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Intel Shows Off Industry's First Fully-Patterned 450 mm Wafer

Discussion in 'News' started by btarunr, Jan 21, 2013.

  1. btarunr

    btarunr Editor & Senior Moderator Staff Member

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    At the SEMI Industry Strategy Symposium (ISS) held late last week, Intel unveiled the pride of its fabs, the industry's first fully-patterned (ready to slice) 450 mm wafer. Major semiconductor fabs around the world are locked in a race for who gets volume-production on 450 mm wafers going first. Among the contenders are Taiwan's TSMC, UAE's GlobalFoundries, and Korea's Samsung, and with the unveiling of the first fully-patterned wafer, Intel appears to have announced its lead. The 450 mm (diameter), thanks to its large surface area, significantly increases yields.

    "[This] is an important step forward and it indicates that there will soon be substantial volume of patterned test wafers for use by suppliers in developing their 450 mm tools," stated Chuck Mulloy, a spokesperson for Intel. As for what Intel etched on the wafer, a report claims it could be large dies of simple (highly-patterned) devices such as flash. The fab reportedly used Impints' J-Fil imprint lithography technology that demonstrated 24 nm patterning with line edge roughness of less than 2 nm to 3Σ and critical dimension uniformity to 1.2 nm 3Σ, offering the prospect of 10 nm patterning with single-step process.

    [​IMG]

    Source: X-bit Labs
     
    Jack Doph says thanks.
  2. btarunr

    btarunr Editor & Senior Moderator Staff Member

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    Many Thanks to NHKS for the tip.
     
  3. natr0n

    natr0n

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    It looks to be as if cookie monster had taken a bite out of that wafer.


    lol oh crap its a reflection and I just now see it.
     
    Aquinus and de.das.dude say thanks.
  4. The Von Matrices

    The Von Matrices

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    Out of curiosity, why weren't large wafers used a long time ago? Hasn't it always made economic sense to have large wafers?
     
  5. HumanSmoke

    HumanSmoke

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    From the good folks at Wiki:
    [source]
     
    The Von Matrices says thanks.
  6. de.das.dude

    de.das.dude Pro Indian Modder

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    so you slice this up like a pizza to get ivy bridge chips?
     
  7. _JP_

    _JP_

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    No. In a matrix.
     
  8. de.das.dude

    de.das.dude Pro Indian Modder

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    i know its in a matrix. :rolleyes:
     
  9. jihadjoe

    jihadjoe

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  10. xenocide

    xenocide

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    Additionally, one of the biggest problem points is polishing operations. It's not easy to get a wafer to polish evenly when you scale up the size...
     
  11. zithe

    zithe

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    He's wearing gloves but resting it on his shirt. I would have gotten in so much shit if I did that.
     
  12. btarunr

    btarunr Editor & Senior Moderator Staff Member

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    That wafer is already expendable after it's come in contact with normal air (normal SPM). It can't be diced, bumped, or packaged anymore. He's using gloves just to prevent ugly fingerprints.
     
    jihadjoe says thanks.

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