techPowerUp! Forums - View Single Post - Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition

farlex85 · May 6, 2008, 02:11 AM

Bigger wafers and smaller dies mean more cores per wafer I would assume. The die size will be down to 22nm by 2012, so they must be moving towards lots of specialized cores or something.

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May 6, 2008, 02:11 AM	#10
farlex85 Join Date: Mar 2007 Posts: 4,114 (1.83/day) Thanks: 369 Thanked 647 Times in 612 Posts System Specs	Bigger wafers and smaller dies mean more cores per wafer I would assume. The die size will be down to 22nm by 2012, so they must be moving towards lots of specialized cores or something.