Friday, December 2nd 2011

IBM to Produce Micron's HMC in Debut of First Commercial, 3D Chip-Making Capability

IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.

Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.

IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC.

HMC parts will be manufactured at IBM's advanced semiconductor fab in East Fishkill, N.Y., using the company's 32nm, high-K metal gate process technology.

HMC technology uses advanced TSVs — vertical conduits that electrically connect a stack of individual chips — to combine high-performance logic with Micron's state-of-the-art DRAM. HMC delivers bandwidth and efficiencies a leap beyond current device capabilities. HMC prototypes, for example, clock in with bandwidth of 128 gigabytes per second (GB/s). By comparison, current state-of-the-art devices deliver 12.8 GB/s. HMC also requires 70 percent less energy to transfer data while offering a small form factor — just 10 percent of the footprint of conventional memory.

HMC will enable a new generation of performance in applications ranging from large-scale networking and high-performance computing, to industrial automation and, eventually, consumer products.

"This is a milestone in the industry move to 3D semiconductor manufacturing," said Subu Iyer, IBM Fellow. "The manufacturing process we are rolling out will have applications beyond memory, enabling other industry segments as well. In the next few years, 3D chip technology will make its way into consumer products, and we can expect to see drastic improvements in battery life and functionality of devices."

"HMC is a game changer, finally giving architects a flexible memory solution that scales bandwidth while addressing power efficiency," said Robert Feurle, Vice President of DRAM Marketing for Micron. "Through collaboration with IBM, Micron will provide the industry's most capable memory offering."

Additional information, technical specifications, tools and support for adopting HMC technology can be found at micron.com.
Add your own comment

14 Comments on IBM to Produce Micron's HMC in Debut of First Commercial, 3D Chip-Making Capability

#1
qubit
Overclocked quantum bit
Wow, first Intel's Tri-gate 3D tech and now this! :rockout:
Posted on Reply
#2
AsRock
TPU addict
by: qubit
Wow, first Intel's Tri-gate 3D tech and now this! :rockout:
And it's with 2 respectable companys too :).
Posted on Reply
#3
krisna159
i will say
"what if" AMD merge with IBM and use that technology to bulid new micro procesor to compete with intel?? maybe... it will be nice competision......:toast:
but that was just "dream":ohwell::shadedshu
Posted on Reply
#4
qubit
Overclocked quantum bit
by: krisna159
i will say
"what if" AMD merge with IBM and use that technology to bulid new micro procesor to compete with intel?? maybe... it will be nice competision......:toast:
but that was just "dream":ohwell::shadedshu
Yes, that would be a fantastic dream. However, what kills it is that exclusive licence agreement Intel signed with AMD 30 years ago, which prevents them partnering with anyone else to produce better x86 processors. :banghead:
Posted on Reply
#5
1c3d0g
Finally high-density, low-power memory is becoming a reality. I'd love to see this coincide with a Haswell release. :)
Posted on Reply
#6
Fx
by: qubit
Yes, that would be a fantastic dream. However, what kills it is that exclusive licence agreement Intel signed with AMD 30 years ago, which prevents them partnering with anyone else to produce better x86 processors. :banghead:
yep, the stifling bitches. I hate Intel with a passion

kudos to IBM & Micron though- this is awesome news
Posted on Reply
#7
FishHead69
by: qubit
Yes, that would be a fantastic dream. However, what kills it is that exclusive licence agreement Intel signed with AMD 30 years ago, which prevents them partnering with anyone else to produce better x86 processors.
So what was the go when they teamed up with Motorola to produce the Athlon http://en.wikipedia.org/wiki/Athlon Which at the time it came out kicked intels arse

Whats stopping them from doing the same thing agian ?
Posted on Reply
#8
HalfAHertz
Um how did they solve the heat issues that plagued previous 3d designs?
Posted on Reply
#9
dogchainx
Didn't IBM develop an internal micro-channel liquid cooling tech? Let me google...

LINK
Posted on Reply
#10
qubit
Overclocked quantum bit
by: dogchainx
Didn't IBM develop an internal micro-channel liquid cooling tech? Let me google...

LINK
Yeah, that's clever tech, I remember reading about this before. Pushing liquid through tiny pipes takes a lot of effort, however, as it becomes highly viscous, like treacle. The article doesn't explain how they get around this.
Posted on Reply
#11
human_error
by: krisna159
i will say
"what if" AMD merge with IBM and use that technology to bulid new micro procesor to compete with intel?? maybe... it will be nice competision......:toast:
but that was just "dream":ohwell::shadedshu
That will never happen. IBM's left the consumer space and focuses the remaining hardware divisions on business customers, where the power series chips do very nicely. The only 2 areas AMD has an advantage are consumer CPUs and graphics, which again is on the consumer end of things (even workstation cards are not big enough business for IBM).

Still this tech looks pretty good, and when it filters down to consumer products could lead to some very high density SSDs and RAM modules.
Posted on Reply
#12
Mussels
Moderprator
this tech could still be used for CPU cache by AMD and intel, if they licenced it. so its good news all around.


video cards could massively benefit too, with 10x boosts to VRAM bandwidth.


shit, even SSD's...
Posted on Reply
#13
qubit
Overclocked quantum bit
by: Mussels
this tech could still be used for CPU cache by AMD and intel, if they licenced it. so its good news all around.


video cards could massively benefit too, with 10x boosts to VRAM bandwidth.


shit, even SSD's...
Indeed, we can never have enough bandwidth.
Posted on Reply
#14
Super XP
What AMD needs to do is get back to joint ventures with IBM and design CPU's together.
Posted on Reply
Add your own comment