According to AMD senior VP and CTO Mark Papermaster, the company will adopt the 28 nanometer bulk CMOS silicon fabrication process for its chips in 2013. The bulk process is used to manufacture high-volume and less-complex products, such as motherboard chipset, entry-level APUs, etc. The company already takes advantage of TSMC 28 nm High-Performance process for highly-complex chip designs, such as its Southern Islands GPU family, and will continue using it for its next-generation "Sea Islands" GPUs. In related news, DigiTimes learned through sources that AMD's Sea Islands GPUs have entered tape-out stage, and are on course for a late-2012 volume manufacturing, and early-2013 launch schedule.
Source: DigiTimes