Originally Posted by Darknova
The contact points break because they aren't strong enough to cope with the heat given out, and neither is the board. It's a bit of both really. The board does warp because of the heat, and the BGA contact points break because of the board warping because they wern't designed well enough.
Thing is, if they'd designed it well, then no matter the heat, we wouldn't have this issue.
part of the PCB is supposed to dissipate heat, thats what its there for beyond being a point for circuit leads to be strewn through. With the XB360 already 3 years old, its useless to release a new version when that console wont live past 2011.