1. Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

AMD A10-7700K "Kaveri" De-lidded

Discussion in 'News' started by btarunr, Jan 20, 2014.

  1. btarunr

    btarunr Editor & Senior Moderator Staff Member

    Joined:
    Oct 9, 2007
    Messages:
    28,561 (11.24/day)
    Thanks Received:
    13,644
    Location:
    Hyderabad, India
    Here are the first pictures of an AMD A10-7700K "Kaveri" APU with its integrated heat-spreader (IHS, or 'lid') removed. Put next to its predecessors, "Richland," "Trinity," and "Llano," AMD's new APU silicon is its biggest for the DIY PC market, more so because it's built on the 28 nm silicon fab process, compared to its predecessors being built on 32 nm. The die measures roughly 245 mm², and packs a staggering 2.41 billion transistors.

    Under the IHS, AMD is using a thermal paste to transport heat from the die, and not a solder. The chip should be easy to de-lid, if you know what you're doing. Kaveri integrates two "Steamroller" x86-64 CPU modules with two cores each, a total of 4 MB of L2 cache, a massive on-die GPU with 512 stream processors based on the Graphics CoreNext micro-architecture, a dual-channel DDR3 IMC with hUMA and DDR3-2400 native support; and a PCI-Express 3.0 root complex.

    [​IMG] [​IMG] [​IMG]

    Source: Akiba PC Hotline
     
  2. wotevajjjj

    Joined:
    May 28, 2012
    Messages:
    46 (0.05/day)
    Thanks Received:
    3
    Did they leave a part unglued to make delidding easier or is there another reason ?
    Cant wait to get my hammer out again
     
  3. RCoon

    RCoon Forum Gypsy

    Joined:
    Apr 19, 2012
    Messages:
    6,933 (7.83/day)
    Thanks Received:
    3,172
    Location:
    Gypsyland, UK
    They're doing it to save money, no other reason. Intel did it and got away with it, therefore so shall AMD.
     
  4. Vario

    Vario

    Joined:
    Oct 21, 2005
    Messages:
    2,918 (0.90/day)
    Thanks Received:
    916
    What are the long term prospects with that? Can the intel or amd thermal paste dry out under the lid?
     
  5. Fourstaff

    Fourstaff Moderator Staff Member

    Joined:
    Nov 29, 2009
    Messages:
    9,182 (5.22/day)
    Thanks Received:
    1,971
    Location:
    Home
    I don't think so, since most thermal pastes I have come across doesn't dry out. Maybe in extreme circumstances though.
     
    RCoon says thanks.
  6. RCoon

    RCoon Forum Gypsy

    Joined:
    Apr 19, 2012
    Messages:
    6,933 (7.83/day)
    Thanks Received:
    3,172
    Location:
    Gypsyland, UK
    When I delidded my 3570K, I had to repaste the IHS every 6 months because the TIM baked itself (MX-5), and temperatures just got worse over time. Not inoperable-worse, but a couple of degrees worse. Enough to screw up clocks at the far end of the spectrum after a few months of use.
     
  7. iO

    iO

    Joined:
    Jul 18, 2012
    Messages:
    70 (0.09/day)
    Thanks Received:
    15
    Location:
    Germany
    Looks like a vent hole to prevent a pressure built-up due to expanding air when the CPU heats up.
     
  8. TheGuruStud

    TheGuruStud

    Joined:
    Sep 15, 2007
    Messages:
    1,615 (0.63/day)
    Thanks Received:
    168
    Location:
    Police/Nanny State of America
    So long SOI. I do not welcome our shitty, new silicon overlord.
     
  9. buildzoid

    buildzoid

    Joined:
    Oct 29, 2012
    Messages:
    1,200 (1.73/day)
    Thanks Received:
    319
    Location:
    CZ
    I hope the next FX processors are still on 32nm SOI because this 28nm stuff doesn't clock at all 4.5Ghz average on HWbot right now and 4.8Ghz required over 1.55v sure these are 10% faster per clock but if they clock that much worse it really doesn't matter because 4.8Ghz x1.1 is equal to the 32nm SOI stuff running at 5.28Ghz which isn't very rare, d1nky even got his FX8350 all the way to 5.7Ghz on water cooling.
    As of right now the best process for OCing has got to be 32nm SOI(good on air water and LN2) and the worst is intel's 22nm(terrible on air/water ok on LN2) but this 28nm stuff might still be even worse.
     
  10. TheGuruStud

    TheGuruStud

    Joined:
    Sep 15, 2007
    Messages:
    1,615 (0.63/day)
    Thanks Received:
    168
    Location:
    Police/Nanny State of America
    Yep, glofo keeps talking a big game about fd-soi but no one's rich or ballsy enough to use it (that we care about).
     
  11. newtekie1

    newtekie1 Semi-Retired Folder

    Joined:
    Nov 22, 2005
    Messages:
    19,935 (6.18/day)
    Thanks Received:
    6,027
    Actually, it is there to allow gasses and pressure to escape while the epoxy cures. Everything with an IHS has an opening for this function, the old P4's used to have a hole in the IHS to allow this, but everyone has now switched to leaving a small gap in the epoxy.
     
    Crunching for Team TPU 50 Million points folded for TPU
  12. Freedom4556

    Freedom4556

    Joined:
    Dec 22, 2009
    Messages:
    78 (0.04/day)
    Thanks Received:
    17
    Location:
    AR, USA
    I think he was referring to Doh, can't read. The switch from solder to paste is very unfortunate, IMO, because this only hurts the kind of people who are buying APUs in the first place: mainstream and budget.

    And btw, the LGA 775 P4s had already switched to the vent slot. The hole was only for socket 478 P4s like Northwood:[​IMG]
    Compared to:
    [​IMG]
     
    Last edited: Jan 20, 2014
  13. Vario

    Vario

    Joined:
    Oct 21, 2005
    Messages:
    2,918 (0.90/day)
    Thanks Received:
    916
    I had the same experience and I traded it for a 2550k.
     
  14. xorbe

    Joined:
    Feb 14, 2012
    Messages:
    392 (0.41/day)
    Thanks Received:
    57
    Location:
    Bay Area, CA
    Can the high temp paste be carefully salvaged from within and reused with direct core contact?
     
  15. Steevo

    Steevo

    Joined:
    Nov 4, 2005
    Messages:
    8,303 (2.56/day)
    Thanks Received:
    1,188
    Solder is better for conductivity, but a good TIM can be made to perform a phase change with a high temp application during IHS installation and never again under normal operating temps.
     
    10 Million points folded for TPU
  16. newtekie1

    newtekie1 Semi-Retired Folder

    Joined:
    Nov 22, 2005
    Messages:
    19,935 (6.18/day)
    Thanks Received:
    6,027
    How does this hurt them? The paste will work just fine for people in the mainstream and budget area. Also, I'm pretty sure all the FM2 processors used paste and not solder.
     
    Crunching for Team TPU 50 Million points folded for TPU
  17. OC-Rage

    OC-Rage

    Joined:
    Oct 20, 2013
    Messages:
    84 (0.25/day)
    Thanks Received:
    3
    WOOOOOOOOOOOOOOOOOOOOOOWc 2.41 billion transistors
     
  18. RCoon

    RCoon Forum Gypsy

    Joined:
    Apr 19, 2012
    Messages:
    6,933 (7.83/day)
    Thanks Received:
    3,172
    Location:
    Gypsyland, UK
    Whatever you're talking about is not what I was talking about ...
     
  19. newtekie1

    newtekie1 Semi-Retired Folder

    Joined:
    Nov 22, 2005
    Messages:
    19,935 (6.18/day)
    Thanks Received:
    6,027
    I was talking about the gap in the epoxy, what wotevajjjj asked about. What were you talking about. and what does it have to do with what wotevajjjj asked?
     
    Crunching for Team TPU 50 Million points folded for TPU
  20. RCoon

    RCoon Forum Gypsy

    Joined:
    Apr 19, 2012
    Messages:
    6,933 (7.83/day)
    Thanks Received:
    3,172
    Location:
    Gypsyland, UK
    You quoted me when replying about epoxy, i was talking about the use of TIM between IHS and physical die.
     
  21. newtekie1

    newtekie1 Semi-Retired Folder

    Joined:
    Nov 22, 2005
    Messages:
    19,935 (6.18/day)
    Thanks Received:
    6,027
    Go read wotevajjjj's post that you quoted again. He is talking about why they left the part unglued, why there is a gap in the epoxy, you said it was to save money. Sorry for the misunderstanding, but it seemed like you were talking about the epoxy, since that is what wotevajjjj was talking about.
     
    Last edited: Jan 21, 2014
    RCoon says thanks.
    Crunching for Team TPU 50 Million points folded for TPU
  22. RCoon

    RCoon Forum Gypsy

    Joined:
    Apr 19, 2012
    Messages:
    6,933 (7.83/day)
    Thanks Received:
    3,172
    Location:
    Gypsyland, UK
    I don't honestly know how I deviated so far from what he was asking :laugh:
     
  23. newtekie1

    newtekie1 Semi-Retired Folder

    Joined:
    Nov 22, 2005
    Messages:
    19,935 (6.18/day)
    Thanks Received:
    6,027
    It happens, the TIM issue was in the OP, so you probably just had it in your mind.
     
    RCoon says thanks.
    Crunching for Team TPU 50 Million points folded for TPU
  24. grndzro7 New Member

    Joined:
    May 14, 2011
    Messages:
    7 (0.01/day)
    Thanks Received:
    1
    Intel used crap TP with Ivy bridge. That's why the performance was crap.
    Soldered lids do not have 100% surface contact. A good TP can actually provide better temperatures than Solder because of greater surface area.
     
  25. Freedom4556

    Freedom4556

    Joined:
    Dec 22, 2009
    Messages:
    78 (0.04/day)
    Thanks Received:
    17
    Location:
    AR, USA
    This is what I was getting at. If they use crap TP and it hurts overclocking, this will only affect people with no interest in de-lidding or replacing the TIM every 6 months. I suppose it makes no difference to stock performance.
     

Currently Active Users Viewing This Thread: 1 (0 members and 1 guest)

Share This Page