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Intel Releases Arc GPU Graphics Drivers 101.5590 WHQL

Intel on Friday (14/06) released the latest version of the Arc GPU Graphics Drivers. Version 101.5590 WHQL adds Game On (day-zero) optimization for Destiny 2: The Final Shape, and Elden Ring: Shadow of the Erdtree. For the Arc A-series discrete GPUs, the drivers also enhance performance of a couple of older Direct3D 11 and Direct3D 10 titles. For Chivalry 2, you can expect up to 13% improved performance at 1080p with epic settings; while for the original Crysis (2007), performance can be up by 10% with very high settings. The drivers provide similar performance uplifts for the Arc Series integrated graphics in Core Ultra "Meteor Lake" processors, with up to 16% uplifts for Chivalry 2, and up to 6% for Crysis 2 (2011). An intermittent application crash with No Rest for the Wicked has been fixed.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5590 WHQL

Intel Isolates Root Cause of Raptor Lake Stability Issues to a Faulty eTVB Microcode Algorithm

Intel has identified the root cause for stability issues being observed with certain high-end 13th- and 14th Gen Core "Raptor Lake" processor models, which were causing games and other compute-intensive applications to randomly crash. When the issues were first identified, Intel recommended a workaround that would reduce core-voltages and restrict the boost headroom of these processors, which would end up with reduced performance. The company has apparently discovered the root cause of the problem, as Igor's Lab learned from confidential documents.

The documents say that Intel isolated the problem to a faulty value in the microcode's end of the eTVB (enhanced thermal velocity boost) algorithm. "Root cause is an incorrect value in a microcode algorithm associated with the eTVB feature. Implication Increased frequency and corresponding voltage at high temperature may reduce processor reliability. Observed Found internally," the document says, mentioning "Raptor Lake-S" (13th Gen) and "Raptor Lake Refresh-S" (14th Gen) as the affected products.

MSI Announces New MAG Infinite E1 Gaming Destkop

MSI, the leading brand in gaming products, is proud to announce the launch of the MAG Infinite E1. Equipped with processors up to 14th Gen Intel processor and NVIDIA GeForce RTX 40 Series graphics card, the MAG Infinite E1 is designed to be the ultimate gaming companion, delivering unmatched functionality. Built with the iconic MAG spirit of durability and robust construction, the MAG Infinite E1 showcases a design that conveys a stable and endurance, appealing to gamers seeking both power and reliability.

The MAG Infinite E1 is powered by up to an Intel Core i7 processor, offering significant performance enhancements over its predecessor. When combined with the NVIDIA RTX 40 Series graphics card, the MAG Infinite E1 not only leaps in performance but also in AI-enhanced graphics capabilities. Gamers can immerse themselves in lifelike virtual environments with advanced ray tracing and enjoy ultra-high frame rates with minimal latency. Furthermore, the MAG Infinite E1 is equipped with state-of-the-art transmission capabilities including DDR5 memory and M.2 PCI-e SSD slots, ensuring peak performance and making it the ideal choice for gamers who demand the very best.

ASML Unveils Plans for Next-Generation "Hyper-NA" Extreme Ultraviolet Lithography

ASML, the world's sole provider of extreme ultraviolet (EUV) lithography systems essential for manufacturing the most advanced chips, has revealed its roadmap for pushing semiconductor scaling even further. In a recent presentation, former ASML president Martin van den Brink announced the company's plans for a new "Hyper-NA" EUV technology that would succeed the High-NA EUV systems, which are just beginning to deploy. The Hyper-NA tools, still in early research stages, would increase the numerical aperture to 0.75 from High-NA's 0.55, enabling chips with transistor densities beyond the projected limits of High-NA in the early 2030s. This higher numerical aperture should reduce reliance on multi-patterning techniques that add complexity and cost.

Hyper-NA is bringing challenges of its own to commercialization. Key obstacles include light polarization effects that degrade imaging contrast, requiring polarization filters that reduce light throughput. Resist materials may also need to become thinner to maintain resolution. While leading EUV chipmakers like TSMC can likely extend scaling for several more nodes using multi-patterning with existing 0.33 NA EUV tools, Intel has adopted 0.55 High-NA to avoid these complexities. But Hyper-NA will likely become essential across the industry later this decade as High-NA's physical limits are reached. Beyond Hyper-NA, few alternative patterning solutions exist besides expensive multi-beam electron lithography, which lacks the throughput of EUV photolithography. To continue classical scaling, the industry may need to eventually transition to new channel materials with superior electron mobility properties compared to silicon, requiring novel deposition and etch capabilities.

Intel Submits Gaudi 2 Results on MLCommons' Newest Benchmark

Today, MLCommons published results of its industry AI performance benchmark, MLPerf Training v4.0. Intel's results demonstrate the choice that Intel Gaudi 2 AI accelerators give enterprises and customers. Community-based software simplifies generative AI (GenAI) development and industry-standard Ethernet networking enables flexible scaling of AI systems. For the first time on the MLPerf benchmark, Intel submitted results on a large Gaudi 2 system (1,024 Gaudi 2 accelerators) trained in Intel Tiber Developer Cloud to demonstrate Gaudi 2 performance and scalability and Intel's cloud capacity for training MLPerf's GPT-3 175B1 parameter benchmark model.

"The industry has a clear need: address the gaps in today's generative AI enterprise offerings with high-performance, high-efficiency compute options. The latest MLPerf results published by MLCommons illustrate the unique value Intel Gaudi brings to market as enterprises and customers seek more cost-efficient, scalable systems with standard networking and open software, making GenAI more accessible to more customers," said Zane Ball, Intel corporate vice president and general manager, DCAI Product Management.

AMD Says Ryzen 9000 Series Won't Beat 7000X3D Series at Gaming

AMD's upcoming Ryzen 9000 "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture won't beat the Ryzen 7000X3D series at gaming workloads, said Donny Woligroski, the company's senior technical marketing manager, in an interview with Tom's Hardware. The new "Zen 5" chips, such as the Ryzen 7 9700X and Ryzen 9 9950X, will come close to the gaming performance of the 7800X3D and 7950X3D, but won't quite beat it. The new processors, however, will offer significant generational performance uplifts in productivity workloads, particularly multithreaded workloads that use vector extensions such as VNNI and AVX512. The Ryzen 7 7800X3D remains the fastest gaming desktop processor you can buy, it edges out even Intel's Core i9-14900KS, in our testing.

Given this, we expect the gaming performance of processors like the Ryzen 7 9700X and Ryzen 9 9950X to end up closer to those of the Intel Core i9-13900K or i9-14900K. Gamers with a 7000X3D series chip or even a 14th Gen Core i7 or Core i9 chip don't have much to look forward to. AMD confirmed that it's already working on a Ryzen 9000X3D series—that's "Zen 5" with 3D V-cache technology, and is sounds confident of holding on to the title of having the fastest gaming processors. This doesn't seem implausible.

EK Unveils the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:
  • Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
  • Temperature sensors
  • Liquid flow meter
  • Direct integration with the ROG water-cooling zone
  • ILM Replacement Kit

Intel's New SoC Solution Accelerates Electric Vehicle Innovation, Slashing Costs

The high purchase price of an electric vehicle (EV) remains one of the biggest barriers for potential buyers on a global scale. EVs are currently more expensive to build than traditional gasoline-powered cars, primarily because of the high costs associated with advanced battery and e-motor technology. The near-term solution is to enhance the efficiency of the existing battery technology through energy savings at the vehicle level, including improved integration with EV station infrastructure. This is exactly the challenge that Silicon Mobility, an Intel Company, has now solved with today's launch of the new OLEA U310 system-on-chip (SoC). This next-gen technology promises to significantly improve the overall performance of electric vehicles (EVs), streamline design and production processes, and expand SoC services to ensure seamless operation across various EV station platforms.

Representing a first for the industry, the new SoC is the only complete solution that combines hardware and software in one and is engineered to match the need for powertrain domain control in electrical architectures with distributed software. Built with a unique hybrid and heterogeneous architecture, a single OLEA 310 FPCU can replace as many as six standard microcontrollers in a system combination in which it controls an inverter, a motor, a gearbox, a DC-DC converter and an on-board-charger. Using the 310 FPCU, original equipment manufacturers (OEMs) and Tier 1 suppliers can control multiple and diverse power and energy functions simultaneously in real time.

EK Introduces New Direct Die Water Block for Socket LGA 1700 14th Gen Intel Core CPUs

EK, the leading computer cooling solutions provider, is rolling out a brand-new water block built from the ground up for the LGA 1700 socket, explicitly designed for delidded Intel Core CPUs. It bears improvements that benefit 14th-generation CPUs and shares almost no parts with the previously released Intel Direct Die water block. It includes a purpose-developed cold plate, cooling fin structure, and mounting mechanism. It relies on standoffs positioned at the four corners of the water block to ensure optimal contact with the CPU, eliminating concerns about applying too much or too little pressure on the bare CPU die, just like the AM5 Direct Die water block. EK's latest water block features EK-Matrix7 compatibility, meaning the product's height and port distance are managed in 7 mm increments for easier loop planning and precise results.

EK-Quantum Velocity² Direct Die D-RGB - 1700 Core Edition
This new direct die LGA 1700 water block is built from scratch and made to squeeze every bit of performance out of the 14th-generation Intel Core CPUs. The top is seethrough glass-like acrylic, with rich D-RGB illumination behind the window, which is riddled with aluminium bars going over the top and two G1/4" extenders that interrupt the flow of the black-anodized aluminium bars. These G1/4" extenders are standard Torque micro extenders. They can be replaced by other products from the EK-Quantum Torque Micro series, be it extenders of different finish, HDP or HDC fittings.

Minisforum Brings Power-Packed Mini-PCs to Computex 2024

Minisforum consistently impressed us with its bold small footprint computing solutions over the years, and they've taken things a level up this Computex. Imagine a docking station on which you installed a graphics card like you'd slot in an NES cartridge. That's the Minisforum DEG1 OCulink graphics docking station. The dock resembles an 8-bit era Atari. You install a graphics card vertically on its PCI-Express 4.0 x16 slot (electrical Gen 4 x4), and connect 12 V power from the dock to the card (12V-2x6 and 3x 8-pin supported). The dock connects to the host machine over Oculink (Gen 4 x4).

The R3GAF is a pre-built external GPU based on the AMD Radeon RX 7600M XT. It connects to the host over Oculink, and uses an internap power supply to drive the card, with a configured power limit of 120 W. Besides the GPU's connectivity, the dock puts out a trio pf 5 Gbps USB 3.2 Gen 1 ports. Next up, is a Thunderbolt 4 (40 Gbps) dock that puts out two downstream Thunderbolt ports, a handful USB-C ports, an internal M.2 slot, card reader, and DisplayPort output demuxed from the Thunderbolt uplink.

Maxsun Puts the PCIe x16 Slot on the Back of its Latest B760 Mini-ITX Motherboard

We've seen a lot of motherboards with the power, SATA and USB connectors on the rear at Computex this year, but Chinese Maxsun decided to put the PCIe x16 slot on the back of its Mini-ITX MS-Terminator B760BKB D5 motherboard. This might seem like a crazy move, but with the right chassis, this means that the graphics card won't need a PCIe extension cable, while fitting in a compact chassis. It's also become increasingly hard to retain signal integrity over ribbon cables and with PCIe 5.0, it might be impossible. Another added benefit of this design is that the board also has a PCIe 3.0 x4 slot available for something like a 10 Gbps network card or just about anything else you'd want to plug into a compact PC.

The overall board specs don't really stick out from the crowd, as the Intel B760 chips is a somewhat limiting factor as well. In addition to the PCIe 5.0 x16 slot and the PCIe 3.0 x4 slot, the board also has a pair of PCIe 4.0 M.2 NVMe slots—one on each side of the PCB—and a slim SAS connector using an SFF-8654 connector. In addition to this, the board also has two DDR5 DIMM slots, four SATA ports, a 2.5 Gbps Ethernet port, a DP 1.2, an HDMI 2.0 port, a USB Type-C port of unknown speed and WiFi 6 and Bluetooth 5.2. The power design consists of a fairly basic 8+1+1 phase setup. We'd like to see this board design to become a standard, as it makes a lot of sense for the SFF market to allow for a better placement of the PCI x16 slot to allow for a more compact chassis without having to compromise on the choice of graphics card.

ENERMAX Brings New AIO CPU Coolers and Fans to Computex 2024

In addition to the new PC cases and PSUs, ENERMAX also unveiled a couple of new and interesting AIO CPU coolers and fans at the Computex 2024 show, including the LIQTECH XTR AiO which can handle quite a high thermal load, the new AQUACore concept, which is actually a compact CPU cooler that integrates the pump and the radiator into a compact solution, and new Montage Flow fans with magnetic daisy-chaining.

The one that piqued our interest is definitely the LIQTECH XTR AIO liquid CPU cooler series, which can handle some impressive thermal loads. To be available in 240 mm, 280 mm, and 360 mm radiator sizes, the LIQTECH XTR can easily AMD Threadripper and Intel Xeon processors, offering 100 percent coverage and uses a powerful EF1 pump in combination with patented shunt-channel technology. According to Enermax and what we saw at the show, the smaller 240 mm can handle well over 500 W of thermal load, while the 360 mm one goes well over 900 W. The LIQTECH XTR also includes a digital built-in display on the pump/block unit, which shows CPU and GPU temperature, or fan RPM data.

Colorful Intros iGame Ultra/Vulkan PC Series of White/Black Components

At Computex 2024, Colorful has introduced a new PC series of premium componentry for games, called iGame Ultra Series. Carrying a premium white aesthetics, the Ultra Series serves as clean and elegant component for PC builds. At the heart of the Ultra Series is the GeForce RTX 4080 SUPER graphics card. The card has a triple-fan cooling solution with vapor chamber technology that keeps temperatures under control. Powering this GPU is the iGame Z790D5 Ultra motherboard. Supporting the latest Intel 14th Gen CPUs and up to 192 GB of DDR5-7800 RAM. An array of ultra-fast PCIe 5.0 and 4.0 M.2 slots allow multiple high-speed SSDs for ridiculous storage performance. Keeping all of these elite components running is the 850 W iGame P850G Ultra W 80 Plus Gold power supply. Its modular design with dedicated PCIe 5.0 connectors ensures clean cable management and stable power delivery. For cooling the CPU, there is the iGame LQ360 Ultra W all-in-one liquid cooler, which sports a massive 360 mm radiator and a trio of high-static pressure fans. All of these premium components are housed in the iGame C23A Ultra W full-tower chassis. With a spacious dual-compartment layout, front USB-C port, and preinstalled vertical GPU bracket, it offers both incredible expandability and sleek aesthetics.

Intel and Apollo Agree to Joint Venture Related to Intel's Fab 34 in Ireland

Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) today announced a definitive agreement under which Apollo-managed funds and affiliates will lead an investment of $11 billion to acquire from Intel a 49% equity interest in a joint venture entity related to Intel's Fab 34. The transaction represents Intel's second Semiconductor Co-Investment Program (SCIP) arrangement. SCIP is an element of Intel's Smart Capital strategy, a funding approach designed to create financial flexibility to accelerate the company's strategy, including investing in its global manufacturing operations, while maintaining a strong balance sheet.

Located in Leixlip, Ireland, Fab 34 is Intel's leading-edge high-volume manufacturing (HVM) facility designed for wafers using the Intel 4 and Intel 3 process technologies. To date, Intel has invested $18.4 billion in Fab 34. This transaction allows Intel to unlock and redeploy to other parts of its business a portion of this investment while continuing the build-out of Fab 34. As part of its transformation strategy, Intel has committed billions of dollars of investments to regaining process leadership and building out leading-edge wafer fabrication and advanced packaging capacity globally.

Next-Gen Computing: MiTAC and TYAN Launch Intel Xeon 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

MSI Unveils Next-Gen AI+ Gaming and Business & Productivity Laptops with Latest Processors at COMPUTEX 2024

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly announces the launch of several next-gen AI+ gaming and business productivity laptops featuring the latest Intel and AMD processors at COMPUTEX 2024. These laptops offer more than 100 TOPS of AI computing power and support more than 500 AI models run optimized on Intel Core Ultra processors, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enabled than any other processor vendor. When equipped with a GeForce RTX Laptop GPU, they offer up to 542 TOPS, delivering peak performance and enabling unique AI experiences.

Additionally, MSI unveiled the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (codenamed "Lunar Lake") and an 8-inch screen, providing a smoother and broader mobile gaming experience.

ASUS Unveils Cutting-Edge Servers and Data Storage for HPC and AI at Computex 2024

ASUS, a leading data center solutions provider, today proudly unveils its expertise in delivering comprehensive solutions for high-performance computing (HPC), AI, and diverse enterprise needs in its Data Center Solutions VIP Showcase at Computex 2024. At the event, ASUS demonstrates its expertise in servers, storage and data center architecture with support for Intel, AMD and NVIDIA technologies, as well as its liquid/air-cooling solutions and proprietary, high-quality software platforms. Equipped to meet the demanding requirements of today's data-intensive workloads, ASUS offers tailored solutions that are meticulously designed to elevate performance, reliability and scalability. From research institutions, financial firms, to manufacturing facilities, ASUS stands ready to empower organizations with cutting-edge HPC capabilities.

Unveiling enhanced flexibility with Intel Xeon 6 processors
To build a top-notch ecosystem, strong integration and partnerships are crucial for excellence. ASUS proudly introduces its latest servers, RS700-E12 and RS720-E12 series, powered by Intel Xeon 6 processors. Through fine tuning in hardware design, we've adeptly addressed the challenges of higher performance as well as increased power consumption, while also embracing modular design for more efficient motherboard layout and serviceability. Empowered by ASPEED AST2600 and PFR AST1060, these advancements have been seamlessly integrated into the all-new ASMB12-iKVM on the Intel Xeon 6 processor platform, resulting in remarkable CPU performance and fortified out-of-band management and security. This new architecture enriches all workloads, leveraging Intel 7 process paired with multiple compute cores etched on Intel 3 process, to deliver unparalleled efficiency and reliability.

GIGABYTE Rolls Out Cloud-scale Solutions for Intel Xeon 6 Processor

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in servers and industrial motherboards, today launched products supporting Intel Xeon 6 Processor (LGA 4710) with Efficient-cores in a single or dual socket configuration. GIGABYTE's new products span its entire enterprise portfolio from GPU servers to liquid cooling servers to motherboards. With Intel's new processor roadmap addressing a broad range of compute needs in the server market, Efficient-cores (E-cores) and Performance-cores (P-cores) have their unique advantages, and both are supported on this platform. E-cores are available today, with P-core products becoming available in the future. The solutions within have distinct advantages for cloud, networking and media, and data services workloads that value consistent performance, greater energy efficiency, and dense rack and core density.

GIGABYTE's enterprise portfolio for the Intel Xeon 6 processor spans GPU servers, direct liquid cooling (DLC) servers, multi-node servers, general purpose motherboards and servers, and edge servers. By releasing a wide range of servers, data centers can quickly integrate it to achieve dynamic goals such as in GIGA POD, a rack-scale supercomputing AI infrastructure by GIGABYTE. The new Xeon based servers by GIGABYTE are also highly compatible with cloud-native software stacks for portability and consistency in containerized applications in distributed systems.

Acemagic Brings Dual-Screen Laptops and Starship-Like Mini-PCs to Computex 2024

Acemagic, a German mini-PC developer, has an interesting product booth at Computex 2024. We stopped by to take a look and found the exciting world of mini-PC solutions. Among the first products, we looked at the Z1A dual-screen laptop solution. Featuring two 14.1-inch 1080p IPS displays sitting side by side, the Z1A laptop is powered by Intel's Alder Lake Core i7-1265U or i7-1255U CPUs with Intel Iris Xe graphics. Weighting 1.8 kg, the laptop has a 4000 mAh battery and accommodates two M.2 2280 NVMe drives in combination with LPDDR4 memory left empty for users to install. The computer features WiFi 6 and BlueTooth 5.2 connectivity options and has an IO port selection that includes a USB 3.0, HDMI 2.0, and two USB Type-C connectors (one for data and one for charging and data).

ASUS Reveals All-New AI-Powered ExpertBook P5 at Computex 2024

As industry leaders and innovators gather at Computex 2024, ASUS is excited to unveil its latest computing technologies for work. This year's highlight is the debut of the all-new ASUS Expert P series, specifically designed for entrepreneurs, prosumers and home offices, marking a significant expansion in ASUS offerings for business. Leading this series is the flagship model ExpertBook P5 (P5405), the first ASUS next-era AI PC designed for work. It exemplifies the fusion of cutting-edge technology with practical functionality.

Powered by Intel Core Ultra processors (code-named 'Lunar Lake'), ExpertBook P5 embodies a new way of working. It introduces pioneering ASUS AI PC technology, boasting more than 45 TOPS NPU, delivering over 100 platform TOPS and approximately triple the AI performance of the first-generation Intel Core Ultra processor, ensuring quieter and cooler operations ideal for the dynamic environments of today's mobile professionals.

Intel Computex 2024 Keynote: The Best that was Yet to come is Here

We are live from the Intel Computex 2024 Keynote address in Taipei. CEO Pat Gelsinger, along with the heads of the company's various business groups will take stage to unveil the latest in PC processors, server processors, generative AI accelerators, datacenter infrastructure gear, and lots more! In particular, we're interested in their Core Ultra "Lunar Lake" and "Arrow Lake" processors, and next-generation Xeon 6 chips. Can Gaudi 3 break into the duopoly between NVIDIA and AMD? Join us to find out in this live-blog!
02:55 UTC: Something really cool from the show: The camera is pointing at Intel's industry partners in the audience, and a Gaudi 3 is turning them into superhero images!
03:02 UTC: Pat Gelsinger takes center stage.

Schenker XMG At Computex 2024: EVO 14 and EVO 15, Qualcomm-powered Tuxedo

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.
Update 07:03 UTC: We have some pricing and availability details from Schenker.

Acer Unveils Wave 7 Mesh Router with Wi-Fi 7 and MLO for Seamless Home Connectivity

Acer today announced the expansion of its wireless router portfolio with two new options designed for gamers and a wide range of individuals, including families and remote workers. The Acer Wave 7 leverages the latest Wi-Fi 7 technology to deliver broad, reliable coverage for large homes with many devices, while the Predator Connect W6x utilizes Wi-Fi 6 to prioritize speed and performance for smooth online gaming experiences.

The W6x boasts dual-band connectivity, utilizing both 2.4 GHz and 5 GHz frequencies to ensure strong and consistent signals throughout the home, while the Wave 7 elevates further with the additional support of up to 6 GHz of Wi-Fi 7. Additionally, they come equipped with Hybrid Quality of Service (QoS) software and the Intel Killer Prioritization Engine, working together to identify and prioritize critical network traffic for maximized speed and minimal lag. User-friendly interfaces make setup and management a breeze, while built-in Trend Micro Home Network Security safeguards network and connected devices from potential threats.

Acer Launches New Line of TravelMate Business AI Laptops

Acer today announced a new range of AI-enhanced TravelMate business laptops. Powered with the latest generation of processors with built-in NPUs, the new laptops offer professionals and executives next-level performance, productivity, and mobility, in addition to enhanced security and connectivity features.

Optimized to deliver new AI-powered capabilities and user experiences, all of the new business laptops come with Acer TravelMateSense for quick access to device management settings and customizations, a new Acer Experience Zone for the collection of the devices' AI features, and Copilot accessible through a dedicated hotkey. Each model also offers advanced security and administration features to streamline device deployment and management for business, ensuring data are safeguarded with discrete Trusted Platform Module (TPM) 2.0, biometric security, and a camera privacy shutter.

God of War Ragnarök is coming to PC

God of War Ragnarök will be coming to PC on September 19, 2024! Santa Monica Studio's development partner for God of War (2018) on PC, Jetpack Interactive, is back to help deliver the PC version of God of War Ragnarök. Alongside the release date, we'd also like to share a selection of the features that will be available (Account for PlayStation Network is required).

Unlocked framerates
Experience the epic conclusion of Kratos and Atreus' journey in the Norse saga at peak performance. Unlocked framerates and the option of true 4K resolution expand the full potential of the cinematic no-cut camera as you travel through the stunning vistas of the Nine Realms to do battle against deadly foes in the forms of Norse gods and monsters.
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