Wednesday, May 7th 2008

Mushkin Announces Ascent Memory Modules With eVCI Cooling

Mushkin, a global leader in high-performance computer products, announced the launch of a new high performance line of memory modules aimed at the power gamer market. Called Ascent, the new line raises the bar on its Redline and XP premium memory offering by using eVCI (enhanced Vapor Chamber Interface) cooling technology, the current state-of-the-art in heat spreaders.


“By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance,” said Brian Flood, director of product development for Mushkin. “The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia’s new eVCI technology.”

At the heart of Mushkin’s eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies (www.celsiatech.com) that are encased on the outer dimensions by high conductivity 6063 aluminum alloy. In direct contact with 95% of the memory chip surface area, the vapor chambers effectively eliminate hot spots on the chip and quickly transfer heat to the aluminum where it is dissipated into the surrounding air.

eVCI, Celsia’s unique vapor chamber solution, was exclusively designed for the Mushkin Ascent line of Redline and XP memory modules, and the new line is among the first to use this innovative approach to rapid cooling of high performance chips. Additionally, the low profile, thin design allows full usage of all memory slots while complementing many of the largest CPU coolers, which often limit memory module height.

“The gamers we’re targeting with this new product line are extremely sensitive to the available memory slots they have for upgrades so the slim design of this new line will be particularly attractive to them as well,” added Flood.

Ascent XP Series – Available now through Mushkin authorized resellers

Two new products are being announced today in the Ascent XP series:
  • The Ascent 4GB (2x2GB) XP2-8500 5-5-5-15 offers the ideal 1066MT/s rating which provides extreme memory performance in both overclocked and non-overclocked FSB scenarios for DDR2 users. The high 4GB density allows users to heavily multitask and get maximum performance from their Vista-based machines.
  • The Ascent XP3-16000, coupled with an NVIDIA 790i-chipset motherboard, reach blazing speeds of DDR3-2000 for ultimate gaming and benchmarking performance. The Ascent XP3-16000 also features new EPP 2.0 SPD performance extensions for plug-and-play operation on enabled platforms.
Ascent Redline Series – Available within sixty days through select Mushkin resellers
Configurations in the Ascent Redline series promise to offer the most extreme frequency options for the most performance oriented PC enthusiast.

Available Part Numbers:
991619 – 2GB XP2-8500 5-5-5-15 2.0-2.1V Ascent XP Series
996619 – 4GB (2x2GB) XP2-8500 5-5-5-15 2.0-2.1V Dual Pack Ascent XP Series
991620 – 1GB XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
996620 – 2GB (2x1GB) XP3-16000 9-9-9-24 1.9-2.0V Ascent XP SeriesSource: Legit Reviews
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29 Comments on Mushkin Announces Ascent Memory Modules With eVCI Cooling

#1
hat
Maximum Overclocker
Finally they actually dissipate heat and not just trap them under the heatspreader -_-
Posted on Reply
#2
DanishDevil
Same deal as the Sapphire Toxic/other names 3870?
Posted on Reply
#3
hat
Maximum Overclocker
How does the 3870 relate to desktop memory?
Posted on Reply
#4
happita
He probably thought they took a chapter out of Sapphire's book and just slapped a few new words here and there and you got eVCI cooling!
Posted on Reply
#5
OnBoard
Vapor Champer seem to be the new Heat Pipe, shouldn't be long until someone makes a CPU cooler with a Vapor Champer base.
Posted on Reply
#6
infrared
Shame it's only the high density DDR2 modules they're doing with this heatspreader. They don't even need it imo because they don't work well at voltages above 2.2v

Now if they did the 128x64 modules with this heatspreader it would be awesome!
Posted on Reply
#7
tkpenalty
by: OnBoard
Vapor Champer seem to be the new Heat Pipe, shouldn't be long until someone makes a CPU cooler with a Vapor Champer base.
Its just funny to see you guys get tricked by simple marketing :rolleyes:

They are the same thing.
Posted on Reply
#8
D4S4
Why to hell are they using 6063 aluminum alloy?!? It has lower thermal conductivity than regular aluminum! 6063 is what my bike frame is made of!!! :banghead:
Posted on Reply
#9
infrared
Perhaps the liquid/vapor coolant stuff is under pressure, or a vaccume?

Only reason i can think of.
Posted on Reply
#10
PrudentPrincess
Can't wait until electronics manufacturers run out of four letter words to call their patents.
Posted on Reply
#11
[I.R.A]_FBi
by: tkpenalty
Its just funny to see you guys get tricked by simple marketing :rolleyes:

They are the same thing.
Quite so.
Posted on Reply
#12
thoughtdisorder
by: PrudentPrincess
Can't wait until electronics manufacturers run out of four letter words to call their patents.
Heck, I can't wait until electronics manufacturers make products good enough WE don't have to USE four letter words!:roll:

Regarding the design, I like the direction it is heading......
Posted on Reply
#13
PrudentPrincess
by: thoughtdisorder
Heck, I can't wait until electronics manufacturers make products good enough WE don't have to USE four letter words!:roll:

Regarding the design, I like the direction it is heading......
God if I see another ram stick cooled with w/c I'm going to shoot myself.
Posted on Reply
#14
WarEagleAU
Bird of Prey
Looks pretty slick to me. I guess the Redline is the awesome overclocking solution?
Posted on Reply
#15
OnBoard
by: tkpenalty
Its just funny to see you guys get tricked by simple marketing :rolleyes:

They are the same thing.
No they are not and I'm not that stupid you think with that post.

"Heatpipes already use this ‘evaporative cooling’ phenomenon, but while heatpipes require coolant to be forced in one direction along a set path, vapour chambers allow the heat to be transferred in all directions. You could think of them as a large-diameter, flat heatpipe, with the liquid moving through the layers of the chamber, rather than travelling along a restrictive pipe."

It would be the same as stating Ferrari and Volvo the same. Sure they both do the same thing, but get there a bit different. When you are not ristricted to pipe shape you can make the whole cooler base of heatpipe. No need to flatten them or file them down or any other direct contact stuff.

Tricky part will be how to attach high fins to it but HTPC cooler should be possible at least. When it's ready then we can be 'tricked by marketing' (read: TPU review). Or are you saying W1zzard got tricked too, as the Sapphire HD3870 Atomic did ok with it's "same thing"? It's something new and seems to work so it will be used (by manufacturers) and bought (by us 'tricked' ones).
Posted on Reply
#16
DanishDevil
by: PrudentPrincess
God if I see another ram stick cooled with w/c I'm going to shoot myself.
Better switch the safety off...
Posted on Reply
#17
D4S4
by: EastCoasthandle


There you go...

Some eye opening info between:
Cooper and Gold
Silver and Diamond
Aluminum and Cooper
Aluminum 6063 vs. regular
Posted on Reply
#18
WarEagleAU
Bird of Prey
Picture isnt showing up d4s4
Posted on Reply
#19
D4S4
Wtf, works for me...
Posted on Reply
#21
jbunch07
nice looking ram!
im tempted to try them out!
Posted on Reply
#22
hat
Maximum Overclocker
Wow diamonds are very conductive!!
Posted on Reply
#23
DanishDevil
That's why places sell diamond dust thermal paste :)
Posted on Reply
#24
tkpenalty
by: DanishDevil
That's why places sell diamond dust thermal paste :)
Diamond paste doesnt help because heat transfer can only be so quick through a thin layer...

by: OnBoard
No they are not and I'm not that stupid you think with that post.

"Heatpipes already use this ‘evaporative cooling’ phenomenon, but while heatpipes require coolant to be forced in one direction along a set path, vapour chambers allow the heat to be transferred in all directions. You could think of them as a large-diameter, flat heatpipe, with the liquid moving through the layers of the chamber, rather than travelling along a restrictive pipe."

It would be the same as stating Ferrari and Volvo the same. Sure they both do the same thing, but get there a bit different. When you are not ristricted to pipe shape you can make the whole cooler base of heatpipe. No need to flatten them or file them down or any other direct contact stuff.

Tricky part will be how to attach high fins to it but HTPC cooler should be possible at least. When it's ready then we can be 'tricked by marketing' (read: TPU review). Or are you saying W1zzard got tricked too, as the Sapphire HD3870 Atomic did ok with it's "same thing"? It's something new and seems to work so it will be used (by manufacturers) and bought (by us 'tricked' ones).
Its still a heatpipe nonetheless. "Vapour chamber" or eVCI cooling is just a marketing name, to trick you into thinking its new-and superior. I'm just pointing out that they are using this just as a method of marketing-its human nature to be more interested in something new.

Sure HD3870 Atomic, the cooler works fine. Even though temps aren't really an improvement vs the original cooler due to the lack of surface area that a vapour chamber has.

Anyway back on topic: How does Mushkin compare to other high end memory?
Posted on Reply
#25
adrianx
vapour....

anyone taste this "technology"

a test or a benchmark?

also the heat exchange is proportional with the heat spreader surface

and the heat conductibility of the spreader is linked to the material(s) used for the spreader

I think that this is a reinvented wheel but this time will be a wheel with cubic form :D
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