Intel officially launched new Clarkdale platform on 8th Jan. According to Intel UMA chipset, the 3D performance was falling behind AMD. Even Intel last generation G45 chipset, the 3D performance still cannot compete with his competitor. As Clarkdale platform launched, Intel royalty customers will look forward it. All users can find the price in internet and the Clarkdale platform price is still high now. Clarkdale structure is different with the chipset controller stage. Intel builds in GPU into CPU this time. It lets users misunderstand the 3D performance will be improved dramatically. Even some of my friends also think in this way. Actually, my last Core i5 661 review has showed the Clarkdale 3D performance just catch up AMD 785G. It’s been long time that Intel IGP products 3D performance is far away behind. At least Clarkdale platform is same as AMD IGP products. Before launching H55/H57, I think this is new segment for all MB makers well preparing for. This time, the review board is GIGABYTE latest GA-H55M-USB3. GIGABYTE is one of the three MB brands. Of course, this time they will provide many H55 models for choice. H55M-USB3 is with latest USB 3.0. It should attract many users who look for latest technology. Let’s start with MB package. Keep GIGABYTE consistent design style. Using white color for back and add in spec and features wording. 2oz PCB design, USB 3.0 spec are this H55 model key features. It bundle with manual, driver CD, Smart 6 user guide, quick installation guide, cables and I/O panel. GIGABYTE H55M-USB3 board Intel LGA 1156 32nm CPU double side The pic is Core i5 660, 2 physical cores and 2 virtual cores by HT(4 threading) CPU clock is 133 X 25, 3.33GHZ. The built-in GPU clock is 733MHz The difference with last 661 is the GPU clock is 900MHz. Back to MB outlook Lower Left Corner 2 X PCI-E X16, supports CrossFire dual VGA technology and bandwidth are X16+X4 2 X PCI LAN Chip is Realtek 8111D Audio Chip is Realtek ALC889, 7.1 channels and support Dolby Home Theater surround sound technology. Lower Right Corner 5 X blue SATAII, provided by H55 2 X white SATAII, GIGABYTE SATA2 chip provides. Support RAID 0, RAID 1 and JBOD. 1 X IDE，GIGABYTE SATA2 provides. Dual BIOS, dual protection Upper Right Corner 4 X DIMM DDR3, support 800/1066/1333/1600/1800/2200+ Max DDR3 capacity is 24GB and can OC to achieve DDR3 1600 up. DDR3 uses 2 phase PWM and next is 24-PIN power connector. Upper Left Corner LGA 1156 CPU socket Intel LGA 1336/LGA 1156 pin design is not as solid as LGA 775. This CPU socket design is very weak. Please read the installation guide in advance and insert carefully.