here is some pics of the haswell chip Features carried over from Ivy Bridge A 22 nm manufacturing process. 3D tri-gate transistors (Ivy Bridge processors and onwards). A 14-stage pipeline (since the Core microarchitecture). Mainstream up to quad-core. Native support for dual channel DDR3. 32KB data + 32KB instruction L1 cache per core. 256KB L2 data cache per core and up to 32MB L3 cache shared by all cores. Confirmed features Advanced Vector Extensions 2 (AVX2) instruction set, also called Haswell New Instructions (includes gather, bit manipulation, and FMA3 support). New sockets — LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market. Intel Transactional Synchronization Extensions (TSX). Direct3D 11.1 and OpenGL 3.2 graphics unit Expected features 32 nm PCH. A new cache design. support for Thunderbolt technology. There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU). Another source, SemiAccurate, however says that the GT3 will have 40 EUs with an accompanying 64MB cache on an interposer. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs. New advanced power-saving system. Base clock (BClk) increase to 133 MHz. 128 bytes cache line. Execution trace cache will be included L2 caching design. Fully integrated voltage regulator, thereby moving another component from the motherboard onto the CPU. 25, 37, 47, 57W TDP mobile processors. 77/65/55/45/35W and ~ 100W+(high-end) TDP desktop processors. 15W TDP processors for the Ultrabook platform (multi-chip package like Westmere).