Wednesday, February 8th 2012

G.Skill Announces Ares Low Profile DDR3 Memory Kits

G.Skill, the worldwide leading high performance memory designer and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory. Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.

Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.

Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth. G.Skill Ares specifications are listed as below. Specifications are subject to change without notice. For further details please check the G.Skill website at www.gskill.com
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24 Comments on G.Skill Announces Ares Low Profile DDR3 Memory Kits

#2
AsRock
TPU addict
Yuk, i would fire the designer if heshe showed me any thing like that, kinda power ranger looking
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#3
xenocide
I have a feeling this is similar performance-wise to the new Samsung memory that happens to be a similar height...
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#4
LagunaX
Pick up your cheap samsungs now before the prices go up!
I emailed G.Skill to come up with a low profile 2133 model comparable to the samsungs but with heatspreaders and XMP profile 2 weeks ago and lo and behold!
:toast:
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#5
Prima.Vera
Those CL9-DDR3 2133Mhz looks good. I wonder what the price is on those?
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#6
btarunr
Editor & Senior Moderator
This year memory prices will be as unpredictable as wartime oil prices (though not high, just unpredictable), so no memory vendor will give out prices.

It is a good time to buy moar rams.
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#7
jalex3
Looks good, appearance wise I think G.Skill has been the best lately.
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#8
AsRock
TPU addict
by: xenocide
I have a feeling this is similar performance-wise to the new Samsung memory that happens to be a similar height...
The sammys are a little lower than the clips that hold them in lol.

EDIT
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#9
R_1
Sammys are puny, not good for your e-P@nis. Gigantic fins are far better though ... adding some length where it is needed. :roll:
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#10
Paulieg
The Mad Moderator
by: R_1
Sammys are puny, not good for your e-P@nis. Gigantic fins are far better though ... adding some length where it is needed. :roll:
I'm confident enough in my e-manhood that I could care less what the damn things look like, as long as they perform.:laugh: That's why I've got 40GB's of those Sammy's sitting here. There is also plenty of utility in low profile sticks too, since you can populate all dimm slots without having to worry about heatsink clearance. Low profile FTW. I don't think I'll be going back to sticks with near useless monsterous heatspreaders. Generally, DDR3 sticks do not get hot, so the heatspreaders are all about aesthetics.

Good to see Gskill jumping on board with low profile sticks. I'm really hoping it's the trend across the board.
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#11
MikeMurphy
Huge heat spreaders, pardon my french, are fucking retarded. I can hardly tell my low-profile Vengeance dimms put out any heat whatsoever. What the hell is the point of huge heatsinks?? Marketing????

I doubt there would be much of a change for faster speeds and volts. FFS
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#12
xenocide
by: MikeMurphy
Huge heat spreaders, pardon my french, are fucking retarded. I can hardly tell my low-profile Vengeance dimms put out any heat whatsoever. What the hell is the point of huge heatsinks?? Marketing????

I doubt there would be much of a change for faster speeds and volts. FFS
Mostly aesthetics. There have even been numerous tests done that say Heatspreaders often increase the temperature of RAM Modules.
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#13
cadaveca
My name is Dave
I like these heatspeaders.


FYI, the heatspreaders that do not cool ram properly are typically made of thick metal, much as KInston's T1 heatsink, and Mushkin's Ridgeback heatsink. The thin metal on these DIMMs isn't going to affect cooling ability much, as is probably there for esthetics.


Speaking of esthetics, i really like this new look.
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#14
Prima.Vera
by: xenocide
Mostly aesthetics. There have even been numerous tests done that say Heatspreaders often increase the temperature of RAM Modules.
Where is the proven link? :shadedshu
FACTS no WORDS
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#15
cadaveca
My name is Dave
by: Prima.Vera
Where is the proven link? :shadedshu
FACTS no WORDS
My Mushkin 6-8-6-24 2x2 GB sets clock better naked?


Same with Kingston? YES, tested by me!


OF course, not many users remove heatsinks like this, but I do. What happens is that the heat gets trapped in the metal covering the memory IC, and the thickness ofthe metal prevents quick removal. With the heatisnks on, the sticks get quite warm to the touch, probably 40c-45c. With the heatspreaders removed, they barely hit 32c.


This is was measured with a thermal diode attached to the DIMM next to the middle ICs.

Keep in mind that as a reviewer, I have to stay 100% in fact as much as possible. It is FACT that some heatspreaders..some only, mind you, do the opposite of what they were intended to do.
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#16
damric
I like.

I always leave feedback about obnoxiously tall heatspreaders. Looks like they are listening to consumer input at g.skill.

I have bought quite a few of these $5 copper ones to replace stupid hair comb style ones that block more airflow than much of anything else.



EVERCOOL EC-MC-CO Copper Heatsinks only
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#17
LagunaX
That is why I like the plain rectangular ramspreaders that you self apply like they provided with the Team Group d9's back in the day - they did not block any airflow from the top/bottom/or sides.
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#18
Prima.Vera
by: cadaveca
My Mushkin 6-8-6-24 2x2 GB sets clock better naked?


Same with Kingston? YES, tested by me!


OF course, not many users remove heatsinks like this, but I do. What happens is that the heat gets trapped in the metal covering the memory IC, and the thickness ofthe metal prevents quick removal. With the heatisnks on, the sticks get quite warm to the touch, probably 40c-45c. With the heatspreaders removed, they barely hit 32c.


This is was measured with a thermal diode attached to the DIMM next to the middle ICs.

Keep in mind that as a reviewer, I have to stay 100% in fact as much as possible. It is FACT that some heatspreaders..some only, mind you, do the opposite of what they were intended to do.
OK, can you put some picture of those modules ,so the users should know and stay away from those please??
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#19
twicksisted
by: InnocentCriminal
I read that as Arse.

:P
lysdexia? or drain bamage?
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#20
Paulieg
The Mad Moderator
by: damric
I like.

I always leave feedback about obnoxiously tall heatspreaders. Looks like they are listening to consumer input at g.skill.

I have bought quite a few of these $5 copper ones to replace stupid hair comb style ones that block more airflow than much of anything else.


http://images17.newegg.com/is/image/newegg/35-119-017-S01?$S300W$
EVERCOOL EC-MC-CO Copper Heatsinks only
This is what I used for some generic D9's when they first came out. The D9's could get a little warm, and I think they actually helped just a bit. However, most current sticks barely get warm with reasonable voltage, so no heatspreaders are needed. They are on there simply for aesthetics and marketing.
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#21
entropy13
by: Paulieg
This is what I used for some generic D9's when they first came out. The D9's could get a little warm, and I think they actually helped just a bit. However, most current sticks barely get warm with reasonable voltage, so heatspreaders are really needed. They are on there simply for aesthetics and marketing.
I was a bit confused there. :laugh:

I'm sure you meant "are not really needed" though.

Yeah, the heatspreaders are basically for aesthetics now. I got blue RipjawsX/Vengeance LP to match the MSI boards, and the red RipjawsX and RipjawsZ to match the ASUS boards.
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#22
Paulieg
The Mad Moderator
by: entropy13
I was a bit confused there. :laugh:

I'm sure you meant "are not really needed" though.

Yeah, the heatspreaders are basically for aesthetics now. I got blue RipjawsX/Vengeance LP to match the MSI boards, and the red RipjawsX and RipjawsZ to match the ASUS boards.
:laugh: Fixed.
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#23
NdMk2o1o
by: btarunr
This year memory prices will be as unpredictable as wartime oil prices (though not high, just unpredictable), so no memory vendor will give out prices.

It is a good time to buy moar rams.
Am hoping they do go up as I am holding on to a brand new 8GB set that I got from RMA a week ago in the hopes they will, selling them now I would probably get £30 :p

BTW GSkill, these are not LP!!! they are standard height just without the gargantuan heatspreaders that are rife among sticks these days :rolleyes:
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#24
cadaveca
My name is Dave
by: Prima.Vera
OK, can you put some picture of those modules ,so the users should know and stay away from those please??
No, i do not think that this is nessecary. The modules work as advertized. However, when it comes to overclcoking, the maximum speeds are hampered by the heatsink design. Because they work fine as rated speeds, there's no reason to avoid them...in fact, one set I've recommended to many here, and many have bought them...and noone is dissatisfied with the products either.


In fact, I've already posted pictures, as have other users of the same modules, and it's been proven that the sticks, although of the same model number, do have different memory under the heatspreaders, and they clock a bit differently. The heatspreaders are there specifically because of this, and I see no problems with that what-so-ever.

Now, if my testing had shown that the modules were failing at stock, because of the heatspreaders, then I might make some noise about it....but as it stands, right now, it's a "secret" that if you buy, will give you much more than you asked for, once the heatspreaders are removed.


Anyway, that has nothign to do with these modules. G.Skill tends to use very thin heatspreders, that work very well, and do not limit airflow around the module.
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