Hynix Semiconductor Inc., today announced that it has begun mass producing 64 Gigabit (Gb) NAND Flash using 20nm class technology at its 300mm Fabrication, M11 in Cheongju site. The Company developed this cutting edge technology last February. Hynix’s 20nm class 64Gb chip doubles the density in a package over the current 32Gb product. 20nm class process technology also provides a 60% increase in productivity over Hynix's existing 30nm class technology. By providing these high density and cost efficient chips, Hynix will respond to the needs of advanced mobile solutions which require smaller size and higher density storage capacity. The Company said it has also developed NAND Flash solution products which combine Hynix’s 30nm class 32Gb Flash chips and controller devices from Anobit, an Israeli NAND-based solution provider, through a strategic alliance between the two companies. This solution product operates at a high speed and significantly improves the reliability as a storage device. The newly mass-produced 20nm class NAND Flash chips will also be combined with the controller device and will be validated in September 2010. "Hynix decided to mass produce the industry’s highest density64Gb chips using 20nm class technology in order to fully satisfy demand from the customers. With these 20nm class 64Gb chips, the Company is enabled to provide customized, high performance products in a timely manner which perfectly suitsmobile solutions including smartphones, table PCs and others,” said Dr. S.W. Park, Executive Vice President and Chief Technology Officer of Hynix.