Tuesday, December 10th 2013

SMART Introduces New Memory Module Form Factor

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

SMART's MIP is an ideal memory solution for the emergence of new cube computing applications in networking, telecom and computing segments, as it leverages SMART's long-term, off-the-shelf stacking expertise. Offered in 2GB and 4GB densities, the MIP runs at speeds up to DDR3-2133.

"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," stated Mike Rubino, SMART's Vice President of Engineering. "The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."
SMART will be showcasing its new MIP at the Embedded World 2014 Exhibition & Conference in Nuremburg, Germany at stand 4-360 starting on February 25, 2014.
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5 Comments on SMART Introduces New Memory Module Form Factor

#1
The Von Matrices
This is compared to SO-DIMM, but it's not comparable since it's a soldered down package. I still don't understand the advantages of this technology versus memory soldered directly to the host PCB.
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#2
Homer_liu
by: The Von Matrices
This is compared to SO-DIMM, but it's not comparable since it's a soldered down package. I still don't understand the advantages of this technology versus memory soldered directly to the host PCB.
Personally, the advantage is only tiny. It just like a miniaturization product. Its size can be used in portable device so as to supply a big density for high loading application in the future.
Indeed, if don't consider the size, notebook can have better performance, unfortnately, notebook is not so small for your pocket.
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#3
eidairaman1
sort of look like PLCC chips, nothing special to these since Vram is BGA- soldered to PCB anyway, what would be great is a module based video card where chip, vrm and ram can be upgraded
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#4
Frick
Fishfaced Nincompoop
by: eidairaman1
sort of look like PLCC chips, nothing special to these since Vram is BGA- soldered to PCB anyway, what would be great is a module based video card where chip, vrm and ram can be upgraded
Some GPU's long ago had upgradable memory iirc. I really don't see the point. Memory maybe, but the other stuff? Might as well get a new GPU, you would have to replace everything anyway.
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#5
eidairaman1
Pti- i didnt focus on gaming till the gf2 era. By that time 3dfx was down the drain
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