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#26 |
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I still don't like the idea though. I'd rather use a large heatsink like this in a bench system.
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#27 | |
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Quote:
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#28 |
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Backplates are for eliminating warping by redirecting pressure to directly under the socket. if the cooler is too heavy it could still warp the board by pulling the PCB within the four screw holes.
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#29 |
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The backplate spreads the weight out over the back of the board, the PCB will not warp with a proper backplate.
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#30 |
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A proper backplate should not "spread the weight out over the back of the board", it's suppose the "concentrate" the mounting pressure directly under the socket to avoid warping.
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#31 | |
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#32 |
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It seems to me that the only way to have a more efficient AIR heatsink and not be HUGE would be through metalurgy. If they come up with new materials with better thermal conductivity and lighter weight. Otherwise, they just get bigger and bigger, surface area is the name of the game here. Maybe come up with something dense like a car radiator? With all the twists and folds the surface area increases and therefore can dispirse more heat. Thats the only thing i can think of. Or...water cool!
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#33 |
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Kind of favors my Scythe Mugen two just a little bit, and I mean a little bit. I like it though.
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#34 |
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Have you ever looked at a backplate? They touch the entire back of the board, not just under the socket. They are not to concentrate the mounting pressure directly under the stocket, they are to spread the weight and pressure out over a greater area of the board. If they wanted to concentrate the pressure behind the socket, the only place the backplate would touch would be behind the socket(think xbox x-clamp), but that isn't the case.
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#35 | |
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Quote:
The backplate is supposed to put the pressure of the cooler onto the CPU so that it doesn't mount unevenly and makes sure it touches the CPU properly. It may spread it, but not much. The backplate still only has about 9-10cm of coverage.
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#36 | |
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With an AMD setup, there is already a backplate, however the coolers normally connect to the weak plastic frame. This is why I said a bold-thru kit is needed, as it eliminates the weak plastic, and puts the weight directly on the backplate. If the backplates were designed only to put preassure on the CPU, then the only place they would touch on the motherboard would be the back of the CPU. This obviously isn't the case. In face, for the 775 and AM2 backplates, they actually are cut out so they don't touch behind the CPU socket, because there are components back there that would break if they did. Backplates are used to increase mounting pressure, I'm not denying that, but they are also used to spread the weight of the cooler out over more area of the board.
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#37 |
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newtekie has it right.
intel use the stupid push pins which put the pressure on the mobo, AMD use a backplate but due to the lever/hook design the pressure is on that, not the backplate.
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#38 | |
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Until we go back to like the early P4s where the heatsink was screwed onto mounting holes on the case rather than a bracket attached to the motherboard which will make sure there is no movement at all (unless your cases flexes because you're in a volcano), I have no intention of putting a big cooler like this in my computer.
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