Phison's commitment to upholding customer-centric values," said Leo Huang, Sr. Director, Product Marketing, Phison. "The E26 controller enables gamers to compete at the highest level and helps content creators to maximize the overall system performance to increase productivity." The need for high-speed storage has increased with the popularity of 5G Wireless availability worldwide. Global markets including desktop PC, notebooks, gaming consoles, cloud servers and even mobile devices will benefit from increased data transfer rates and the bandwidth available for multitask purposes. The ecosystem consisting of AMD's AM5 platform, Phison's PS5026-E26 controller, Micron's DDR5 DRAM and Replacement Gate 3D NAND allow for platform acceleration across the entire system to meet the requirements for today's always-connected lifestyle.

We're expecting to see a wide range of AM5 motherboards next week during Computex, but we're already being treated to some early leaks ahead of the show. The most recent leak was picked up by @9550pro on Twitter, but was originally posted on Baidu. What we're looking at here though, isn't actually a picture of a motherboard, but rather the placement map for the SMD components used during motherboard assembly. These pictures are often used to make sure things like the solder mask and components were applied properly during production. However, it does give us a good look at the overall layout of the ASUS X670 Prime-P WiFi and the fact that the X670 chipset does indeed consist of two parts. What is also clear is that we're looking at a PCIe 5.0 x16 slot here, as these slots are SMD components rather than through hole.

Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots. Finally the board should have two SATA ports mounted at a 90-degree angle, as well as four ports at the bottom edge of the PCB. ASUS seems to have gone for a solar system pattern on the PCB itself, so it'll be interesting to see what the actual boards will look like.

It appears that ASRock got a little bit too excited and posted a Computex video earlier today that contained a brief glimpse of its upcoming X670E Taichi motherboard. The screenshot that was captured by Wccftech doesn't give away too much details, but the board appears to have at least three M.2 slots and a pair of PCIe x16 slots, of which at least one is meant to be of the PCIe 5.0 variety. The rest of the board is covered in heatsinks and various shrouds. The board will feature Realtek's ALC4082 USB attached audio codec, as well as a ESS ES9218 DAC. It is also said to sport a 26-phase VRM setup. The board is also expected to have Thunderbolt 4 support. The video has unfortunately been taken down, so we'll have to wait until next week to find out more details.

In related news, @momomo_us has leaked details of several upcoming AM5 motherboards, of which four models are from ASRock and two from ASUS. The ASRock models are the X670E Taichi mentioned above, the X670 PG Riptide, X670 Phantom Gaming 4 and the X670 Steel Legend. The two ASUS models are the ProArt X670E-Creator WiFi and the ProArt B650-Creator. Finally Gigabyte has revealed that the company will be displaying its X670 Aorus Xtreme, X670 Master, X670 Pro AX and X670 AERO D at Computex next week. The company mentions PCIe 5.0 for both graphics and the M.2 interface, which pretty much cements the earlier rumors about AMD offering PCIe 5.0 support for the M.2 interface on the AM5 platform.

A physical show of COMPUTEX 2022 will be held at the Taipei Nangang Exhibition Hall from May 24 to 27, 2022. In addition, TAITRA will simultaneously hold an online exhibition called COMPUTEX DigitalGo (May 24 to June 6). This year, exhibitors and visitors are invited to participate in COMPUTEX both online and offline. The online registration is now open to buyers worldwide. COMPUTEX is one of the world-leading ICT exhibitions. This year, the show focuses on six trendy themes: Accelerating Intelligence, Connected X-Experience, Digital Resilience, Innovative Computing, Innovations & Startups, and Sustainability. In addition, a number of top ICT leaders, including Acer, AMD, Apacer, Arm, ASUS, ATEN, Delta, GIGABYTE, IBM, Infineon, KIOXIA, Microsoft Corp., MSI, NVIDIA, NXP, Qualcomm, Quanta Cloud Technology (QCT), Supermicro, Texas Instruments, ZOTAC and more, will participate in hybrid events.

COMPUTEX will hold many events during the show this year. Some highlights include five COMPUTEX CEO Keynotes by the global tech giants. They will deliver hot topics and the latest trends that attendees could walk away with informative and insightful views. The COMPUTEX Forum will revolve around the theme "Create the New Normal", consisting of two technological innovation and application sessions. The first session will focus on technology innovation, with the topic of "Technology Empowerment, Building Industry Chains", dissecting computing, 5G, IoT to drive the opportunities in AI. The second session will cover technology application with the topic of "Application Advancements - Realizing Future Scenarios", which focuses on virtual reality, smart life, remote work, and ESG management by using digital technology.

COMPUTEX 2022 is set to kick off from May 24 to 27 in the Taipei Nangang Exhibition Center Hall 1 & 2, featuring Innovative Computing, Accelerating Intelligence, Digital Resilience, Connected X-Experience, Innovations and Startups, and Sustainability. This annual tech event will continue to lead in the discovery of the latest technology trends. Due to the pandemic, the annual physical show was cancelled for two years, but COMPUTEX 2022 is back, and it is open for international exhibitor registration starting from October 6. In addition, the global warm-up tour, #COMPUTEXisEverywhere, will begin on November 18.

As a co-organizer of COMPUTEX, TAITRA indicated that technology has demonstrated its importance in enabling business resilience in the past year, as society experienced challenges and witnessed accelerated digital transformation in various industries. As a leading ICT trade show, COMPUTEX has embraced digital transformation and will return anew to bring better exhibition experience to attendees.

Senior Technology Fellow Yuzo Fukuzaki shed light on the elusive new CPU technology AMD unveiled at its Computex 2021 keynote, 3D Vertical Cache (3DV Cache). The company had then detailed it as an additional 64 MB last-level cache stacked on top of a CCD (CPU core complex die), which significantly improves performance, including a claimed 15% average gain in gaming performance, which accounts for a generational performance gain over "Zen 3." The prototype AMD unveiled in its keynote was based on a Socket AM4 processor with "Zen 3" CCDs that have the 3DV Cache components in place. With two such CCDs, a 16-core processor would end up with 192 MB of L3 cache.

Yuzo Fukuzaki's theory sheds light on the most plausible position of 3DV Cache in the processor's cache hierarchy. Apparently, it expands the CCD's L3 cache, and doesn't serve as an "L4" victim cache to the L3. This way, the cache setup remains transparent to the OS, which sees it as a contiguous 96 MB block of L3 cache (per CCD). The 3DV Cache die is an SRAM chip fabricated on the same 7 nm process as the "Zen 3" CCD. It measures 6 mm x 6 mm (36 mm²), and is located above the region of the CCD that typically has the 32 MB L3 SRAM. Fukuzaki estimates that roughly 23,000 TSVs (through-silicon vias), each about 17 µm in size, connect the 3DV Cache die to the main CCD.

EK Water Blocks, or simply EK as the company refers to itself now, had a decent showing at the virtual Computex 2021 event including new AIO CPU coolers, additions to its Fluid Gaming and Fluid Works portfolio, and more water blocks based on current designs and supporting newer hardware, including one we reported on just a few hours ago. These all interested me, but then there was a nearly two hour private conversation followed by a live stream that ended minutes ago which shed more light on future updates and products in its mainstream Quantum DIY liquid cooling lineup.There were renders of the upcoming Velocity² CPU blocks shared before, but seeing them actually manufactured is a whole other thing. Velocity² is the update to EK's popular Velocity CPU blocks, with a complete redesign that evokes more comparisons to monoblocks than other CPU blocks. Taking cues from the flagship EK-Quantum Magnitude, you will see different cooling engines to better cool different CPU sockets. There is also a concealed aesthetic theme here, especially for the acetal top version where you can't see any screws in use, thanks to a patent-pending mounting mechanism from the back- again taking cues from monoblocks. EK says the new system uses "pre-tensioned springs concealed in the water block top, so with just a few turns on the thumb-nuts, the installation is finished". We look forward to checking these out in person when they release in the Sept 2021 timeframe. Read past the break for more from EK!

Micron, the US-based manufacturer of various kinds of memory technologies, has today announced some quite interesting products at its Computex 2021 keynote. For starters, the company has announced a new portfolio of products based on 176-layer NAND. There are currently two products listed that use this new technology and those are the Micron 3400 and 2450 M.2 NVMe SSDs. Based on the PCIe 4.0 interface, the 2450 SSD lineup is designed as a value-oriented solution that comes in M.2-2280, M.2-2242, and M.2-2230 sizes. It ranges from 256 GB to 1 TB in capacities, which are supposed to be priced as a value purchase.

In a contrast, the 3400 SSD is M.2-2280 design, meant for only the highest performance. The sequential read speeds go up to 6600 MB/s, while the sequential writes go up to 5000 MB/s (in the case of the 2 TB model). Capacities range from 512 GB to 2 TB and only the 1 TB and 2 TB variants have the 5000 MB/s write speeds, while the 512 GB version is capped at 3600 MB/s speed. Both SSD models are featuring a heat spreader on top of NAND chips and spot an in-house and Micron-developed NVMe 1.4 SSD controller. However, Micron does note that the company is free to use any 3rd party SSD controller as we are deep in component shortages with high demand for SSDs. You can get an in-depth look at the 2450 and 3400 M.2 SSDs from Micron's website.

Intel CEO Pat Gelsinger, speaking at the company's 2021 Computex Opening Keynote address stated that the explosive demand for chips caused by recent inflections of technology, accelerated by the COVID-19 pandemic, has resulted in demand outstripping supply by such extent, that it could "still take a couple of years for the ecosystem to address the shortages."

Gelsinger detailed how the world of information technology is at its biggest crossroads ever, with the emergence of Cloud, 5G, AI, and smarter edge computing changing the way people work, learn, and interact. This has caused a huge growth in the demand for semiconductors straining technology supply chains around the world. Gelsinger stated that his company is working with partners across the technology ecosystem to increase output to meet demand. He detailed how Intel has nearly doubled its own chip wafer manufacturing capacity over the past four years. "But while the industry has taken steps to address near-term constraints, it could still take a couple of years for the ecosystem to address chip shortages of foundry capacity, substrate, and components.

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.

Join Intel Executive Vice President Michelle Johnston Holthaus for Intel's first virtual COMPUTEX keynote and a firsthand look at how the strategies of new CEO Pat Gelsinger, along with the forces of a rapidly accelerating digital transformation, are unleashing a new era of innovation at Intel — right when the world needs it most.

Johnston Holthaus will welcome Intel's Steve Long, corporate vice president of Client Computing Group Sales, and Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group, to outline how Intel innovations help expand human potential by expanding technology's potential. This includes collaborating with partners to drive innovation across the technology ecosystem — from the data center and cloud to connectivity, artificial intelligence, and the intelligent edge.

As one of the most important tech summits globally, COMPUTEX Forum and its discussion topics have always garnered great attention. To facilitate the discussion on future technology trends, the COMPUTEX Forum on June 2 and 3 will evolve around the theme of "The New Era of Intelligence." TAITRA announced the lineup of speakers to discuss key applications of 5G, AI, IoT, and electric vehicles, deep diving into business strategies in the post-pandemic era.

In the morning of Wednesday, June 2, COMPUTEX Forum will address the topic of "AIoT Evolution." Leading semiconductor giants such as Intel, Micron, NVIDIA and Supermicro, will explore how they accelerate business opportunities in the 5G era. In the afternoon, NXP Semiconductors will kick off the "AI Empowerment" session by sharing its vision and lead the Secure Edge and AI Empowerment discussions in fields. As AI rises in various applications, Arm, Delta Electronics, Micron and Check Point Software will elaborate their latest solution in different scopes.

TAITRA (Taiwan External Trade and Development Council) announced today that Dr. Lisa Su, President and CEO of AMD, is invited back to deliver a keynote address at COMPUTEX 2021. This digital keynote will be on Tuesday, June 1, at 10:00 AM Taipei time, with the keynote theme "AMD Accelerating - The High-Performance Computing Ecosystem." COMPUTEX displays will be digital this year, with keynotes and forums running on hybrid. "It has been a year unlike others. Technology has gotten us through some of the most challenging times," said James Huang, TAITRA Chairman. "We will continue to transform our exhibition models and practices to meet the evolving needs of our exhibitors, visitors, and media, without losing the most essential element of a trade show - connection."

Dr. Lisa Su is proud to join COMPUTEX once again in 2021. "The past year has shown us the important role high-performance computing plays in our daily lives - from the way we work to the way we learn and play. At this year's COMPUTEX, AMD will share how we accelerate innovation with our ecosystem partners to deliver a leadership product portfolio," said Dr. Lisa Su. At the COMPUTEX | AMD CEO Keynote, Dr. Lisa Su will share the AMD vision for the future of computing, including details of the growing adoption of the AMD high-performance computing and graphics solutions, built for PC enthusiasts and gamers.

TAITRA, the COMPUTEX organizer, has announced that the physical COMPUTEX event has been cancelled (surprising maybe some three or four people in the world). The organizer cites ongoing COVID-19 concerns (including the world's current state of vaccination levels) that would put the safety of attendees on the line, and has thus elected to forego the physical event and focus only on an online capacity.

However, even as the physical event has been cancelled, TAITRA doubled down on the virtual COMPUTEX event. Marketed #COMPUTEXVirtual, the event is scheduled to run for a full month, from May 31st to June 30th, in what marks COMPUTEX's first attempt at doing a large-scale virtual event. TAITRA had this to say on their decision: "With another wave of coronavirus pandemic across the world, it doesn't look like we are close to the end. The majority of the show's stakeholders, including international exhibitors, visitors, and media, cannot join the show due to border control. Therefore, the organizers of COMPUTEX have decided to cancel the onsite exhibition this year."

Intel announced their 11th Generation Tiger Lake-H processors for high-end gaming laptops at CES 2021. The three models announced are now shipping in slim gaming machines and target the AMD Ryzen 5000H series processors. The Intel models compete favorably in single-core performance but only feature four cores and eight threads while the Ryzen 5000H series processors include up to 8 cores and 16 threads giving them the clear advantage in multi-core performance.

Intel is planning to close this performance gap with the launch of three new 45 W 8 core 11th Generation H-series processors in Q2 2021 with a possible announcement at Computex. The three models include the unlocked Core i9-11980HK, Core i9-11900H, and the Core i7-11800H along with the Core i5-11400H with six cores. These new processors will compete directly with the Ryzen 9 5980HX, Ryzen 9 5900H, and Ryzen 7 5800H with the Core i9-11980HK likely to feature a boost clock of 5 GHz on multiple cores.

COMPUTEX 2021 International Online Press Conference kicks off today, revealing the leading ICT tradeshow to return as a physical exhibition from June 1 to 4, 2021 (InnoVEX from June 2 to 4). More importantly, COMPUTEX 2021 will utilize artificial intelligence (AI) for the first time to create a smart Online-Merge-Offline (OMO) exhibition platform, connecting the tech community through an innovative model that breaks barriers and limitations.

COMPUTEX 2021 will be held from June 1 to 4 at the Taipei Nangang Exhibition Center, Hall 1 & 2 (TaiNEX 1 & 2) and at Taipei International Convention Center (TICC). InnoVEX will also be exhibited from June 2 to 4 on the 4th floor of the Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2). More exhibition information will be announced on the official websites of COMPUTEX and InnoVEX.

According to the report from DigiTimes, which cites industry sources, the global supply chain of Intel, AMD, and NVIDIA has been rather confused recently by their launch dates and launch procedures. Due to worldwide pandemic, there are no electronics shows like Computex that are designed for companies to showcase their products there, and thus, there is no unified launch window where you can expect a product to be launched. What's even worse is the fact that the companies have now started to keep their launch dates as a secret in the latest edition of playing with the competition. Launch dates have started to change and now the launch is uncertain even if the launch day is provided.

This has a massive effect on the industry supply chain. By not giving concrete dates to them, companies have left them to wonder when the product will launch. This is hurting their ability to prepare themselves for an upcoming product and possibly cause some delays later on. If not given enough time, the supply chain could not adapt fast enough and the product could come later in the hands of consumers.

TAITRA, organizers of Computex, the year's biggest PC industry-related tech expo that highlights Taiwan's vibrant computer hardware and consumer electronics industries, announced that they have formally cancelled the 2020 edition of Computex. Originally slated for June as almost every edition prior, Computex 2020 was hit hard by the COVID-19 global pandemic that caused exhibitors to pull out. TAITRA scrambled to postpone the 2020 edition to September, a move that apparently didn't do enough to bring back exhibitors. With the COVID-19 crisis showing no signs of waning by September, TAITRA did the only thing it could: can the 2020 edition. The company did put up a brave face and hoped that the 2021 edition will go ahead as planned, scheduled for June 1-5, 2021. One of our industry partners shared with us a copy of the email TAITRA sent to its exhibitors.The TAITRA press-release follows.

EK Waterblocks has unveiled a new air cooler design at their Computex 2020 replacement, EK Cooling Expo. The company released one image of a prototype cooler which appears to include 4 heat pipes and an EK branded fan. EK representatives confirmed to Overclock 3D that the EK heatsink has not been finalized and is still undergoing product design. EK didn't say if they are planning other models or announce pricing/availability of the heatsink. Will EK become a serious competitor in the air cooling market against established players such as Noctua?

Update 09:34 UTC: EK has confirmed that they will be introducing both single and dual-tower models in the EK-AIR series of products, which will feature modern D-RGB lighting, premium build quality, modern aesthetics, and great cooling.

Noctua is reportedly working on a high-performance fanless CPU cooler building on a 2019 prototype that was exhibited at last year's Computex. The final product should launch within 2020, according to an Overclock3D report. As of now there's no word on whether the said cooler will look identical to last year's prototype, but it provides a long list of capabilities that Noctua could build on. For starters, last year's prototype was capable of handling 120 W TDP in PC cases with good natural ventilation, and up to 180 W in cases with quiet fans. The company used a Core i9-9900K in a variety of workloads as a proof of the heatsink's capabilities. The prototype heatsink was also shown offering decent amount of clearance with the motherboard's memory- and VRM areas. Its only downside was the 1.5 kg weight.

Woes for Computex 2020 refuse to end, as its biggest lure for PC enthusiasts - motherboard and graphics card vendors - are reportedly planning to withdraw from this year's edition. Organizers of the popular PC ecosystem trade-show had announced a postponement of the show to late-September from its early-June original scheduled, in the wake of the COVID-19 global pandemic.

Among the big companies confirmed by DigiTimes to have withdrawn from Computex 2020 are Gigabyte, MSI, TUL (parent of PowerColor), Chaintech (major OEM of several DIY brands); and ECS. ASUS said it's still following existing plans for the event. Some brands are planning online events around the same time as Computex, in which they will announce new products.

Computex is always one of the many highlights of our tech/gaming event lineup, however due to the current COVID-19 pandemic, the health of our employees and tech community is our primary concern. With the evolving health concerns surrounding COVID-19, Patriot and Viper Gaming by Patriot will not be attending Computex this year. In the meantime we'll be working cautiously and are advising all employees to refrain from traveling during this time of stay-in-place solidarity.

We'd like to thank Computex, for all they've done the past successful years in hosting a great show to help build the tech industry, and appreciate all their efforts in sharing safety guidelines and additional health measures as the event draws closer. With great optimism, we will definitely be returning to Computex next year once the pandemic is confirmed to be cleared and safe to return to normal activities.

AMD's 4th generation Ryzen desktop processors are expected to launch around September 2020, sources in the motherboard industry tell DigiTimes. Codenamed "Vermeer," successor to "Matisse," these processors will be socket AM4 multi-chip modules of up to two CPU complex dies based on the "Zen 3" microarchitecture, combined with an I/O controller die. The "Zen 3" chiplets are expected to be fabricated on a newer 7 nm-class process by TSMC, either N7P or N7+. The biggest design change with "Zen 3" is the doing away of CCX arrangement of CPU cores, with each chiplet holding a common block of cores sharing a last-level cache. This, along with clock speed headroom gains from the new node are expected to yield generational price-performance increases.

The "Zen 2" based 8-core "Renoir" die is also expected to make its socket AM4 debut within 2020, succeeding the "Picasso" based quad-core Ryzen 3000-series APUs. This is a particularly important product for AMD, as it is expected to compete with Intel's 10th generation Core i5 6-core/12-thread processors in terms of pricing, while offering more cores (8-core/16-thread) and a faster iGPU. The 4th gen Ryzen socket AM4 processor lineup will launch alongside AMD's 600-series motherboard chipset, with forwards- and backwards-compatibility (i.e., "Vermeer" and "Renoir" working with older chipsets, and older AM4 processors working on 600-series chipset motherboards). AMD was originally expected to unveil these processors at the 2020 Computex trade-show in June, but Computex itself is rescheduled to late-September.