IBM developing more efficient way to transfer heat away from the processor

zekrahminator · Oct 29, 2006, 04:38 PM

Most of the time, when people see cuts or grooves in their heatsinks or Integrated Heat Spreader (IHS), they think that it will really reduce thermal transfer. However, IBM is working on a technology that actually uses those grooves, and organizes them into a system of canals. By carving these canals into the IHS of a processor, or a heatsink, IBM actually increases the efficiency of thermal paste. The technology is still in prototype stage.

Source: The Register

Oct 29, 2006, 04:40 PM

Oh.

xylomn · Oct 29, 2006, 04:42 PM

i'll believe it when i see actual results

Jimmy 2004 · Oct 29, 2006, 04:57 PM

Probably nothing huge I'd expect, but we'll see. IBM have done good stuff in the past (obviously

).

spectre440 · Oct 29, 2006, 05:04 PM

Quote:

Originally Posted by xylomn

i'll believe it when i see actual results

agreed.

tigger · Oct 29, 2006, 05:13 PM

thats it,i'm slicing up my ihs.

xylomn · Oct 29, 2006, 05:14 PM

Quote:

Originally Posted by tigger69

thats it,i'm slicing up my ihs.

shall i start dialing 999 now?

tigger · Oct 29, 2006, 05:15 PM

nah,it aint got no rights man.

DanTheBanjoman · Oct 29, 2006, 05:17 PM

Quote:

Originally Posted by Jimmy 2004

Probably nothing huge I'd expect, but we'll see. IBM have done good stuff in the past (obviously

).

They still do, they request and get the most patents per year.

xylomn · Oct 29, 2006, 05:17 PM

Quote:

Originally Posted by tigger69

nah,it aint got no rights man.

i meant for yourself when you put in your pc and blow yourself up

cdawall · Oct 29, 2006, 06:20 PM

thats nice so ibm is making a way to cool down there chips since they happen to be some of the hottest runnning since prescott problem meet solved

EastCoasthandle · Oct 29, 2006, 07:29 PM

Hmm, i found that a smooth IHS yielded the lowest cpu temps vs. ihs with grooves or unfinished ihs.

Agility · Oct 29, 2006, 07:30 PM

Wow i'm going to cut my IHS into bits and pieces like those 1MM sizes. Weeeeee.

pt · Oct 29, 2006, 07:55 PM

time to start cut my IHS

*gone look for a chainsaw*

xylomn · Oct 29, 2006, 08:01 PM

Quote:

Originally Posted by pt

time to start cut my IHS

*gone look for a chainsaw*

chainsaw

pt · Oct 29, 2006, 08:33 PM

Quote:

Originally Posted by xylomn

chainsaw

too powerfull?

RaDaR · Oct 29, 2006, 09:22 PM

Make sense to me

infrared · Oct 29, 2006, 10:34 PM

Copper conducts heat far better than thermal grease, i don't see how cutting groves in the copper is going to help.

KennyT772 · Oct 30, 2006, 02:21 AM

i think it is to reduce the amount of thermal paste between the highpoints on the ihs and the cooler. that way if too much tim is used it will be squished into the channels and wont interfear with the heat transfer.

kakazza · Oct 30, 2006, 06:28 AM

More area = More heat can be transfered. The same way heaters work, just that his is for cooling ;p

So if there is more area on the IHS it can transport more heat to the copper cooler. And yes I think this will work. Not like -20°C but it will give some advantage.
Why? a) IBM scientists better know what they are doing, b) the 'more area = more heat dispense' has been used for decades anywhere where heat dispension is important.

infrared · Oct 30, 2006, 07:26 AM

I think kenny's got it figured. Nice thinking mate

Oct 30, 2006, 09:40 AM

Quote:

Originally Posted by xylomn

i'll believe it when i see actual results

Actually when you look at it on a molecular level yes, because they are removing a little bit they increase the surface area, and since it doesnt require a thicker layer of thermal paste, it will increase thermal transfer.

__________________ vs. ~~~~~~~~~~~~~~

Thats how it prob is

My way is right.

olstyle · Oct 30, 2006, 11:16 AM

In some test of an Arctic Cooling CPU-cooler it was said that in its manual Arctic says they use the same method on the bottom of this Cooler.

Firedomain · Oct 30, 2006, 12:22 PM

well i guess it'd make more surface area between the thermal paste & IHS.....
but wouldn't it also make more air pockets?

We'll see what they manage to do with it!

Jimmy 2004 · Oct 30, 2006, 02:05 PM

Probably no air pockets if it's applied correctly.

Oct 29, 2006, 04:38 PM	#1
zekrahminator McLovin Join Date: Jan 2006 Location: My house. Posts: 6,280 (2.35/day) Thanks: 105 Thanked 340 Times in 246 Posts System Specs	IBM developing more efficient way to transfer heat away from the processor Most of the time, when people see cuts or grooves in their heatsinks or Integrated Heat Spreader (IHS), they think that it will really reduce thermal transfer. However, IBM is working on a technology that actually uses those grooves, and organizes them into a system of canals. By carving these canals into the IHS of a processor, or a heatsink, IBM actually increases the efficiency of thermal paste. The technology is still in prototype stage. Source: The Register

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Oct 29, 2006, 04:42 PM	#3
xylomn Join Date: May 2006 Location: Swindon, England, United Kingdom Posts: 538 (0.21/day) Thanks: 4 Thanked 18 Times in 17 Posts System Specs	i'll believe it when i see actual results __________________ Bsc(Hons) Computer Science Software Engineering MSc(Hons) Computer Game Engineering

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Oct 29, 2006, 04:40 PM	#2
v-zero Guest Posts: n/a (0/day)	Oh.

Oct 29, 2006, 04:57 PM	#4
Jimmy 2004 Eligible for custom title Join Date: Jan 2005 Location: England Posts: 5,047 (1.66/day) Thanks: 134 Thanked 276 Times in 185 Posts System Specs	Probably nothing huge I'd expect, but we'll see. IBM have done good stuff in the past (obviously ).

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Oct 29, 2006, 05:13 PM	#6
tigger I'm the only one Join Date: Mar 2006 Location: HU5 1LL Posts: 7,194 (2.75/day) Thanks: 469 Thanked 942 Times in 775 Posts System Specs	thats it,i'm slicing up my ihs.

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Oct 29, 2006, 05:15 PM	#8
tigger I'm the only one Join Date: Mar 2006 Location: HU5 1LL Posts: 7,194 (2.75/day) Thanks: 469 Thanked 942 Times in 775 Posts System Specs	nah,it aint got no rights man.

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Oct 29, 2006, 06:20 PM	#11
cdawall where the hell are my stars Join Date: Jul 2006 Location: some AF base Posts: 16,021 (6.43/day) Thanks: 457 Thanked 2,753 Times in 2,222 Posts System Specs	thats nice so ibm is making a way to cool down there chips since they happen to be some of the hottest runnning since prescott problem meet solved __________________

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Oct 29, 2006, 07:29 PM	#12
EastCoasthandle Eligible for custom title Join Date: Apr 2005 Posts: 6,244 (2.12/day) Thanks: 382 Thanked 1,526 Times in 865 Posts System Specs	Hmm, i found that a smooth IHS yielded the lowest cpu temps vs. ihs with grooves or unfinished ihs.

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Oct 29, 2006, 07:30 PM	#13
Agility Join Date: Jun 2005 Location: Singapore Posts: 1,382 (0.48/day) Thanks: 38 Thanked 45 Times in 44 Posts System Specs	Wow i'm going to cut my IHS into bits and pieces like those 1MM sizes. Weeeeee. __________________ “If you don't like the 2900, that's fine, but quit coming into every 2900 thread you see, just to downtalk it. That's called trolling.”

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Oct 29, 2006, 07:55 PM	#14
pt not a suicide-bomber Join Date: Mar 2006 Location: Portugal Posts: 5,877 (2.24/day) Thanks: 106 Thanked 219 Times in 193 Posts System Specs	time to start cut my IHS gone look for a chainsaw __________________ [img disabled]http://apax.eveonlinekb.com/?a=sig&i=39051&s=zealot[/img]

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Oct 29, 2006, 09:22 PM	#17
RaDaR Join Date: Mar 2006 Posts: 8 (0.00/day) Thanks: 1 Thanked 1 Time in 1 Post System Specs	Make sense to me

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Oct 29, 2006, 10:34 PM	#18
infrared Join Date: May 2005 Location: Southampton, UK Posts: 2,878 (0.99/day) Thanks: 233 Thanked 185 Times in 156 Posts System Specs	Copper conducts heat far better than thermal grease, i don't see how cutting groves in the copper is going to help. __________________ I don't suffer from insanity - I enjoy every minute of it!

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Oct 30, 2006, 02:21 AM	#19
KennyT772 Join Date: Dec 2005 Posts: 2,933 (1.08/day) Thanks: 19 Thanked 103 Times in 98 Posts System Specs	i think it is to reduce the amount of thermal paste between the highpoints on the ihs and the cooler. that way if too much tim is used it will be squished into the channels and wont interfear with the heat transfer. __________________ Xfire Heatware

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Oct 30, 2006, 06:28 AM	#20
kakazza Join Date: Aug 2006 Posts: 470 (0.19/day) Thanks: 3 Thanked 7 Times in 5 Posts	More area = More heat can be transfered. The same way heaters work, just that his is for cooling ;p So if there is more area on the IHS it can transport more heat to the copper cooler. And yes I think this will work. Not like -20°C but it will give some advantage. Why? a) IBM scientists better know what they are doing, b) the 'more area = more heat dispense' has been used for decades anywhere where heat dispension is important.

Oct 30, 2006, 07:26 AM	#21
infrared Join Date: May 2005 Location: Southampton, UK Posts: 2,878 (0.99/day) Thanks: 233 Thanked 185 Times in 156 Posts System Specs	I think kenny's got it figured. Nice thinking mate __________________ I don't suffer from insanity - I enjoy every minute of it!

Oct 30, 2006, 11:16 AM	#23
olstyle Join Date: May 2006 Posts: 69 (0.03/day) Thanks: 7 Thanked 10 Times in 9 Posts	In some test of an Arctic Cooling CPU-cooler it was said that in its manual Arctic says they use the same method on the bottom of this Cooler.

Oct 30, 2006, 12:22 PM	#24
Firedomain Join Date: Oct 2006 Location: Adelaide, SA, Aussie! Posts: 353 (0.15/day) Thanks: 33 Thanked 16 Times in 15 Posts System Specs	well i guess it'd make more surface area between the thermal paste & IHS..... but wouldn't it also make more air pockets? We'll see what they manage to do with it!

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Oct 30, 2006, 02:05 PM	#25
Jimmy 2004 Eligible for custom title Join Date: Jan 2005 Location: England Posts: 5,047 (1.66/day) Thanks: 134 Thanked 276 Times in 185 Posts System Specs	Probably no air pockets if it's applied correctly.

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