Mobile Nehalem Chips Not Expected Until Late 2009?

malware · Oct 21, 2008, 06:11 AM

Intel Clarksfield, the company's Nehalem based mobile platform, was reported on Monday to begin production in the second half of 2009. Although mass production of the first Core i7 processors is scheduled for next month, on the mobile front Intel users will have to wait until late next year. Clarksfield will be produced using the same 45-nanometer production process that's used to make Intel's current chip lineup. The upcoming chip will be the heart of a new Intel Centrino platform, codenamed Calpella. As its desktop variant, Clarksfield CPUs will have all the enhancements Nehalem offers, as well as the brand new integrated memory controller all in one package. Clarksfield is also expected to include more advanced power-management features than Intel's current mobile chips.

Source: PC World

Wile E · Oct 21, 2008, 08:03 AM

I hope it gets triple channel support. I bet it would be a benefit to the slow ram notebooks usually get saddled with.

FordGT90Concept · Oct 21, 2008, 08:09 AM

Not many laptops have more than two SO-DIMM slots so I think it is rather unlikely. Still, I hope they make major improvements in regards to power consumption.

Wile E · Oct 21, 2008, 08:32 AM

Quote:

Originally Posted by FordGT90Concept

Not many laptops have more than two SO-DIMM slots so I think it is rather unlikely. Still, I hope they make major improvements in regards to power consumption.

Well, being a completely new platform, why couldn't they just put 3 slots? Board real estate shouldn't be that critical, considering how much simpler the chipsets will be without the mem controller.

FordGT90Concept · Oct 21, 2008, 08:38 AM

Space, heat, and power. The northbridge may no longer have a memory controller in it but that also means the SO-DIMM slots must be much closer to the processor. They have less flexibility as to where they can put the slots now.

Wile E · Oct 21, 2008, 08:44 AM

Quote:

Originally Posted by FordGT90Concept

Space, heat, and power. The northbridge may no longer have a memory controller in it but that also means the SO-DIMM slots must be much closer to the processor. They have less flexibility as to where they can put the slots now.

While they may have to be closer to the cpu, there's still no reason not to do it. Just change where you place the cpu. As far as the heat and power argument, it will still be less than today's notebooks.

Time will tell if it's implemented, but I do have to disagree with you on whether or not it's feasible.

Triprift · Oct 21, 2008, 08:50 AM

Heat will be the big thing always a problem with lappys at the best of times hopefully weel see an improvement.

FordGT90Concept · Oct 21, 2008, 08:51 AM

I didn't say it wasn't feasible, because it is. It is simply unlikely to be used mostly because of space constraints. It is not easy to find a laptop with more than two SO-DIMM slots today.

Wile E · Oct 21, 2008, 08:55 AM

Quote:

Originally Posted by FordGT90Concept

I didn't say it wasn't feasible, because it is. It is simply unlikely to be used mostly because of space constraints. It is not easy to find a laptop with more than two SO-DIMM slots today.

I know today's don't have it due to space an heat constraints. I just think that maybe these future setups will be more efficient, and allow the ability for manufacturers to include a 3rd slot for a small penalty in space, but a good increase in performance.

Then again, we may have 1.5v 2000Mhz CAS7 DDR3 by then, making a third slot moot. lol.

FordGT90Concept · Oct 21, 2008, 09:01 AM

What they really need to do is replace the SO-DIMM slot architecture with one that is designed for half-height memory chips. That way they could fit three, maybe four slots in the same space; however, the density would go down by about half so you would need to buy multiple sticks to get the same performance. I think this is a possibility if bandwidth becomes a factor and the bandwidth tri-channel offers is required.

Hayder_Master · Oct 21, 2008, 11:44 AM

i can't say until i see

Oct 21, 2008, 06:11 AM	#1
malware Eligible for custom title Join Date: Nov 2004 Location: Bulgaria Posts: 5,413 (1.74/day) Thanks: 78 Thanked 986 Times in 497 Posts System Specs	Mobile Nehalem Chips Not Expected Until Late 2009? Intel Clarksfield, the company's Nehalem based mobile platform, was reported on Monday to begin production in the second half of 2009. Although mass production of the first Core i7 processors is scheduled for next month, on the mobile front Intel users will have to wait until late next year. Clarksfield will be produced using the same 45-nanometer production process that's used to make Intel's current chip lineup. The upcoming chip will be the heart of a new Intel Centrino platform, codenamed Calpella. As its desktop variant, Clarksfield CPUs will have all the enhancements Nehalem offers, as well as the brand new integrated memory controller all in one package. Clarksfield is also expected to include more advanced power-management features than Intel's current mobile chips. Source: PC World

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Oct 21, 2008, 08:03 AM	#2
Wile E Power User Join Date: Oct 2006 Location: Western PA (Pittsburgh suburbs) Posts: 18,129 (7.47/day) Thanks: 450 Thanked 3,826 Times in 3,124 Posts System Specs	I hope it gets triple channel support. I bet it would be a benefit to the slow ram notebooks usually get saddled with. __________________ Visit Ashentech “What the hell did you expect? Leave Vista under the pillow and the OS fairy would make it Win7?” -El Fiendo “And Bring Mailman back god damnit, he is the Eric Cartman of TPU” -MRCL

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Oct 21, 2008, 08:09 AM	#3
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Oct 21, 2008, 08:38 AM	#5
FordGT90Concept "I go fast!1!11!1!" Join Date: Oct 2008 Location: IA, USA Posts: 10,577 (6.28/day) Thanks: 1,755 Thanked 2,596 Times in 1,960 Posts System Specs	Space, heat, and power. The northbridge may no longer have a memory controller in it but that also means the SO-DIMM slots must be much closer to the processor. They have less flexibility as to where they can put the slots now. __________________ Golden Rule of Programming: Never assume. try { SteamDownload(); } catch (Steamception ex) { RageQuit(); }

Oct 21, 2008, 08:50 AM	#7
Triprift Join Date: Dec 2007 Location: Adelaide Australia Posts: 4,258 (2.14/day) Thanks: 520 Thanked 946 Times in 787 Posts System Specs	Heat will be the big thing always a problem with lappys at the best of times hopefully weel see an improvement. __________________ Welcome to the lost chicken helpline if you have lost your chicken press 1, if you have found a lost chicken press 2, if you would like to adopt a chicken press 3, if you would like to sponsor a chicken press 4 for all other enquiries press 5 Graphic Artists United™ Solaris utility DVD 4.0 ---General nonsense 2.0--- How to post pics at TPU

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Oct 21, 2008, 08:51 AM	#8
FordGT90Concept "I go fast!1!11!1!" Join Date: Oct 2008 Location: IA, USA Posts: 10,577 (6.28/day) Thanks: 1,755 Thanked 2,596 Times in 1,960 Posts System Specs	I didn't say it wasn't feasible, because it is. It is simply unlikely to be used mostly because of space constraints. It is not easy to find a laptop with more than two SO-DIMM slots today. __________________ Golden Rule of Programming: Never assume. try { SteamDownload(); } catch (Steamception ex) { RageQuit(); }

Oct 21, 2008, 09:01 AM	#10
FordGT90Concept "I go fast!1!11!1!" Join Date: Oct 2008 Location: IA, USA Posts: 10,577 (6.28/day) Thanks: 1,755 Thanked 2,596 Times in 1,960 Posts System Specs	What they really need to do is replace the SO-DIMM slot architecture with one that is designed for half-height memory chips. That way they could fit three, maybe four slots in the same space; however, the density would go down by about half so you would need to buy multiple sticks to get the same performance. I think this is a possibility if bandwidth becomes a factor and the bandwidth tri-channel offers is required. __________________ Golden Rule of Programming: Never assume. try { SteamDownload(); } catch (Steamception ex) { RageQuit(); }

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