ATP Electronics released an internal USB solid state storage device. The device sits on one USB internal header cluster on the motherboard (occupying headers for two ports), to provide fixed storage of up to 4 GB in a package that measures 8.2 (L) x 15.3 (W) x 6.2 (H) mm. The package is dust, vibration and ESD resistant. It uses single-level cell (SLC) NAND flash chips, and provides speeds typical to storage devices connected over USB 2.0, around 30 MB/s. The device is said to be industrial-grade, and can be deployed in embedded computers. The package is advertised to be extremely durable, making use of the System In Package (SIP) technology that protects vital components.