Samsung Develops 16-Chip Stack Package Memory

[D_o_S]

Samsung Electronics announced that it has developed the industry’s first process to enable production of a 16-chip multi-chip package (MCP) of memory. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16GB MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning, redistribution layer, chip sawing and wire bonding.

To increase the number of chips stacked vertically, Samsung introduced wafer-thinning technology that eliminates 24/25th of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns. This is just 65 percent the thickness of the 45-micron 10-chip MCP wafer Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.



Source: Daily Tech

[randomperson21]

16gb ipod nanos, perhaps? schweet!

[Firedomain]

hang on..... with tech upgrades like this could we be looking at HUGE RAM upgrades soon?????

well i guess in the long run it'll happen anyway.
seeing as an old comp my dad had had a 250MB HDD & now i have a 320,000MB HDD

hmmm... what kind of gaming will the world be in control of in another 10 years...?

[magibeg]

i'm thinking alone the lines of Doom 6 and Half-life 4. Or you should shake things up with some final fantasy 37 :P. I hope they do come to computers, could be one more step towards eliminating harddrives altogether