Thursday, February 16th 2012

MAINGEAR Maximizes CPU Heat Transfer With the EPIC T1000 Thermal Cooling Solution

MAINGEAR, an award-winning custom PC builder offering custom desktops, custom notebooks, pc and workstations, is excited to announce their next innovation from MAINGEAR EPIC Labs; the MAINGEAR EPIC T1000 CPU thermal solution for their entire desktop lineup.

The MAINGEAR EPIC T100 is an ultra-high performing phase change metal alloy thermal interface material (TIM) offering the most effective solution to transfer heat from the CPU to the heatsink with high bulk conductivity. The MAINGEAR EPIC T1000 deploys into all the surface micro-asperities on the CPU lid and heat sink in a way that traditional paste solutions simply cannot.


The MAINGEAR T1000 is perfect for those who overclock their PCs and want immediate maximum thermal conductivity without waiting for the traditional curing times found in other solutions on the market today. This allows MAINGEAR and enthusiasts alike to reach the most extreme overclocking limits quickly and cut off precious extra degrees, resulting in a more stable system.

Key features highlighted below:

Maximizing Performance

The MAINGEAR EPIC T1000 has outstanding thermal conductivity-as much as 3 times better than the best silver-filled greases. The EPIC T1000 is unmatched by any other materials except solders, and unlike solders, the EPIC T1000 can be used between materials without matching Coefficients of Thermal Expansion (CTEs) such as between silicon dies and metal heat sinks. With the big reduction in thermal resistance EPIC T1000 provides, the demands on heat sinks and fans are relaxed, leading to many desirable results: decreased costs, quieter operation, and form-factor reductions.

Minimal Noise

The MAINGEAR EPIC T1000 also addresses a key emerging issue in the electronics industry-acoustics. For comfort in the home, and for safety in the workplace, the trend of increasing fan noise must be reversed. The EPIC T1000, by increasing the performance and efficiency of heat sinks reduces the need for enhanced airflow.

Consistent Performance

The MAINGEAR T1000 is a unique, effective solution that offers an easier, faster and more consistent way for PC performance not to be hindered by potential issues from heat generated by their CPU. Because the EPIC T1000 is a truly engineered solution you can be guaranteed consistent, repeatable performance with each application - there is no risk of over or under applying. This solution offers the use of the complete CPU lid surface for heat dissipation with a unique phase changing metal alloy thermal interface material.

The MAINGEAR EPIC T1000 will be available for the following socket solutions at the price point listed:

- Intel Socket 1155/1156 - $19.99
- Intel Socket 2011 - $29.99
- AMD - all open lid - $19.99

The EPIC T1000 will be available for purchase on www.maingear.com as a part of their full integrated systems as well as individually with other online retail stores such as: Amazon, FrozenCPU and Performance PCS.

"The MAINGEAR EPIC T1000 is a powerhouse TIM that should be included in any high performance system build." Said Mark Frig, CEO of Frozen CPU. "FrozenCPU carries the highest performing enthusiast components for the DIY PC market and we're happy to include the MAINGEAR EPIC T1000 amongst our stable of products."

"The EPIC T1000 when combined with the EPIC 180 is a potent combination. We found that it gave us quite a boost in terms of stability and performance." Said Sean Kalinich, Editor in Chief of Decryptedtech.com.

"If you are an extreme enthusiast and want to squeeze every last drop of performance out of your system a product like Maingear's EPIC T1000 is exactly the last piece in the cooling puzzle. The 11% gain in cooling performance with a fairly aggressive overclock is simply awe inspiring." – Legit Reviews, Editor's Choice.

"The EPIC T1000 is a testament to our commitment to constantly looks for ways to improve and innovative the PC performance and experience. We are developing unique solutions that help make PCs faster and quieter while still retaining a tasteful sense of style." Said Wallace Santos, Founder and CEO of MAINGEAR.

Select MAINGEAR SHIFT, F131, VYBE and X-Cube custom pcs will have the option of selecting the EPIC T1000. All MAINGEAR EPIC solutions are geared towards maximizing custom built PCs while enhancing the overall experience.

All of MAINGEAR products are supported with lifetime labor and phone support with one to three year hardware warranty.
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29 Comments on MAINGEAR Maximizes CPU Heat Transfer With the EPIC T1000 Thermal Cooling Solution

#1
Chaitanya
I still use Arctic Silver 5 thermal compound. :rockout:
Posted on Reply
#2
Arrakis+9
isn't this the same exact thing as indigo extreme ?
Posted on Reply
#3
meirb111
Thermal compound advertisement reminds me of cosmetics advertisement big promises and they will say anything to make you buy their products and you will end up with regular results no magic
Posted on Reply
#4
FreedomEclipse
Crazy Dogmatic Bullsh!t!
So this is like some metal shim that goes between the cooler and the CPU that supposed to improve the transfer of heat????

Sorry to say this but Coollaboratory are already inb4u with their Liquid MetalPad

from what i hear it was pretty medicre too with normal liquid based TIMs being a fair step ahead of it in performance...

Liquid MetalPad has been out for a long long time now yet nobody uses it
Posted on Reply
#5
micropage7
ultra-high performing phase change metal alloy thermal interface material
metal alloy? like rims?
metal based so if it bleed it would shortcircuit your board?
Posted on Reply
#7
n-ster
overpriced for 2011 :(
Posted on Reply
#8
Delta6326
I'm still using up all my MX-2 :D
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#9
D4S4
so what, this is essentially a low temperature solder?
Posted on Reply
#10
ChrisMorley
by: D4S4
so what, this is essentially a low temperature solder?
There's no adhesive properties to the alloy, it comes right off. It won't bond the CPU to the HS.
Posted on Reply
#11
D4S4
but the review says it wets the metal, that's what i was thinking drawing comparison to soldering metal.
Posted on Reply
#12
ChrisMorley
by: D4S4
but the review says it wets the metal, that's what i was thinking drawing comparison to soldering metal.
Oh sure, there's definitely a comparison, but the distinction is that they are different materials and the EPIC T1000 does not bond like solder does.
Posted on Reply
#13
halfwaythere
Talking about a marketing failure. If its only 3 degrees better than AS5 that means most modern conventional thermal compounds will better this without the hassle.

Grab yourselves some MX-4 and forget about this warranty voiding bullshit.
Posted on Reply
#15
ChrisMorley
by: halfwaythere
Talking about a marketing failure. If its only 3 degrees better than AS5 that means most modern conventional thermal compounds will better this without the hassle.

Grab yourselves some MX-4 and forget about this warranty voiding bullshit.
It destroys MX-4:

http://www.legitreviews.com/article/1852/4/
Posted on Reply
#16
VulkanBros
Adding an extra layer for heat transfer .... logically it makes no sense.....
Like putting on a condom for better feeling....:roll:
Posted on Reply
#17
ChrisMorley
by: VulkanBros
Adding an extra layer for heat transfer .... logically it makes no sense.....
Like putting on a condom for better feeling....:roll:
Um, it replaces the thermal grease. It doesn't get applied ON TOP of the thermal grease.
Posted on Reply
#18
VulkanBros
by: ChrisMorley
Um, it replaces the thermal grease. It doesn't get applied ON TOP of the thermal grease.
A HSF -> one side of the T1000 -> the other side of the T1000 -> the cooling unit

No I don't get it ..... to many surfaces .....
Posted on Reply
#19
ChrisMorley
by: VulkanBros
A HSF -> one side of the T1000 -> the other side of the T1000 -> the cooling unit

No I don't get it ..... to many surfaces .....
The T1000 is applied as a solid. It's basically a molded phase change metal alloy. There are no sides except when you first apply it. It's like solder. Think of solder, except it doesn't bond the HS to the CPU.

You then do a reflow by running your CPU hot. Then you plug in your fan or pump and it cools off, hardening into a thin sheet of metal between the CPU and the HS. It fills all the micro-asperations in the CPU lid and imperfections in the contact with the HS. Because it has much higher bulk conductivity than ANY grease out there, it also does better with thicker bond lines due to imperfect mounts, or where, like in the case of Socket 2011 CPUs, there's a convex surface, leading to thicker bond lines the further out you get from the CPU lid.

Perhaps you're confused by the pictures, but there are two separate applications in the package, you don't need both applications for one CPU.
Posted on Reply
#20
overclocking101
by: Arrakis+9
isn't this the same exact thing as indigo extreme ?
looks to be about the same to me
Posted on Reply
#21
wrathchild_67
This looks amazing. Now you can reseat your CPU waterblock with less effort. I wish there was a socket 1366 version of this stuff...
Posted on Reply
#22
ChrisMorley
by: wrathchild_67
This looks amazing. Now you can reseat your CPU waterblock with less effort. I wish there was a socket 1366 version of this stuff...
It's coming, probably next week or the week after.
Posted on Reply
#23
meirb111
The use of t1000 and metal alloy is this a Terminator movie? no its just a Thermal compound
Posted on Reply
#24
Chevalr1c
Thermalright Chill Factor III is enough for me. :D
Posted on Reply
#25
halfwaythere
Sorry but I don't buy that. Not even Liquid pro managed to destroy anything:

Posted on Reply
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