IBM developing more efficient way to transfer heat away from the processor

Alec§taar · Oct 30, 2006

kakazza said:
More area = More heat can be transfered. The same way heaters work, just that his is for cooling ;p

So if there is more area on the IHS it can transport more heat to the copper cooler. And yes I think this will work. Not like -20°C but it will give some advantage.
Why? a) IBM scientists better know what they are doing, b) the 'more area = more heat dispense' has been used for decades anywhere where heat dispension is important.

You're "dead on right" & it's the SAME principal heatsinks use really... increase of surface area, via folding the surface & allowing for more of a "heat transferral event horizon".

APK

P.S.=> Personally, I wouldn't expect 'gigantic/knockout' blow-your-mind levels of better cooling, but it should work... IBM imo @ least, STILL has some of the finest most experienced minds out there in this field... apk

cdawall · Oct 30, 2006

well if they really wanted this to work right they would get w/ a hsf company and build a pair together as in lets say all sAM2 cpus are grooved in the same manner and all sAM2 hsf are grooved in the same manner they would interlock giving a larger surface area thus better heat transfer and then with that comes better cooling

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IBM developing more efficient way to transfer heat away from the processor

Alec§taar

New Member

cdawall

where the hell are my stars