| Friday, November 6th 2009 |
Antec is preparing the airy, new Lanboy Air ATX case. The new case will be one of Antec's star attractions at CES 2010, where it will be launched. The sporty design looks to be massively modular, from the looks of it, users could completely dismantle it. Several shards look to be connected to each other, which make for the case's various panels. Each of these has a steel mesh for high airflow. These, in combination with the black, grey and a dash of yellow, give it a subjectively industrial look.
The case sports three 5.25" drive bays, two 120 mm fans which protrude, and the the front connectors, on the front panel. The area of the side panel covering the drive bays holds another two to three 120 mm fans, two more right over the expansion slot area. The top, again, is perforated, with room for two 120 mm exhausts apart from the usual one on the rear panel. The LanBoy Air awaits launch at CES 2010, which will be held in the coming January. It is expected to be priced at around 200 EUR.
Source: Case & Cooling.fr
The case sports three 5.25" drive bays, two 120 mm fans which protrude, and the the front connectors, on the front panel. The area of the side panel covering the drive bays holds another two to three 120 mm fans, two more right over the expansion slot area. The top, again, is perforated, with room for two 120 mm exhausts apart from the usual one on the rear panel. The LanBoy Air awaits launch at CES 2010, which will be held in the coming January. It is expected to be priced at around 200 EUR.
Source: Case & Cooling.fr
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