Report: Microsoft Prepares to Release the 65nm Xbox 360 ''Jasper'' Consoles in August

[malware]

The China Economic News Service reported today that Microsoft has assigned Taiwan Semiconductor Manufacturing (TSMC), Advanced Semiconductor Engineering (ASE) and Nanya PCB to manufacture, test and package the latest version of Xbox 360, codenamed "Jasper". TSMC will build ATI Xenos graphics and memory controller hub (GMCH) for the new Jasper console, using 65nm process. ASE was contracted to package and test the two chips, while Nanya has won orders to supply flip-chip packaging substrates, reports CENS.com. Current Xbox 360 consoles named Falcon utilize GMCH and eDRAM cores manufactured using 90nm process technology at TSMC as well as CPU built at IBM using 65nm fabrication process. The new Jasper Xbox 360s are projected to consume less electricity, use less complex cooling systems and logically produce less noise. In addition the revised consoles will fix the so-called "red ring of death" issue that plagued many Falcon systems. Microsoft will reportedly make available the Jasper version of XBox 360 game console in August this year.

Source: CENS.com, X-bit labs

[Darknova]

They wouldn't have the issue if they produced a better way of securing the heatsinks.

[lemonadesoda]

Action too late. Press release indicating that the red ring of dead is fixed in the future by the not yet implemented 65nm FAB process, is just awfully poor PR. Basically it's an admission that it is still a problem and still occuring.

PR department should fall on swords immediately.

X360 team should have gone back to OEMs much earlier and demanded die-shrink. It's kind of too late. The X360 brand is already spoiled, and a die shrink without NEW FEATURES to excite the consumer is another missed opportunity.

Marketing department should fall on swords immediately.

[freaksavior]

give me a blu ray drive and i will be happy.

[Ravenas]

This thread should have been dated 05-08-2007

[nflesher87]

Originally Posted by lemonadesoda

Action too late. Press release indicating that the red ring of dead is fixed in the future by the not yet implemented 65nm FAB process, is just awfully poor PR. Basically it's an admission that it is still a problem and still occuring.

PR department should fall on swords immediately.

X360 team should have gone back to OEMs much earlier and demanded die-shrink. It's kind of too late. The X360 brand is already spoiled, and a die shrink without NEW FEATURES to excite the consumer is another missed opportunity.

Marketing department should fall on swords immediately.

gotta agree with you on a lot of those points

heck, I'd like to find out what percentage of 360 owners even know what size die the Falcon models are, let alone what a die shrink is or does

[kylew]

Originally Posted by Darknova

They wouldn't have the issue if they produced a better way of securing the heatsinks.

I thought it was down to the motherboard warping, and breaking the BGA contact points between chips and the board? Or was it the heatsink causing the board to warp due to heat?

[kylew]

Looks like I'm gonna wait till August to get a 360 then, I've been thinking about getting one very soon, may aswell wait if it sorts the ring of death problems.

[Darknova]

Originally Posted by kylew

I thought it was down to the motherboard warping, and breaking the BGA contact points between chips and the board? Or was it the heatsink causing the board to warp due to heat?

The contact points break because they aren't strong enough to cope with the heat given out, and neither is the board. It's a bit of both really. The board does warp because of the heat, and the BGA contact points break because of the board warping because they wern't designed well enough.

Thing is, if they'd designed it well, then no matter the heat, we wouldn't have this issue.

[PVTCaboose1337]

From what I understand... (just made this image)

[eidairaman1]

Originally Posted by Darknova

The contact points break because they aren't strong enough to cope with the heat given out, and neither is the board. It's a bit of both really. The board does warp because of the heat, and the BGA contact points break because of the board warping because they wern't designed well enough.

Thing is, if they'd designed it well, then no matter the heat, we wouldn't have this issue.

part of the PCB is supposed to dissipate heat, thats what its there for beyond being a point for circuit leads to be strewn through. With the XB360 already 3 years old, its useless to release a new version when that console wont live past 2011.

[lemonadesoda]

Originally Posted by PVTCaboose1337

Grammar nazi! SHOOT!

(ask questions later)

[Millenia]

I'll prolly get one when these come out, the newest console I have is the age-old Xbox D:

[candle_86]

lol yours is newer than mine, mine is a Dreamcast, just took my 360 to wal-mart to get my money back, cause i got the rrd and i didnt wanna deal with it anymore

[Para_Franck]

Personnaly, I 'am not sure wath I prefer yet. I have the original XBOX and I loved it. Just put de disc in and play, no hassle. PC, on the other hand, You have to check for patches, compatibility issues, driver updates, it's a lot more $$, but damn the graphics are nice!!! I love to play with game pad, and Xbox'S i the ones I prefer! But PC games often don't support then *Half life2* *BF2*. People think I am crazy to prefer a game pad over the keyboard/mouse combo. Well just blame HALO for that.

Those new consoles are sweet, but I figure next Gen will be even better, with integrated PhysiX engines, multi GPU (let's no forget that ATI has a strong hold on the console market) and even better performing multi-core CPU (Die shrink and all), full HD capabilites with 7.1 sound, heck why not even implement a sort of operating system from wich you could access applications... SWEET and you know it will be available in not so long anyways. Let's name this thing, The all in one ultimate living quarters entertainment box.

Franck

[Xolair]

Hmm, thought they had gotten rid of the RRoD problems already with the Falcon-XBOX 360's... but apparently not.

One question; are the RRoD issues severe with the current Falcon models, as severe as they seemed to be on the time of release for the X360? Or should I just wait 'til August to get the console? Will it be a big-enough of a difference between the Jasper version and the current?

[Darknova]

Originally Posted by Xolair

Hmm, thought they had gotten rid of the RRoD problems already with the Falcon-XBOX 360's... but apparently not.

One question; are the RRoD issues severe with the current Falcon models, as severe as they seemed to be on the time of release for the X360? Or should I just wait 'til August to get the console? Will it be a big-enough of a difference between the Jasper version and the current?

The RROD is still there, but not as frequent on the Falcon models.

And it really depends on how quickly you want to get your hands on one. You're covered by a 3 year warranty against RROD, yes it takes 2-3 weeks for repair, but better than waiting 3-4 months for the new ones to come out wouldn't you say?

[eidairaman1]

other drawback is some models are having Optical Drive Detection Problems, like the PS2 did, doesnt matter if the drive is clean or disks are in good condition the drive wont read them.

[commandercup]

man, I wish M$ would offer free replacements

my 360 is on my desk next to my monitor and its deafening...

[Xolair]

Originally Posted by Darknova

The RROD is still there, but not as frequent on the Falcon models.

And it really depends on how quickly you want to get your hands on one. You're covered by a 3 year warranty against RROD, yes it takes 2-3 weeks for repair, but better than waiting 3-4 months for the new ones to come out wouldn't you say?

Yeah... and if my console went broken eventually, they COULD change it for a Jasper version, but not guaranteed. I'll rather get the console soon, than wait for the new model. Guess my current computer already sounds like a lawn-mower, so the X360 (Falcon) wouldn't be a problem with its noise. I hope. Just that the RRoD wouldn't trouble me.

[Darknova]

Originally Posted by Xolair

Yeah... and if my console went broken eventually, they COULD change it for a Jasper version, but not guaranteed. I'll rather get the console soon, than wait for the new model. Guess my current computer already sounds like a lawn-mower, so the X360 (Falcon) wouldn't be a problem with its noise. I hope. Just that the RRoD wouldn't trouble me.

Well, if it does break, they either fix the heatsinks so you get the same one back, or they replace the motherboard if the damage is bad enough, so you could get a Jasper, however, my 360 falcon is coming up to 6 months and I've not had an issues. The RROD rate for the Falcons is 16% compared to 33% for the originals

[Xolair]

^ Ok... I'll buy my console in early June probably, hopefully it wouldn't fail me. Doubt it's worth to wait 'til August, or then I'm just burning up from not getting to play GTA 4 unlike many people. OR I'm a very unpatient person.

[Darknova]

Originally Posted by Xolair

^ Ok... I'll buy my console in early June probably, hopefully it wouldn't fail me. Doubt it's worth to wait 'til August, or then I'm just burning up from not getting to play GTA 4 unlike many people. OR I'm a very unpatient person.

I'm very impatient...bought GTA 4 on release day (15 min before we opened for business :P) and to be honest. I've hardly played it...

[Solaris17]

i dont get it..seems to me problems will be exactly the same for the 360.....they said the 65nm process will reduce heat and as such thay can reduce noise....in my mind that measn putting


A: a cheaper fan on it

or

B: making it spool slower


in which case either a or b the xbox will still get 2 hot because their going to cut cooling for less noise and their simply assuming the 65nm will bleed less heat but thats not true if they slow the fan down..


i think they should


A: leave the current loud ass fan in their but make the HS have a copper core like the P4 days

B: have a copper core cooler and just put a nice quite high cfm fan in their

[Darknova]

Originally Posted by Solaris17

i dont get it..seems to me problems will be exactly the same for the 360.....they said the 65nm process will reduce heat and as such thay can reduce noise....in my mind that measn putting


A: a cheaper fan on it

or

B: making it spool slower


in which case either a or b the xbox will still get 2 hot because their going to cut cooling for less noise and their simply assuming the 65nm will bleed less heat but thats not true if they slow the fan down..


i think they should


A: leave the current loud ass fan in their but make the HS have a copper core like the P4 days

B: have a copper core cooler and just put a nice quite high cfm fan in their

Yeah, and if they do that you know they won't be able to keep the price competitive with the Wii (£159.99 for the Arcade - Wii is £179.99).

Microsoft is only JUST making a profit on the 360, but it's like $4 a console or something ridiculous like that.