Intel To Shrink Penryn For SFF

HellasVagabond · Jul 18, 2007, 05:39 AM

With the desktop PC market heading toward SFF (small form factor), Intel makes plans to shrink its newest Penryn processors.
Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller. Penryn will launch first as a 35mm square SV version in the second quarter of 2008 while the LV and ULV are scheduled for the second half.

Intel will launch its next generation Centrino platform, Montevina, in the second quarter of 2008. The platform will consist of 45nm Penryn processors, Cantiga GM/PM northbridge chipsets, and the ICH9M southbridge. The platform will also support the Wi-Fi/WiMAX wireless module codenamed Echo Peak, and the 802.11n wireless module codenamed Shirley Peak. Chipsets will support DDR2/DDR3 memory and the graphics engine will have built-in DisplayPort and HDMI/HDCP support, added the sources.

Source: Digitimes

tkpenalty · Jul 18, 2007, 06:15 AM

35nm is seriously getting small.

anticlutch · Jul 18, 2007, 07:10 AM

Quote:

Originally Posted by tkpenalty

35nm is seriously getting small.

I thought he was talking about the size of the chip itself, not the technology (i.e. 65nm, 45nm, etc.)

Either way, it sounds pretty exciting

WarEagleAU · Jul 18, 2007, 01:37 PM

Yeah I saw that 35mm and 22mm and I was thinking the die shrink but I believe he is mentioning the size of the chip not the fabrication size.

D3aDl0cK · Jul 19, 2007, 05:31 PM

Of course its the die size as it is "mm"
what would be a very large

production size.
(btw. 1000000nm = 1mm)

Jul 18, 2007, 05:39 AM	#1
HellasVagabond Join Date: Jan 2007 Location: Athens , GREECE Posts: 2,695 (1.17/day) Thanks: 14 Thanked 168 Times in 140 Posts System Specs	Intel To Shrink Penryn For SFF With the desktop PC market heading toward SFF (small form factor), Intel makes plans to shrink its newest Penryn processors. Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller. Penryn will launch first as a 35mm square SV version in the second quarter of 2008 while the LV and ULV are scheduled for the second half. Intel will launch its next generation Centrino platform, Montevina, in the second quarter of 2008. The platform will consist of 45nm Penryn processors, Cantiga GM/PM northbridge chipsets, and the ICH9M southbridge. The platform will also support the Wi-Fi/WiMAX wireless module codenamed Echo Peak, and the 802.11n wireless module codenamed Shirley Peak. Chipsets will support DDR2/DDR3 memory and the graphics engine will have built-in DisplayPort and HDMI/HDCP support, added the sources. Source: Digitimes

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Jul 18, 2007, 06:15 AM	#2
tkpenalty Eligible for custom title Join Date: Sep 2006 Location: Australia, Sydney Posts: 5,023 (2.07/day) Thanks: 412 Thanked 361 Times in 266 Posts System Specs	35nm is seriously getting small. __________________ AMD Radeon X1950~HD4000 Support Clubhouse “Mac: "Woah, what are you doing?" Mac says as he levitates in the air. PC: "Playing Half-Life 2, this is my gravity gun." Mac: "Well I can sort of do that." PC: "Technically Mac, you have to become me first."” -From_Nowhere

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Jul 18, 2007, 01:37 PM	#4
WarEagleAU Bird of Prey Join Date: Jul 2006 Location: Gurley, AL Posts: 9,994 (3.99/day) Thanks: 3,810 Thanked 557 Times in 521 Posts System Specs	Yeah I saw that 35mm and 22mm and I was thinking the die shrink but I believe he is mentioning the size of the chip not the fabrication size. __________________ =-TheEagle-= http://www.heatware.com/eval.php?id=62454 “You crazy? Surfing any website without an antivirus is like freaking with a dirty woman without protection” -OzzmanFloyd120 - Edited for content and clarity

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Jul 19, 2007, 05:31 PM	#5
D3aDl0cK Join Date: Aug 2004 Location: Germany Posts: 35 (0.01/day) Thanks: 0 Thanked 0 Times in 0 Posts System Specs	Of course its the die size as it is "mm" what would be a very large production size. (btw. 1000000nm = 1mm)

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