Discussion in 'Overclocking & Cooling' started by <-_->, Aug 22, 2014.
and LGA2011-3 "Delid Die Guard"
Why is it bad news? For those that really care, this would be good news. If temps were actually a problem... or are you listening to reports from users with ES CPU? ROFL
That shows solder...
That also shows ES.... ROFL.
SO nothing to see here...
Well personally I was hoping for solder just to eliminate any potential chance of heat when running high overclocks. But on the same note I also expect a 500 dollar - 1000 dollar chip to have it personally. I just do not want to Delid the chip for optimal temps
Yea I was under the impression it was going to use solder...Sounds like they still are...
I would think a 140W or so chip would have solder too. But this is a good item to get hits, so whatever.
I just do not want the chip to be throttled with heat while over clocking even with an LC system. I just want to push it to the limit hence why I have liked the platform for quite some time! I still believe it is based on what is seen so far (Unless soldering is reserved specifically for the 8 core variant which I think would be odd).
As I said last time this news hit, that's a strong thermal EPOXY type glue and is not soldered.
It even says so on the original report of it being soldered wtf.
According to that article, it's "soldered TIM based on a strong epoxy". What does that actually mean? Those seem like two incompatible materials.
Die guards are for pussies.
I hate signatures, but I want that in mine......... Bwaaaaaaaahahahah!
Dave, how did you figure out from that picture that its an ES?
Because it's actually an older picture that I have seen before. Original source showed that it was an ES.
If they didn't use solder I would be fucking pissed off! Come-on AMD be good!
That no heat was used to bond it and that it is not soldered simples.
They have likely made it trickier and riskier to de lid via a higher bonding coefficient to dissway attempts imho .
I think you missed what I was stating. Intel can use solder or Intel can use epoxy, but there's no such thing as a soldered epoxy. Soldering by definition involves the flowing of a metal, and epoxy is not a metal, so you can't have a soldered epoxy. What guru3d is saying is gibberish.
I really hope this is just MSI thinking that because the die guard is a great feature for non-E Haswells that the same will imply to the new Haswell-E's. Either way I'm glad because if intel screws us and makes these chips with cheap TIM then atleast I can delid and use a die guard :/
I don't get it why are companies always saving on tiny stuff, making crap products just because they want more profit. Use a god damn solder and charge extra 5 bucks on every bloody CPU. When you pay freakin 400 bucks for a CPU, you won't gonna care about extra 5 bucks, and they'll still have the same profit as if they don't charge extra 5 bucks, but use shitty epoxy instead. Jesus.
For the cost of the CPU it will be solder.
and what, if not ... we are talking of Intel ... they could (would?) go skyrocket price for 2011-3 even with pasta tim
well ... as cadaveca wrote
nonetheless delidder could be happy with that news
Thats what im saying you silly sausage its NOT SOLDER , fourth time ive said it now and I said it when guru first wrote that article
OMG I want that die guard for my 3770K!
You guys really can't read between dave's lines huh?
Calm down, people. Haswell-E is NOT ivy-bridge \ haswell in terms of heat. Wait a bit and you'll see.
Oh wait the thread was started by someone with 0 post and gibberish name. Looks like there's nothing to be discussed here.
Dave likes to rofl a lot XD
That die guard reminds me of the anti die crusher copper shim Amd had years ago. I actually have one in a drawer somewhere I got in a trade.
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