A-DATA Presenting its Latest XPG DRAM Modules at Computex 2009

alexp999 · May 25, 2009, 08:17 AM

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting its entire XPG - Xtreme Performance Gear product line and latest XPG Series DRAM modules with superior conductive technology in Nangang Exhibition Hall during Computex Taipei 2009.

As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009.

Adopting new dual copper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design.
Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module.

A-DATA is also presenting its new XPG SX94 2.5” SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability.

For more information about the latest XPG series products, please visit A-DATA booth at Computex 2009.

Date: June 2, 2009 - June 6, 2009
Place: Taipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei City)
Booth No: J818, J824, J1017, J1023

Arrakis+9 · May 25, 2009, 12:57 PM

Quote:

Originally Posted by alexp999

Adopting new dual cooper heat pipe design,

i think you mean copper

either way it is nice looking ram, reminds me of ocz's reaper X

DaC · May 25, 2009, 01:23 PM

Corsair dominator also..

alexp999 · May 25, 2009, 01:46 PM

Quote:

Originally Posted by Arrakis+9

i think you mean copper

either way it is nice looking ram, reminds me of ocz's reaper X

Stupid Press Release, fixed thanks

h3llb3nd4 · May 25, 2009, 03:04 PM

LOL, I sense copy & paste

alexp999 · May 25, 2009, 04:04 PM

Quote:

Originally Posted by h3llb3nd4

LOL, I sense copy & paste

Thats all press releases ever are, copy, paste, remove tm/c/r fix any typos (which i missed this time), post.

DanishDevil · May 25, 2009, 05:49 PM

I've gotta say, those red and black heatsinks are sexy. Let's hope they perform as well as they look!

Kitkat · May 25, 2009, 06:09 PM

Quote:

Originally Posted by DanishDevil

I've gotta say, those red and black heatsinks are sexy. Let's hope they perform as well as they look!

Yeah they showed up and got best dressed for sure.

HellasVagabond · May 25, 2009, 07:32 PM

The XPG Plus run at 1866MHz but they should easily reach 2GHz.

Hayder_Master · May 26, 2009, 06:48 AM

DDR3-2133X , what about latency

May 25, 2009, 08:17 AM	#1
alexp999 Staff Join Date: Jul 2007 Location: Dorset, UK Posts: 6,728 (3.17/day) Thanks: 684 Thanked 915 Times in 783 Posts System Specs	A-DATA Presenting its Latest XPG DRAM Modules at Computex 2009 A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting its entire XPG - Xtreme Performance Gear product line and latest XPG Series DRAM modules with superior conductive technology in Nangang Exhibition Hall during Computex Taipei 2009. As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009. Adopting new dual copper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design. Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module. A-DATA is also presenting its new XPG SX94 2.5” SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability. For more information about the latest XPG series products, please visit A-DATA booth at Computex 2009. Date: June 2, 2009 - June 6, 2009 Place: Taipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei City) Booth No: J818, J824, J1017, J1023 Last edited by alexp999; May 25, 2009 at 01:45 PM.

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May 25, 2009, 01:23 PM	#3
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May 25, 2009, 03:04 PM	#5
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May 25, 2009, 05:49 PM	#7
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May 25, 2009, 07:32 PM	#9
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May 26, 2009, 06:48 AM	#10
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