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Originally Posted by Steven B
how? By increasing the processing back to 32 or 45nm? lol or adding more transistors?
Lol they can increase temperature performance by simply making CPU and IHS contact more optimal.
ANyways I think this press release has to be the funniest of all time, i love how they say he was on top of the boards for 18 months straight, and he only OCed for 2 years. But what I like more is how they call OC an experiment, and how they call his scores a miracle hahahaha. Oh man they should have a USA marketing office re-write this for the US. It is a nic score tho, he worked really hard, but i don't think asrock motherboards are industry leading record breaking.
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I might be mistaking alot here... But strongly doubt that the DIE is single layer...
It would be dead thin if it was, and well, a DIE isnt..
So, half the layer, and surface area will almost double.