techPowerUp! Forums

Go Back   techPowerUp! Forums > www.techpowerup.com > News

Reply
 
Thread Tools
Old Jan 25, 2010, 04:09 PM   #1
btarunr
Editor & Senior Moderator
 
btarunr's Avatar
 
Join Date: Oct 2007
Location: Hyderabad, India
Posts: 14,981 (7.31/day)
Thanks: 788
Thanked 12,895 Times in 5,647 Posts
Send a message via AIM to btarunr Send a message via MSN to btarunr

System Specs

JEDEC Anounces Publication of Specifications for SPD and Thermal Sensor Devices

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of a family of compatible device specifications for Serial Presence Detect (SPD) EEPROMs, Thermal Sensors (TS), and combination devices with both SPD and TS in a single package. The specifications offer advanced power management features for a wide array of applications, and may be downloaded free of charge at JEDEC.org.

“These chips are being applied in a wide range of applications from handheld devices to telecommunications equipment and data servers,” said Desi Rhoden, Chairman of JEDEC’s JC-42 Committee for Random Access Memory (RAM). He added, “The demand for green technologies has the industry looking for new ways to measure and conserve power. This family of devices gives a way to accurately measure temperatures to less than half a degree so that systems can automatically adjust their energy usage in response to customer’s needs.”

JEDEC’s JC-42.4 Subcommittee for Non-Volatile Memory developed the specifications, and has recommended that all three specifications be published together as a single standard, with the objective of promoting uniformity and ease of device specification. The proposed standard provides for multiple packaging options, including low cost plastic packages, and offers compatibility with industry standard I˛C and SMBus low pin count serial buses. These specifications include variations for narrow or wide range voltage options for compatibility with serial buses in common use today. In addition, the specifications for the TS3000 and TSE2002 devices also have a central heat paddle integrated into the package to deliver thermal sensing directly to the die, improving sensing accuracy.

The TS3000 specification defines the parameters for a standalone thermal sensor with high accuracy across a wide temperature range. It supports a sideband interrupt signal to the system that high or low temperature thresholds have been crossed. The EE1002 specification defines the characteristics of an electrically erasable programmable read only memory (EEPROM) incorporated as a Serial Presence Detect on all JEDEC standard memory modules. This SPD device has a content protection feature that prevents modification in end-user applications, but which is reversible in supplier manufacturing processes. The TSE2002 specification covers a combination device that incorporates the functions of both TS3000 thermal sensors and EE1002 SPD EEPROMs in a single chip.
btarunr is offline  
Reply With Quote
The Following User Says Thank You to btarunr For This Useful Post:
Old Jan 25, 2010, 04:28 PM   #2
[I.R.A]_FBi
Eligible for custom title
 
[I.R.A]_FBi's Avatar
 
Join Date: May 2007
Location: c:\programs\kitteh.exe
Posts: 6,152 (2.81/day)
Thanks: 724
Thanked 556 Times in 461 Posts

System Specs

No more wierd sensors?
__________________
Rig 1+1
Athlon XP 2200+, MSI KM2M Combo, ATI 9200SE 128 MB DDR, 2 X 512 MB DDR333, 250GB + 80 HDD?

“try intel cpu, amd is only good for going to nude sites” -firehawkxd
“go for the 5850 now and play games while the nvidiots wait for the ceo to show an actual working product” -W1zzard
“An MSI logo? This offends my retina. I await your apology.” -MRCL

www.autolounge.com.jm
[I.R.A]_FBi is offline  
Reply With Quote
Old Jan 25, 2010, 10:52 PM   #3
Bundy
1000 Posts
 
Bundy's Avatar
 
Join Date: Oct 2007
Location: Caboolture, Australia
Posts: 1,070 (0.53/day)
Thanks: 189
Thanked 165 Times in 141 Posts

System Specs

Quote:
Originally Posted by btarunr View Post
This SPD device has a content protection feature that prevents modification in end-user applications, but which is reversible in supplier manufacturing processes..
I wonder if this means that a version of SPD tool for this spec will be impossible?

Would mobo BIOS would need updates to recognise this? lol, I suppose I could read the specs.
Bundy is offline  
Reply With Quote
Reply


Currently Active Users Viewing This Thread: 1 (0 members and 1 guests)
 
Thread Tools

Posting Rules
You may not post new threads
You may not post replies
You may not post attachments
You may not edit your posts

BB code is On
Smilies are On
[IMG] code is On
HTML code is On

Forum Jump

Similar Threads
Thread Thread Starter Forum Replies Last Post
How does GPU-Z retrieve thermal sensor data ? MoonDust GPU-Z 4 Jul 3, 2009 01:03 PM
JEDEC and SFF Announce Plans to Collaborate on Standards Development for SSDs btarunr News 0 Jun 3, 2009 03:10 AM
JEDEC Announces Publication of LPDDR2 Standard for Low Power Memory Devices malware News 2 Apr 7, 2009 01:45 AM
Build your own thermal sensor ram cooler technicks Cases, Modding & Electronics 29 Dec 31, 2007 12:49 AM
Where to place a thermal sensor on the mobo? KBD Motherboards & Memory 6 Jul 2, 2007 08:21 PM


All times are GMT. The time now is 12:43 PM.


Powered by vBulletin® Version 3.8.6
Copyright ©2000 - 2013, Jelsoft Enterprises Ltd.
no new posts