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ATI to use NanoFoil on R600

Discussion in 'News' started by D_o_S, Dec 14, 2006.

  1. D_o_S

    D_o_S Moderator

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    Probably all of us are eagerly awaiting the R600 from ATI. The news floating on the internet is mixed - some report that the chip runs cool and doesn't draw a lot of power, while others tell us the contrary.

    Hexus.net managed to find out some information about how ATI plans to cool the chip. Apparently, NanoFoil technology will be used. The technology works by having ultra-thin nanolayers of aluminium and nickel that can be controlled by heat, electricity or mechanical or optical stimulation, causing a reaction that gives off heat in a controlled fashion. The technology has been around since 2003, but hasn't yet been used to cool computer components.

    Source: Hexus
     
  2. overcast New Member

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    Well then!
     
  3. Track

    Track New Member

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    No matter what new technology they come up with, a stock cooler will always remain a stock cooler because ATI/nVidia arent going to bundle a 30$+ cooler with their cards..

    I hope Zalman gets news of this and starts to manufactur some DX10 card coolers..
     
  4. Exceededgoku

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    I can't honestly see this happening :S
     
  5. unsmart

    unsmart New Member

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    Nanofoil is a bonding/soldering material. http://www.llnl.gov/str/October05/Barbee.html
    The only way it will help with cooling is to form a better bond with the heat sink. Most likely they will use it on the heatspreader or this article is a little of and there using it to solder. I really hope ATI isn't dumb enough to fuse there stock heatsink to the chip:eek:
     
  6. D_o_S

    D_o_S Moderator

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    Yep, NanoFoil is used instead of the TIM.
     
  7. WarEagleAU

    WarEagleAU Bird of Prey

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    Agreed, though it does move and accomodate the different heat temps we are used to seeing with Video Cards.

    -The Eagle
     
  8. Frogger

    Frogger

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    reading the white papers on this stuff ..it would appear that IF they use it.. it will fuse the the sink to the chip... we have seen this before but can usually remove it .... this stuff might just be a littli bit more of a challange... :ohwell:
     
  9. ATIonion New Member

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    why would they do this?? ...unless they plan on releasing lines of product without heatsinks as well....

    would make it tough for aftermarket cooling.......especially for us H2O guys...that would suck...unless of course they release cards without cooling on them for cheaper prices...that could be nice...


    looking forward to the first reviews and "REAL" specs on that...:rockout:
     
  10. overcast New Member

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    Oh c'mon guys, don't be so negative. That's my job.
     
  11. unsmart

    unsmart New Member

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    I can't see them fusing the heatsink, it was more of a joke. There would be some real pissed folks if they did. I think the core2 is fused I'm not sure if they use nanofoil or not.
    How great is this stuff? Even the best TIM would give like a few deg drop and if it's that great I want some. Nano stuffs f#$# cool:rockout:
     
  12. Frogger

    Frogger

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  13. unsmart

    unsmart New Member

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    WoW, 8c diff! I hope that proves true in real world products.
    It would be great if someone released waterblocks or TECs perfused to chips as it appears not to be DIY yet.
     
  14. WarEagleAU

    WarEagleAU Bird of Prey

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    I dont think it will fuse onto the card. ATI has nothing to lose by allowing other companies to make aftermarket coolers. Just doesnt seem logical.

    -The Eagle
     
  15. ktr

    ktr

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    so basicly they gonna melt and sandwich some aluminum foil (renolds perharps) between the gpu and the heatsink...

    me-->:slap:<--ati cooling dev dept...
     
    Last edited: Dec 14, 2006
  16. Slater Guest

    Well it may be another P4 prescott-type deal (remember there was "epoxy" holding the IHS to the chip? Well it's probably the same thing.)
     

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