stinger608
Dedicated TPU Cruncher & Folder
- Joined
- Nov 11, 2008
- Messages
- 11,115 (1.97/day)
- Location
- Wyoming
System Name | Dean Machine/2020 Ryzenfall |
---|---|
Processor | Intel 4790K/AMD Ryzen 3700X |
Motherboard | MSI 1150 Gaming mATX/Gigabyte AORUS ELITE B550 |
Cooling | Cooler Master Hyper 212 LED/SilverStone AH240 AIO |
Memory | 16 gigs Crucial Ballistix Tactical Tracer/16 gigs G.Skill TridentZ NEO DDR4 |
Video Card(s) | Gigabyte 1660 Super/Gigabyte GTX 1660 |
Storage | Crucial SSD 256 and 2TB spinner/Dual Samsung 980 Pro M2 NVME 4.0 |
Display(s) | Overlord 27" 2560 x 1440 |
Case | Corsair Air 540 |
Audio Device(s) | On board |
Power Supply | Seasonic modular 850 watt Platinum/EVGA T2-850 Titanium |
Software | Windows 10 Pro/Windows 10 Pro |
As all the reports are stating, the new Intel Ivy Bridge seems to be running much hotter than the Sandy Bridge generation. As the reports keep flooding in, Overclockers.com have seemed to figure out why!
Is it the 22nm design? Nope Here is the simple report from Overclockers.com.
Now this is interesting to say the least. Maybe this is just a hype from a website wanting to get there name in the lime light?
Not according to Overclockers.com.
Is it the 22nm design? Nope Here is the simple report from Overclockers.com.
Overclockers.com said:So why is Ivy Bridge hot?
Intel is using TIM paste between the Integrated Heat Spreader (IHS) and the CPU die on Ivy Bridge chips, instead of fluxless solder.
Now this is interesting to say the least. Maybe this is just a hype from a website wanting to get there name in the lime light?
Not according to Overclockers.com.
Overclockers.com said:In light of this contrast, we can gain further insight as well from what history has taught us. If you’ve been paying attention, we saw similar issues between the E6XXX and E4XXX processor lines. The E6XXX used a solder attach under the IHS and were far easier to keep cool. The E4XXX used a TIM paste under the IHS and ran hot!