Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has begun volume production of its industrial temperature SATA and PATA interface NANDrive embedded solid state drives (SSDs) using 2-bits-per-cell (MLC) NAND flash memory. Overcoming the temperature sensitivity risk of MLC NAND, industrial temperature (I-temp) SATA and PATA NANDrive operate between -40 and +85 degrees Celsius. Compared to significantly more expensive 1-bit-per-cell (SLC) NAND-based SSDs, I-temp MLC NANDrive offers cost-effective, ball grid array (BGA) products that meet quality and reliability requirements—such as avoiding uncorrectable errors and data retention issues—when the MLC NAND is operating at extremely low and high temperatures. NANDrive combines Greenliant's internally developed NAND controller with NAND flash die for a fully integrated SSD in a multi-chip package. Other benefits of GLS85LS SATA and GLS85LP PATA NANDrive include: Highly Efficient Wear Leveling Management: Achieves maximum SSD lifespan for critical applications Power Interrupt Data Protection: Ensures data integrity and reliability by promptly detecting and recovering from system power failures Configurable Security: Provides user-selectable protection zones and military-grade "instant" erase commands NANDrive Health Monitor: Estimates remaining SSD lifespan and takes proactive actions to prevent costly data loss "SATA and PATA NANDrive have been used in a multitude of embedded system designs to provide long life, small form factor and low power data storage," said Arthur Kroyan, vice president, business development and marketing, Greenliant Systems. "The addition of industrial temperature MLC NANDrive gives Greenliant customers more flexibility to select a rugged and reliable SSD that will meet their specific application needs, especially in the automotive, industrial and networking segments." Exhibiting at embedded world Greenliant will display the SATA, PATA and eMMC NANDrive product lineup in stand 503, hall 4A at embedded world 2013, Nuremberg, Germany, February 26–28.