I think my chip may be running hotter after delidding it now. I have applied paste about 20x in varying amounts and styles. I got a reduction of at best -5*C with CLP, for the application method that time I put a ton of it down covering the die and the backside of the lid. Unfortunately, I moved the case and it seemed like I lost that reduction amount (maybe the CLP slid out). I ran out of CLP and I am using AS5 (which I applied similarly) with loads around 70*C in Intel Extreme Utility/P95, idle around 30*C, email@example.com. This chip sucks so I actually need that much voltage to be stable. It sucked before delid and it sucks even worse after. Previously before delid was around 60-65*C load, 25-30*C idle. Ambient in my apartment has been around 22*C. Also my chip had not very much intel factory thermal paste under it when I delidded it initially, unlike pictures I have seen. The contact with the die is good, I have removed most of the black glue material on the pcb and I polish/sanded the contact part of the lid (where it would rest on the pcb) with 2500 grit to remove any glue on it that might result in less contact with the die. I ordered some CLU since I heard its easier to work with then the CLP. Any ideas? Edit: Also the lid seems to be flat. I checked it with a fresh razor blade. Update Edit with CL Ultra spread evenly on die and on IHS underside. CL ultra is also between IHS and H100i. -20*C Reduction in temps. Officially works great now.