CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

Lenovo is unveiling the Lenovo Legion Go, the company's first Windows gaming handheld device, to give gamers more freedom to game however—and wherever—they want. The Lenovo Legion Go is designed for gamers who will settle for nothing less than top-tier specs and visuals on their handheld device. Along with the micro-OLED-equipped new Lenovo Legion Glasses and new Lenovo Legion E510 7.1 RGB Gaming In-Ear Headphones, the debut of the Lenovo Legion Go is a marked expansion of the Lenovo Legion ecosystem of gaming devices, monitors, accessories, software, and services that empower gamers to immerse themselves in their games.

• The new Lenovo Legion Go brings Windows PC gaming power to a handheld mobile form factor, powered by AMD Ryzen Z1 Series processors that bring games to life on its 8.8-inch Lenovo PureSight Gaming Display.
• For gamers who want to take their Lenovo Legion Go portable gaming experience to the next level, the new Lenovo Legion Glasses leverage micro-OLED technology to provide a large screen viewing experience that fits in the pocket.
• For a truly immersive gaming experience, the new Lenovo Legion E510 7.1 RGB Gaming In-Ear Headphones offer hi-res 7.1 surround sound audio with a multifunction inline controller.

AMD is aiming to launch its Ryzen 8000 desktop CPUs, codenamed "Granite Ridge," at some point next year. The next generation Zen 5 core microarchitecture is expected to arrive alongside (Navi) RDNA 3.5 iGPU cores according to the last batch of Team Red product roadmaps. Today, hardware tipsters Olrak29_ and Kepler_L2 have made claims on social media that part of the Ryzen 7000 CPU legacy will continue with the succeeding desktop processor lineup—we already know that Granite Ridge will exist as a Socket AM5 package, but today's leak proposes that these next-gen chips are lined up to utilize the same IO die as sported by AMD's current Zen 4 desktop family.

These new rumors suggest that the "reused" Ryzen 7000 IOD (I/O Die) chiplet will grant the familiar allocation of 28 PCIe Gen 5 lanes, memory controllers, USB functions, plus RDNA 2 iGPU cores. Wccftech points out that: "...interestingly, AMD lists the Ryzen 7000 "desktop" CPUs with Navi 3.0 support whereas the Radeon 710M iGPU in fact is based on the RDNA 2 graphics core. The next-gen lineup was mentioned to support the newest RDNA 3.5 GPU core which will be coming to the Strix APU family next year but that isn't the case either." The article proposes that "RDNA 3.5 GPU cores on the AM5 platform" could arrive with the advent of upcoming Ryzen APUs—namely 6 nm Rembrandt (6000G) and 4 nm Phoenix (7000G) desktop solutions.

Giga Computing, a trailblazing force in high-performance technology and a distinguished GIGABYTE subsidiary, proudly presents the next evolution in computing. Behold the sleek and powerful ultra-compact mini-PC, a masterpiece meticulously designed for the BRIX Extreme lineup. This dynamic addition harnesses the formidable capabilities of the AMD Ryzen 7040U and 7035U series processors. As AMD propels mobile platforms into a new era with the Zen 4 architecture and TSMC's cutting-edge 4 nm process, the BRIX Extreme rises as the ultimate symbol of performance, style, and innovation.

Enveloped in GIGABYTE's exclusive design, the BRIX Extreme of 2022 boasts an enhanced appearance that seamlessly integrates four display outputs—HDMI 2.1, USB Type C, 2.5G Ethernet, and Wi-Fi 6E. This unleashes the unprecedented power of the most dominant mini-PC, delivering breathtaking performance and responsiveness. Unleash your creativity, dominate your games, and immerse yourself in limitless possibilities.

During its "Xiamen HighFun" event in China, Minisforum announced the latest addition to its compact series of gaming PCs, this time with no official name. The 6-liter system, code-named "Project RPFXI" for Intel and "Project DRFXI" for AMD, will support up to 100 W TDP and utilize the most powerful Ryzen CPU, the Ryzen 9 7945HX3D. This hybrid mobile/desktop processor combines the desktop-level performance of 16 Zen 4 cores with 144 MB of 3D V-cache, all within a 55 W power limit. Minisforum confirmed the 7945HX3D would be available in the AMD platform version, positioned as a premium model compared to the existing 7945HX system.

Interestingly, the GPU support is literally external, as the potential GPU needs to be attached to the outside part of the case, which is then secured using screws. The case could accommodate the fastest GPUs like NVIDIA GeForce RTX 4090 with a powerful enough power supply. The 6-liter mini PC is expected to launch in late 2023, either in 24-core Intel (HX line) configuration, of 16-core AMD configuration.

Today, AMD released the findings from a new survey of global IT leaders which found that 3 in 4 IT leaders are optimistic about the potential benefits of AI—from increased employee efficiency to automated cybersecurity solutions—and more than 2 in 3 are increasing investments in AI technologies. However, while AI presents clear opportunities for organizations to become more productive, efficient, and secure, IT leaders expressed uncertainty on their AI adoption timeliness due to their lack of implementation roadmaps and the overall readiness of their existing hardware and technology stack.

AMD commissioned the survey of 2,500 IT leaders across the United States, United Kingdom, Germany, France, and Japan to understand how AI technologies are re-shaping the workplace, how IT leaders are planning their AI technology and related Client hardware roadmaps, and what their biggest challenges are for adoption. Despite some hesitations around security and a perception that training the workforce would be burdensome, it became clear that organizations that have already implemented AI solutions are seeing a positive impact and organizations that delay risk being left behind. Of the organizations prioritizing AI deployments, 90% report already seeing increased workplace efficiency.

As a part of its promotional deal with Bethesda for the upcoming Starfield game, AMD has announced a limited edition release of both its Radeon RX 7900 XTX graphics card and its Ryzen 7 7800X3D CPU. The latter is in all fairness a bit dull as far as limited editions go, as the only thing really limited is the packaging the CPU comes in. Despite being a limited production run of only 500 units, AMD didn't bother adding any extra marking on the CPU itself, making it less of a collectors edition than it could've been.

On the other hand, the Radeon RX 7900 XTX Starfield Special Edition gets a custom white shroud with a lot of little quirky bits of text on the card and an overall different feel to it compared to AMD's reference design cards. Again, we're looking at a limited run of 500 cards here too and it's not clear if these will be numbered or not. Neither product will be available to buy though, so the only way to get your hands on one or the other, is to enter one of multiple giveaways that either AMD or its partners will host in the near future. There's a video after the break with more details.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

Based on details posted on Twitter/X by a pair of well known leakers, AMD appears to be working on a pair of different Ryzen 8000-series mobile processors. The previously known Strix Point is said to get up to four Zen 5 cores and eight Zen 5c cores, whereas the Strix Halo is said to get 16 Zen 5 cores, according to @Olrak29_. This is something that was posted by Moore's Law is Dead back in April as well, who claimed the chip will launch sometime at the end of 2024. MLID also suggested that the Strix Halo will feature a 40 CU GPU and a 256-bit LPDDR5X memory interface, making it a very different proposition from your average APU from AMD.

@kopite7kimi chimes in on Twitter to point out that "Strix Halo looks like a desktop Zen 5 with a different IOD." This is definitely something that would be possible for AMD to do and if we look at the MLID information, the Strix Halo processor appears to have something called a Mall Cache, which seems to be something of a catch all cache for the various components inside the chip, such as the AI Engine and the GPU. Time will tell if AMD delivers on Strix Halo or not, but this might be the first notebook processor that can handle gaming at a decent resolution without needing a discrete GPU. Then again, with a rumoured peak TDP of 120 W, this chip is also going to run hotter and draw more power than most mobile processors to date.

ASUS Republic of Gamers (ROG) today announced the new ROG Strix SCAR 17 X3D, the perfect fusion of cutting-edge silicon and ROG engineering. Featuring the AMD Ryzen 9 7945HX3D mobile processor equipped with AMD 3D V-Cache technology for the very first time, the Strix SCAR 17 X3D takes performance to a whole new level. By doubling the L3 cache of the mighty Ryzen 9 7945HX processor, the Ryzen 9 7945HX3D gives users a boost in games that are hungry for this onboard ultrafast memory. Paired with a 240 Hz QHD display, Conductonaut Extreme liquid metal on the GPU, and a vapor chamber, the Strix SCAR 17 X3D is ready to dominate the leaderboards.

Making great processors even better
While the original 2023 ROG Strix SCAR 17 came equipped with AMD Ryzen 7000 Series processors, the AMD Ryzen 9 7945HX3D is truly in a league of its own. It leverages the power of AMD 3D V-Cache technology, a stacking of extra ultra-high-speed L3 cache vertically on top of one of the two core compute dies (CCD). This extra cache enables the eight cores to perform certain calculations quickly and efficiently, notably in gaming. For situations where increasing CPU frequency simply doesn't show significant performance gains, 3D V-Cache technology holds the potential to unlock extra compute power.

Talking with XDA-Developers, AMD has confirmed more details about the upcoming Phoenix2 APU, which should debut with Ryzen 3 7440U and Ryzen 5 7540U APUs. Unlike the larger Phoenix APU, the Phoenix2 APU will have a hybrid design with Zen 4 and Zen 4c cores. As confirmed by AMD, the Phoenix2 APU will be a 6-core design, which makes it pretty clear it will feature two Zen 4 and four Zen 4c cores. It will also come with a Radeon 740M GPU with 4 RDNA3 compute units (CUs). The Phoenix2 APU will also lack the Ryzen AI core. Unlike Intel's hybrid approach, Zen 4c cores will have the same IPC as Zen 4, same instructions, but have less L3 cache per core.

AMD has previously confirmed that the Ryzen 3 7440U will have a smaller die size of 137 mm², compared to 178 mm² on the Ryzen 5 7640U. While AMD did not directly confirmed that the Ryzen 5 7540U will also be based on the Phoenix2 APU, official specification shows it with the same 4 GPU cores and without Ryzen AI core, making it pretty obvious it will be based on the same Phoenix2 APU. Hopefully, AMD will come up with more official details about its Phoenix2 APU as there are still a lot of unknowns.

A new vulnerability has been discovered in AMD Zen 2 based CPUs by Tavis Ormandy, a Google Information Security researcher. Ormandy has named the new vulnerability Zenbleed—also known as CVE-2023-20593—and it's said to affect all Zen 2 based AMD processors, which means Ryzen 3000, 4000 and 5000-series CPUs and APUs, as well as EPYC server chips. The reason why Zenbleed is of concern is because it doesn't require a potential attacker to have physical access to the computer or server in question and it's said to be possible to trigger the vulnerability via executing a javascript on a webpage. This means that the attack vector ends up being massive, at least when we're talking about something like a webhosting company.

Zenbleed is said to allow a potential attacker to gain access to things like encryption keys and user logins via triggering something called "the XMM Register Merge Optimization2, followed by a register rename and a mispredicted vzeroupper." Apparently this requires some precision for the vulnerability to work, but due to these registers being used system wide, even a sandboxed attacker can gain access to them. AMD has already issued a patch for its EPYC server CPUs, which obviously are the most vulnerable systems in question and the company is planning to release patches for all of its Zen 2 based CPUs before the end of the year. Hit up the source links for more details about Zenbleed.

Tipsters have noticed that ASUS is preparing a new high-end laptop with an unannounced AMD processor—the upcoming ROG Strix SCAR 17-inch model (G733PYV-LL046W,) will apparently sport a Ryzen 9 7945HX3D APU (with 128 MB of L3 cache). The inclusion of "X3D" in the processor's name has generated a lot of interest, given that Team Red's 3D V-Cache technology has existed mainly within mainstream desktop-oriented Ryzen 7000 and 5000 processor lineups. This leaked dual-CCD APU is probably being lined up to take on upper-echelon Intel Raptor Lake-HX processors, as well as refreshed variants.

The leak indicates that this APU will likely sit at the top of the Zen 4-based Dragon Range-H lineup—being a 5.4 GHz max. boost clock, 16-core/32-thread CPU, with a configurable TDP (between 55 W and 75 W) and Radeon 610M iGPU. The host ASUS ROG Strix SCAR 17 laptop is no slouch thanks to some very generous hardware specifications, including a mobile NVIDIA RTX 4090 GPU, 32 GB of DDR5 memory, 2 TB SSD, and a 17.3" 240 Hz IPS display. Listed at 5599 AUD (~$3800) on Computer Alliance, or £3904.79 (~$5000) chez Lamba-Tek, you would expect the best possible performance for those prices. The two online retailers have not confirmed any concrete release dates for the high-end ASUS laptop.

AMD's recently added Ryzen 5 7500F for the AM5 socket was initially said to only be available in the PRC, but according to AMD, it will apparently be available globally. That said, AMD apparently only seeded review units to select Asian media, among them Quasar Zone in Korea, who put the six core, 12 thread CPU through its paces. Overall performance is very close to the Ryzen 5 7600, which isn't really all that strange, considering the two only differ by 100 MHz in both base and boost clock. In most of the benchmarks, the Ryzen 5 7500F is around two to three percent slower than the Ryzen 5 7600 on average.

When compared to the slightly more pricey Intel Core i5-13400, AMD falls behind multithreaded apps but comes out on top in most of the games tested, with the usual odd exception as would be expected. On average, the Ryzen 5 7500F is some 13 percent faster in the game benchmarks at 1080p, although this is using an NVIDIA GeForce RTX 4090 graphics card. It even beats the overall much faster Intel Core i5-13500 in gaming by around nine percent on average. However, the Ryzen 5 7500F system loses out to the two Intel systems when it comes to power efficiency, drawing around 20 Watts more on average when gaming. At US$179.99 it seems like AMD finally has a budget friendly CPU for the AM5 platform, if you're willing to lose the integrated GPU. It's unknown when the CPU will be available outside of Asia at this point in time.

AYANEO, an Asian manufacturer known for its mobile handhelds, has introduced a new device, the AYANEO Kun. The Kun is powered by the latest AMD Ryzen 7 7840U mobile processor from the Ryzen 7040 series. This SoC includes eight Zen 4 cores and an integrated graphics unit based on the RDNA 3 architecture with 12 compute units. The console's dimensions stand at 312 x 133 x 21.9 mm, making it slightly wider but slimmer than ASUS's ROG Ally, with the exact weight yet to be disclosed. Kun's battery capacity is rated for 75Wh, as compared to other handhelds' 40 Wh, potentially indicating a longer battery life.

The AYANEO Kun's other notable features include its 8.4-inch display with an IPS panel and resolution of 1,920 x 1,200 pixels. For controls, the device utilizes a D-Pad and two Hall sensor-equipped joysticks for gaming. The shoulder buttons also employ Hall sensor technology. There are touchpads on either side of the display, along with other function keys and the A/B/X/Y keys. For the first time, AYANEO has integrated buttons at the back of the device, offering customizable functions. The device provides two Type-C (likely USB4), one USB Type-A, and one 3.5 mm jack connection. More comprehensive technical details, model variants, and pricing information are to be released during the official unveiling of the AYANEO Kun scheduled for August.

Today, Lenovo unveiled the newest additions to its ThinkPad mobile workstation portfolio. Powered by the latest AMD Ryzen PRO 7040 Series Mobile processors with optional NVIDIA RTX professional graphics, the new ThinkPad P16v, P16s Gen 2 and P14s Gen 4 complement the models announced in May 2023, offering customers a broad choice in mobile workstation PC solutions. ThinkPad P Series devices deliver breakthrough performance, premium design, and durability for demanding workflows across a variety of price points and include support for Windows 11 and several flavors of Linux. Bringing advanced and power-efficient processors with AMD PRO technologies and Ryzen AI on select models opens up an enhanced world of AI-driven features for advanced collaboration on ThinkPad mobile workstations.

"Our latest workstations are designed to help our customers make a difference and drive a positive long-lasting impact in their fields, whether it's research and design, engineering and finance, media and entertainment, healthcare and education, or anything else. We are committed to delivering human-centric innovations that empower our customers to unleash their potential with ThinkPad mobile workstations," said Rob Herman, VP and GM, Worldwide Workstation and Client AI Business at Lenovo.

As reported by Phoronix—references to GFX1150 & GFX1151 targets have been added to the AMDGPU LLVM backend/compiler, which seems to indicate that these are upcoming AMD APU models. AMD engineers have made to reference to GFX1150 as "Strix1" (full codename: Strix Point) in the past according to several sites, but the recent leak has GFX1151 mentioned for the first time.

Previous reports suggest that Team Red could be developing two Strix/Zen 5/RDNA 3.5 APUs with AI engine enhancements for laptops—a discovery of two separate GFX targets suggests that we are likely looking at different 12-core and 16-core models. The former is said to be a monolithic design with a TDP going up to 54 W. The 16-core "Strix Halo" (also known as "Starlak") is a very different type of product with leaks suggesting that it will have a maximum TDP of 120 W, and be based on a chiplet design. Zen 5 processor products are expected to arrive in the second half of 2024—with Granite Ridge filling in the desktop platform segment.

Gamers Nexus recently visited AMD's headquarters in Austin, Texas—a previous video documented company employees discussing the history of Zen CPUs, and the showcasing of historical prototypes including (unreleased) Ryzen 9 5950X3D and 5900X3D models. The YouTube channel promised that more AMD HQ tour footage would be shared over the next couple of weeks—their latest upload has (host) Steve Burke talking to representatives from various internal labs.

A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.

According to the Linux Kernel Mailing List, AMD started to enable next-generation processors by submitting patches to the Linux kernel. Codenamed Family 1Ah or Family 26 in decimal notation, the set of patches corresponds to the upcoming AMD Zen 5 core, which is the backbone of the upcoming Ryzen 8000 series processors. The patches have a few interesting notes, namely few of them being: added support for the amd64_edac (Error Detection and Correction) module and temperature monitoring; added PCI IDs for these models covering 00h-1Fh and 20h; added required support in k10temp driver.

The AMD EDAC driver also points out that the Zen 5 server CPUs will max out with 12-channel memory. Codenames 0-31 correspond to next-generation EPYC, while 40 to 79 are desktop and laptop SKUS. Interestingly, these patches are just the start, as adding PCI IDs and temperature drivers are basic enablement. With the 2024 launch date nearing, we expect to see more Linux kernel enablement efforts, especially with more complicated parts of the kernel.

Newegg is currently running a time limited offer on AMD's flagship Ryzen 9 7950X3D CPU—the base price sits at $662, but a promotional voucher can be applied at checkout that removes $105. Amazon USA price matched the competition earlier today—via their own voucher system—but stock allocation of the powerful desktop processor appears to be sold out. North American customers eager to acquire an attractively priced Ryzen 9 7950X3D soon-ish will have to do business with Newegg.

The latest $557 deal is certainly more generous when compared to a campaign run by the American online retailer back in May, albeit via their Ebay store—several Ryzen 7000X3D-series CPUs were discounted at the time, perhaps in reaction to bad publicity swirling around the product lineup (referring to accounts of hardware burnouts). The Ryzen 9 7950X3D was reduced to a previous all-time low of $629.99. Perhaps public perception of AMD's top flight models has not improved all that much since then (plus other economical factors), and very deep discounts are necessary to attract customers. A Newegg mini-store page recently revealed a forthcoming "Starfield Game Bundle Promotion," that will apply to all Ryzen 7000-series CPUs. The AMD + Bethesda initiative will probably kick in closer to the game's September 6 launch date.

American online retailer, Newegg, has perhaps jumped the gun a little by readying CPU listings for an "AMD Starfield Game Bundle Promotion." The store page was noticed by some eagle-eyed folks over the weekend, and news sites were soon tipped off to the early announcement. AMD was revealed as Starfield's exclusive partner on PC last week, but upcoming promotions/bundles were not mentioned during presentation proceedings. Newegg's mini-site only functions as a promo product container (at the time of writing) for all available Ryzen 7000-series CPUs—individual SKU pages are void of any Starfield material, and the previous Star Wars Jedi: Survivor campaign ended on June 30.

The Newegg promo page includes everything in the mainstream Zen 4 lineup—from the entry-level Ryzen 5 7600 model going all the way up to the flagship Ryzen 9 7950X3D, but internet sleuths were unable to track down anything representing an equivalent campaign for AMD's latest Radeon RX graphics cards. Team Red's Zen 4 and RDNA 3 technologies got plenty of shout-outs in last week's partnership presentation: "Making this game even more special, is the close collaboration between Bethesda and AMD to unlock the full potential of Starfield. We have worked hand-in-hand with Bethesda Game Studios to optimize Starfield for both Xbox and PC with Ryzen 7000 series processors and Radeon 7000 series graphics. The optimizations both accelerate performance and enhance the quality of your gameplay using highly multi-threaded code that both Xbox and PC players will get to take advantage of."

US Computer component retailer Micro Center has announced that the store has struck an exclusive deal with AMD to be the sole retailer for the Ryzen 5 5600X3D processor. The CPU is apparently a limited edition release, although it's not clear how limited it'll be in terms of available quantities. The new CPU will launch on the 7th of July and has a base clock of 3.3 GHz and a boost clock of 4.4 GHz, each 100 MHz slower than the Ryzen 7 5800X3D. The CPU obviously has six CPU cores, which results in a total cache of 99 MB due to the missing two cores.

The TDP remains at 105 W and it appears that the Ryzen 5 5600X3D might just consist of failed Ryzen 7 5800X3D chips sold with two cores disabled. From what TPU understands, there should be some OEM availability of the Ryzen 5 5600X3D as well, based on what our sources have told us, but we don't have any details on which system integrators might be offering the CPU. Micro Center will be charging US$229.99, which is US$220 less than what the Ryzen 7 5800X3D launched at, although Micro Center is currently selling it at US$279.99. The Ryzen 5 5600X3D will also be offered at a discounted price when bought with eligible motherboard and memory bundles from Micro Center.

AMD and Bethesda have today revealed that Starfield will be best experienced on a Ryzen processor and Radeon graphics card-equipped PC. Team Red has been announced as the giant open world game's official graphics and GPU partner, but its Xbox Series hardware also gets a couple of friendly shout-outs. Todd Howard, director and executive producer at Bethesda Game Studios, stated in the video presentation: "We have AMD engineers in our code base working on FSR (FidelityFX Super Resolution) 2.0 image processing and upscaling and it looks incredible. You're going to get the benefits of that obviously on your PC but also on Xbox. We're super excited and can't wait to show everybody more."

Jack Huynh, Senior Vice President and General Manager of its Computing and Graphics Group at AMD, added: "Making this game even more special, is the close collaboration between Bethesda and AMD to unlock the full potential of Starfield. We have worked hand-in-hand with Bethesda Game Studios to optimize Starfield for both Xbox and PC with Ryzen 7000 series processors and Radeon 7000 series graphics. The optimizations both accelerate performance and enhance the quality of your gameplay using highly multi-threaded code that both Xbox and PC players will get to take advantage of."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, workstations, and mini-PCs, today announced a newly designed ultra-compact, mainstream mini-PC for the GIGABYTE BRIXs lineup that adopts AMD Ryzen 7030 series processors. With AMD Zen 3 architecture and TSMC 7 nm process, AMD advanced its high-performance, efficient mobile processors for the mobile market to multitask and stay entertained. Even while adopting a compact size, all new mainstream BRIXs still delivers powerful computing that fits perfectly in any IoT deployment, whether for office use, education use, home use, digital signage, medical care, or KIOSK.

The most recent generation of mainstream BRIXs products in 2023 adopt an all-new chassis design. Computing performance has increased, but the design does not require an increase in the size of the chassis. Its appearance has curved, soft, and twisted lines with a liveliness that makes it very unobtrusive. By the way it was assembled and layered, and designing oblique angles around the base, a sense of simplicity is created to achieve a lightweight design. This allows users to enjoy ultimate computing performance while also having a stylish and elegant product.