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So, I found the following bit of experimental information:
http://www.news.gatech.edu/2015/10/05/liquid-cooling-moves-chip-denser-electronics
The goal was to improve water cooling technology, and make it more efficient. They took a silicon die, cut micro channels into the back of it, and pumped deionized water through the micro channels.
The result was a 60% performance increase from standard air coolers (though standard water cooling wasn't explored).
Caveat emptor, the technology basically requires that the microchannels never build up sediment (the "large" silicon cylinders inside the channels designed to increase surface area were 100 microns in diameter).
So, anyone else want to start delidding processors, etching channel, and getting that extra performance?
http://www.news.gatech.edu/2015/10/05/liquid-cooling-moves-chip-denser-electronics
The goal was to improve water cooling technology, and make it more efficient. They took a silicon die, cut micro channels into the back of it, and pumped deionized water through the micro channels.
The result was a 60% performance increase from standard air coolers (though standard water cooling wasn't explored).
Caveat emptor, the technology basically requires that the microchannels never build up sediment (the "large" silicon cylinders inside the channels designed to increase surface area were 100 microns in diameter).
So, anyone else want to start delidding processors, etching channel, and getting that extra performance?