Tuesday, January 17th 2012

Cooler Master Announces the Vertical Vapor Chamber technology

After releasing the world's first heatpipe heatsink in 2000, Cooler Master announces that it will begin to phase in Vertical Vapor Chamber technology into its upcoming retail CPU heatsinks; a technology initially developed by Cooler Master's OEM and industrial cooling division.

Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heatsink. At the same time vertical vapor chambers exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.


As a result, Vertical Vapor Chambers allow Cooler Master to develop cooling solutions with greatly reduced noise footprints or increased cooling performance in excess of 200W at the same or lower noise level as without vertical vapor chambers.

The high-end tower heatsink Cooler Master TPC-812, the first product based on this latest technology and Cooler Masters leading product development process will be officially released to the market in a few weeks during CeBIT 2012.
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8 Comments on Cooler Master Announces the Vertical Vapor Chamber technology

#1
Zubasa
So they made a fat heatpipe GJ Cooler Master.
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#2
RejZoR
Basically they stuffed vapor chamber between the cooling fins. Nothing special but if it's effective, i like it...
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#3
meirb111
nice marketing scheme nothing more
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#4
OOZMAN
Gimme the tl;dr / noob version plz. :D
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#5
Static~Charge
More surface contact area with the fins should mean better heat transfer. I'm withholding judgement until after I see some real-world performance tests.
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#7
GSG-9
First Vertical Vapor Chamber huh.

I did not realize just because a product flopped it is then fair game to pretend it never existed.

I believe the Vapochill micro had 3 vertical chambers.
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