World class memory/DRAM module manufacturer, Silicon Power sets the sight on server class DDR3 DRAM module. Officially released as of today, the modules come with built-in temperature sensors and are made specifically for servers and workstations. Available in 1333/1066 MHz speeds, they are compatible with Intel Nehalem-based Xeon 5500 platform in tri-channel operation. With its built-in temperature sensor, it can effectively prevent system crashes, maximize efficiency and improve overall performances. It is the perfect fit for servers and workstation PCs that require stability, efficiency and processing power.

For serves and workstation PCs, platform stability is always a concern with system's heat production. Silicon Power's DDR3 1333/1066 temperature sensor can be monitored by the system and will address memory workloads accordingly to prevent overheating or overworking the modules. It effectively lowers module temperatures by evenly distributing workloads to ensure maximum system performance and stability.Silicon Power's server class DDR3 1333/1066 modules fully comply with JEDEC DDR3 standards. Using the latest Fly-by circuit design, it maximizes DRAM and Controller signal efficiency; support ODT technology that effectively reduces signal reflection. Insisting on using original and FBGA packaging modules, it is best suited for heat dissipation and reliability. Silicon Power's DDR3 dual / tri-channel modules are 100% tested to ensure second to none performance and durability. In full compliance with European RoHS standards, Silicon Power's DRAM modules also come with lifetime warranty. Silicon Power's DDR31333/1066 Unbufferred ECC DIMM are available in 6GB(2GB*3) / 3GB(1GB*3) / 4GB(2GB*2) / 2GB(1GB*2) / 2GB / 1GB capacities for users to choose from.

Product Features:

• Server / workstation DDR3 DRAM module
• Built-in temperature sensor to monitor module temperatures and adjust workloads accordingly to ensure maximum system performance and stability
• Fully compatible with Intel Nehalem-based Xeon 5500 in single, dual or tri-channel operation mode
• New generation and effectively consumes 20% to 30% less power over DDR2 modules
• Original modules configured in 128Mx8 and with FBGA packaging, it effectively dissipates heat
• Uses the latest Fly-by circuit design to improve signal efficiency between DRAM and the controller
• Support ODT (On-DIE Termination) technology to reduce signal reflection
• Use original manufacturer modules and tested thoroughly for stability and performance
• Durable and high compatibility guaranteed

Product Specifications:

• Memory type: DDR3 Unbufferred ECC Memory
• Pin count and module: 240Pin Long-DIMM
• Operating frequency: DDR3-1333 MHz / DDR3-1066 MHz (PC3-10600/ PC3-8500)
• Module type: Unbufferred ECC Memory
• Capacity: 6GB(2GB*3) / 3GB(1GB*3) / 4GB(2GB*2) / 2GB(1GB*2)/ 2GB / 1GB
• Module configuration: 128Mx8 (bit)
• Operating voltage: 1.5 V
• Cas Latency: 9 (1333MHz) / 7 (1066MHz)
• Warranty: Lifetime