Kingston showed off its wares to the media, which included one product in particular that garnered some interest, the new HyperX T1 modules. Designed keeping in mind today's congested high-end motherboards, the HyperX T1 modules feature compound aluminum heatsinks that are designed in away that doesn't make the modules thicker, but taller. These modules are twice as tall as usual kits such as the HyperX Genesis. Their PCBs, too, are taller, and probably have an exposed copper layer for heat-transfer, à la Corsair Dominator. The heatsink branches out into fins at the top, for passive heat transfer to surrounding air. These modules will probably comply with new XMP 1.3 specifications, and offer out-of-the-box DRAM speeds in the range of DDR3-2133 to DDR3-2600, with quite some OC headroom to spare.


Source: VR-Zone