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Intel Foundry Services (IFS) today announced that it will commence mass-production on its first silicon fabrication node that leverages extreme ultraviolet (EUV) lithography, Intel 4. On September 29, the Intel 4 node will start rolling at the company's facility in Leixlip, Ireland, dubbed Fab 34. CEO Pat Gelsinger, Dr. Ann Kelleher, general manager of Technology Development at Intel, and Keyvan Esfarjani, chief global operations officer, will be present at a ceremony commemorating production of the first wafers.
Intel 4 is an advanced foundry that leverages EUV, and offers both transistor densities and electrical characteristics comparable to TSMC's 5 nm-class and 4 nm-class foundry nodes. Among the first chips to be built are the compute tiles of the company's Core "Meteor Lake" processors, which contain their next-generation CPU cores. Compared to the current Intel 7 node, Intel 4 offers double the area scaling for logic libraries, a 20% iso-power improvement, and introduces the new metal-insulator-metal (MIM) capacitor.
View at TechPowerUp Main Site
Intel 4 is an advanced foundry that leverages EUV, and offers both transistor densities and electrical characteristics comparable to TSMC's 5 nm-class and 4 nm-class foundry nodes. Among the first chips to be built are the compute tiles of the company's Core "Meteor Lake" processors, which contain their next-generation CPU cores. Compared to the current Intel 7 node, Intel 4 offers double the area scaling for logic libraries, a 20% iso-power improvement, and introduces the new metal-insulator-metal (MIM) capacitor.
View at TechPowerUp Main Site