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Intel's TIM is still worse than affordable TIM

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The only TIM worse than Intel's is one developed by the USSR in 1974




Source - http://www.3dnews.ru/823575
 

fullinfusion

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Really?

How about a post on AS5, MX-4, ICD exc..?

One already knows liquid is better then anything on the market these days lol

Im -out-
 
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The only TIM worse than Intel's is one developed by the USSR in 1974

and chocolate ... don't forget chocolate, rocket... (sorry i just saw the teaser for the film "the defender of the galaxy" ... RR' " )

edit WTH? o_O they use Freemake VC for loading a CPU? i use it everyday ....

sooo Devil Canyon improved new TIM is still worse than my beloved MX-4 (MX-2shown i know) hurray for the SWISS! even Intel can't beat us when it come to the cold (hell my place had snow recently for the 3 last days ... ok a bit higher than where i live but still...)
xKey_visual_Our_History.jpg.pagespeed.ic.MylBzrSN0b.jpg
http://www.arctic.ac/eu_en/our-history/

How about a post on AS5, MX-4, ICD exc..?
MX-4 is above all, AS5 is on par ICD is a metal eater (remember the "scandale" with the rep)

well to be fair i intend to "test" the AS5 the next time i have to order TIM now that my retailer finally list the 3.5g syringe a bit under the price of a 4g MX-4
Liquide Ultra/Pro is good that's a fact but not really practical to use (but once you get used it's still the best yup...)
 
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fullinfusion

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I test all sorta paste on GPU and CPU and AS5 is a waste of time.

ICD yes pits the shit outta the metal and isnt worth a crap IMO.

MX-4?

Yes it's about the best stuff on the market these days.

I agree LU/P is good but not practical as you say.
 
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I test all sorta paste on GPU and CPU and AS5 is a waste of time.

ICD yes pits the shit outta the metal and isnt worth a crap IMO.

MX-4?

Yes it's about the best stuff on the market these days.

I agree LU/P is good but not practical as you say.
sooo i stay with my MX-4

i even tested a GD-Brand silicone-copper TIM, 1$ 1g syringe... dry too fast but not too bad cooling (only a 2WK/m but still) used 2/3 of it for my 2 Opterons 248 and my AXP 2800+ (currently using the pre applied TIM on he H60v2 but once my retailer restock MX-4 back to it!)
 
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I did not read the article as don't speak russian, but from looking at their pictures they tested original TIM and then cleaned the die and reseated with new paste. BUT if you look at 4770k delliding threads, most gains are from lowering the thickness of TIM - you remove the black silicone glue that is about 0,5mm thick.
My point is: its not fair to say intel TIM is crap unless, they can test it in exact conditions.
 
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its not fair to say intel TIM is crap

OK, intel's application of TIM is crap, and they never should have tried to cut costs in the first palce and stuck with solder.
 
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Really?

How about a post on AS5, MX-4, ICD exc..?

One already knows liquid is better then anything on the market these days lol

Im -out-
comparison between different tims. absolut numbers are irrelevant cause cpu is i7 920 but delta temps are completely valid. source (test is LinX 0.6.2)

compare it with delta temps from OP and you will get what you want.
 
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comparison between different tims. absolut numbers are irrelevant cause cpu is i7 920 but delta temps are completely valid. source (test is LinX 0.6.2)

compare it with delta temps from OP and you will get what you want.

dang they should differentiate Arctic (silver/ceramic) and Arctic (formerly Arctic Cooling)
but that chart is really interesting
 
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dang they should differentiate Arctic (silver/ceramic) and Arctic (formerly Arctic Cooling)
differentiate :confused:
thay mention only products not manufacturers except for xerox one cause they dont know what is product name i guess
 
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hm
now i saw where they mixed as and ac.
this ofc doesnt chage test results.
 
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comparison between different tims. absolut numbers are irrelevant cause cpu is i7 920 but delta temps are completely valid. source (test is LinX 0.6.2)

compare it with delta temps from OP and you will get what you want.
what are the values to the "greasing" and "point" values comparing ?
Pea method verse spreading over whole die ?
 
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what are the values to the "greasing" and "point" values comparing ?
Pea method verse spreading over whole die ?

that's what I was wondering
 
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OK, intel's application of TIM is crap, and they never should have tried to cut costs in the first palce and stuck with solder.
They only went with solder because of P4's heat issues, once they fixed that they didn't really need to keep using solder.

But I'll take it a step further and say they never should have tried to cut costs in the first place and never used an IHS. They tried to say the IHS was to help with thermals, but we all know it was really used to prevent people from cracking their dies and trying to RMA the chip.
 
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That would make the most sense, where's the article that goes with the graph?
link is just above the graph but i doubt you can read it.
as for your question yes they compare appliance method. greasing is spreading over die and and dot is "pea method"
 
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link is just above the graph but i doubt you can read it.
as for your question yes they compare appliance method. greasing is spreading over die and and dot is "pea method"

Yeah, I see it now- the link doesn't show up well to begin with. :( And you're right, I don't understand that language.
 
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if you tell me what are you looking for i may try to find and translate info you need or at least summarize it
 
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http://hardwarebg.com/18420-сравнение-на-термопроводими-пасти-1/

Ah, link didn't work , here source link .

here translation to apply method . (it like what neotogadno said )

As already mentioned, the proper placement of the thermally conductive paste is important, therefore, in the tests included two methods of inserting - with a period (one to one and half a rice grain), the processing in the middle of the cap and through the pre-wise thin blur uniformly over the entire surface of the cap. For some of toothpastes have to do more than one placement and installation in order to achieve the best results the temperature, but we'll talk down.
 
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Easy solution is to buy socket 2011 to get the soldered lid. The TIM thing sucks but the 1150 chips are still blindingly fast.
 
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http://hardwarebg.com/18420-сравнение-на-термопроводими-пасти-1/

Ah, link didn't work , here source link .

here translation to apply method . (it like what neotogadno said )

As already mentioned, the proper placement of the thermally conductive paste is important, therefore, in the tests included two methods of inserting - with a period (one to one and half a rice grain), the processing in the middle of the cap and through the pre-wise thin blur uniformly over the entire surface of the cap. For some of toothpastes have to do more than one placement and installation in order to achieve the best results the temperature, but we'll talk down.
try this one http://www.microsofttranslator.com/bv.aspx?from=bg&to=en&a=http://hardwarebg.com/18420-%D1%81%D1%80%D0%B0%D0%B2%D0%BD%D0%B5%D0%BD%D0%B8%D0%B5-%D0%BD%D0%B0-%D1%82%D0%B5%D1%80%D0%BC%D0%BE%D0%BF%D1%80%D0%BE%D0%B2%D0%BE%D0%B4%D0%B8%D0%BC%D0%B8-%D0%BF%D0%B0%D1%81%D1%82%D0%B8-1/

eidt:
read toothpastes as (thermally conductive) pastes
 
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None of these experiments testing the thermal performance have proper scientific controls. They are not controlling for the height of the IHS above the die. When you scrape off all the glue during delidding you move the IHS closer to the die, thus reducing the thickness of the TIM and improving heat transfer. You could put mayonaise between the die and the CPU and it still would look better than Intel's TIM because in the process of delidding you reduced the clearance between the IHS and the die.

I would argue that Intel's TIM is pretty respectable since it is achieving similar performance even in a thicker application. You can legitimately criticize Intel for using TIM instead of solder or for having too large of a gap between the die and the IHS, but you can't legitimately criticize Intel for its TIM composition without a better testing procedure.
 
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