Tuesday, October 21st 2008

Mobile Nehalem Chips Not Expected Until Late 2009?

Intel Clarksfield, the company's Nehalem based mobile platform, was reported on Monday to begin production in the second half of 2009. Although mass production of the first Core i7 processors is scheduled for next month, on the mobile front Intel users will have to wait until late next year. Clarksfield will be produced using the same 45-nanometer production process that's used to make Intel's current chip lineup. The upcoming chip will be the heart of a new Intel Centrino platform, codenamed Calpella. As its desktop variant, Clarksfield CPUs will have all the enhancements Nehalem offers, as well as the brand new integrated memory controller all in one package. Clarksfield is also expected to include more advanced power-management features than Intel's current mobile chips.Source: PC World
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10 Comments on Mobile Nehalem Chips Not Expected Until Late 2009?

#1
Wile E
Power User
I hope it gets triple channel support. I bet it would be a benefit to the slow ram notebooks usually get saddled with.
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#2
FordGT90Concept
"I go fast!1!11!1!"
Not many laptops have more than two SO-DIMM slots so I think it is rather unlikely. Still, I hope they make major improvements in regards to power consumption.
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#3
Wile E
Power User
by: FordGT90Concept
Not many laptops have more than two SO-DIMM slots so I think it is rather unlikely. Still, I hope they make major improvements in regards to power consumption.
Well, being a completely new platform, why couldn't they just put 3 slots? Board real estate shouldn't be that critical, considering how much simpler the chipsets will be without the mem controller.
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#4
FordGT90Concept
"I go fast!1!11!1!"
Space, heat, and power. The northbridge may no longer have a memory controller in it but that also means the SO-DIMM slots must be much closer to the processor. They have less flexibility as to where they can put the slots now.
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#5
Wile E
Power User
by: FordGT90Concept
Space, heat, and power. The northbridge may no longer have a memory controller in it but that also means the SO-DIMM slots must be much closer to the processor. They have less flexibility as to where they can put the slots now.
While they may have to be closer to the cpu, there's still no reason not to do it. Just change where you place the cpu. As far as the heat and power argument, it will still be less than today's notebooks.

Time will tell if it's implemented, but I do have to disagree with you on whether or not it's feasible.
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#6
Triprift
Heat will be the big thing always a problem with lappys at the best of times hopefully weel see an improvement.
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#7
FordGT90Concept
"I go fast!1!11!1!"
I didn't say it wasn't feasible, because it is. It is simply unlikely to be used mostly because of space constraints. It is not easy to find a laptop with more than two SO-DIMM slots today.
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#8
Wile E
Power User
by: FordGT90Concept
I didn't say it wasn't feasible, because it is. It is simply unlikely to be used mostly because of space constraints. It is not easy to find a laptop with more than two SO-DIMM slots today.
I know today's don't have it due to space an heat constraints. I just think that maybe these future setups will be more efficient, and allow the ability for manufacturers to include a 3rd slot for a small penalty in space, but a good increase in performance.

Then again, we may have 1.5v 2000Mhz CAS7 DDR3 by then, making a third slot moot. lol.
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#9
FordGT90Concept
"I go fast!1!11!1!"
What they really need to do is replace the SO-DIMM slot architecture with one that is designed for half-height memory chips. That way they could fit three, maybe four slots in the same space; however, the density would go down by about half so you would need to buy multiple sticks to get the same performance. I think this is a possibility if bandwidth becomes a factor and the bandwidth tri-channel offers is required.
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