techPowerUp! Forums

Go Back   techPowerUp! Forums > www.techpowerup.com > News

Reply
 
Thread Tools
Old May 4, 2012, 07:10 AM   #1
Cristian_25H
Staff
 
Cristian_25H's Avatar
 
Join Date: Dec 2011
Location: Still on the East Side
Posts: 41 (0.07/day)
Thanks: 9
Thanked 977 Times in 489 Posts

VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.





In addition, with the VIA COMe-8X91 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.

"The COM Express Mini form factor provides embedded customers the ideal platform for creating highly tailored solutions where real estate is at a premium," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA COMe-8X91 delivers an extremely ruggedized, power efficient solution for the creation of ultra compact embedded devices with a short time to market approach."

VIA COMe-8X91 Module

Available in the industry standard COM Express Mini form factor of 84 mm x 55 mm, the VIA COMe-8X91 module pairs an 800 MHz VIA Eden X2 dual core processor and the VIA VX900 MSP for a low power, high performance platform. The VIA COMe-8X91 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS and either one Displayport or one HDMI port (without HDCP).

Onboard I/O includes two SATA II ports, one GigaLAN port, eight USB 2.0 ports shared with one USB client port, one HD audio digital interface and two serial ports. System memory includes 1 GB of onboard DDR3.

For more information about the VIA COMe-8X91 module please visit:
http://www.viaembedded.com/en/produc...id=1710&tabs=1
Cristian_25H is offline  
Reply With Quote
Reply


Currently Active Users Viewing This Thread: 1 (0 members and 1 guests)
 
Thread Tools

Posting Rules
You may not post new threads
You may not post replies
You may not post attachments
You may not edit your posts

BB code is On
Smilies are On
[IMG] code is On
HTML code is On

Forum Jump

Similar Threads
Thread Thread Starter Forum Replies Last Post
VIA Announces New System-on-Module Solutions btarunr News 2 Mar 23, 2012 08:35 PM
VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90 Cristian_25H News 4 Feb 25, 2012 10:06 AM
VIA Announces First Nano-ITX Board with VIA VX800 btarunr News 4 Aug 16, 2008 07:00 AM
VIA Announces the VIA PT890 Intel Chipset for Windows Vista malware News 0 Apr 6, 2006 07:58 PM
VIA Announces CN700 IGP Chipset for the VIA C7™ Processor Darksaber News 0 Dec 12, 2005 07:41 PM


All times are GMT. The time now is 10:52 PM.


Powered by vBulletin® Version 3.8.6
Copyright ©2000 - 2013, Jelsoft Enterprises Ltd.
no new posts