As the demand has increased for PC components for gaming market, including high speed and reliable DRAM module, A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0 DRAM module. Designed for favorite gaming and daily computing groups on Intel X58, P55, and H55 platform, the new XPG Gaming Series DDR3-2000G DRAM module is promised to deliver CL9-9-9-24 timing with 1.65V voltage.

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can rely on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”


Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module:

• All DRAM IC are verified by high standard criteria.
• High quality 8 layers PCB (Printed Circuit Board).
• Equipped aluminum heat spreaders to perform heat away from DRAM module.
• Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
• Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
• Optimized for 64-bit OS (operating system).
• Test at latency settings 9-9-9-24 at 1.55V-1.75V.
• SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
• Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module:

• All DRAM IC are verified by high standard criteria.
• High quality 2oz copper 8 layers PCB (Printed Circuit Board):
• Assist spreading of heat from critical areas to perform effective thermal cooling.
• Decrease the resistance of electronic flow to avoid electric waste.
• Increase DRAM module’s lifetime.
• Improve signal integrity.
• Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
• Thermal Conductive Technology (TCT) - Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
• Feature Extreme Memory Profiles.
• Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
• Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
• Optimized for 64-bit OS (operating system).
• Test at latency settings 9-9-9-24 at 1.55V-1.75V.
• SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
• Limited lifetime Warranty.