Friday, March 16th 2012

Common Platform Transitions to Adopt FinFET 3D Transistor with 14 nm Fab Process

Common Platform, a consortium of three major silicon fabrication companies: IBM, Samsung, and GlobalFoundries, met at their 2012 Technology Forum, where they announced their intention to transition to FinFET 3D transistor technology, but only with the 14 nanometer (nm) silicon fabrication process. Chips on this process will be built in the 2014~2015 time-frame. 3D transistors is a technology pioneered by Intel, which provides space-optimized, energy-efficient transistors on a nano-scale.

FinFET transistors will be combined with Fully Depleted Silicon-On-Insulator (FD-SOI) to offer extremely high transistor densities, with lower chip power. FD-SOI overcomes the limitation of current partially-depleted SOI (PD-SOI) technology, of lower-yields due to the pressure required for SOI insulation, which nears the breaking-point of strained silicon transistors. FinFET tech will be combined with chip-stacking technology, which helps make devices with better use of available PCB footprint.

Source: Bright Side of News
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7 Comments on Common Platform Transitions to Adopt FinFET 3D Transistor with 14 nm Fab Process

#2
Andy77
by: hellrazor
Come on, AMD....
Come on, brain... use at least one neuron! /s

AMD is fabless... corrected: Come, on GF....
Posted on Reply
#3
Zubasa
by: hellrazor
Come on, AMD....
Guess who manufacture CPUs for AMD?
Posted on Reply
#4
Shinshin
So AMD will be behind Intel for at lease 3 more years I see....
AMD we need you back in the CPU game....
Posted on Reply
#5
dude12564
by: Zubasa
Guess who manufacture CPUs for AMD?
tsmc, glofo
Posted on Reply
#6
KonstantinDK
So, which transistor technology will they move after 2015?
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#7
happita
by: KonstantinDK
So, which transistor technology will they move after 2015?
I think Intel will be the only one using 3d transistors and everyone else will use the FD-SOI transistors.
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