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Kingston Readies HyperX Genesis DDR3 Memory Series for Sandy Bridge

Discussion in 'News' started by btarunr, Dec 31, 2010.

  1. btarunr

    btarunr Editor & Senior Moderator Staff Member

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    Memory major Kingston Technology is ready to greet Intel's 2011 Core processor family with a new line of DDR3 memory kits tailored for it. The HyperX Genesis, as it's called, combines faster, lower-latency, and lower-voltage DDR3 memory with a new sporty-looking heatsink design that keeps the modules cool while maintaining standard module height. The heatsink is basically two sheets of metal interlocked at the top, with rows of holes to draw in convectional air currents, to cool the heatsink. Kingston's new HyperX Genesis series is expected to be out in early January, 2011.

    [​IMG] [​IMG] [​IMG]

    A video presentation showing the modules from almost all angles follows.

     
  2. makwy2

    makwy2

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    Looks pretty cool. I am left wondering what the color difference signifies and how useful those little holes really are to keeping the RAM cool.

    HyperX is usually quality RAM in my experience, hope this carries on that tradition!
     
  3. FreedomEclipse

    FreedomEclipse ~Technological Technocrat~

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    they speak of lower latencies but yet do not post what they are....ohMy
     
  4. Animalpak

    Animalpak

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    Cool !
     
  5. sneekypeet

    sneekypeet Unpaid Babysitter Staff Member

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    I'm sorry but the holes in these spreaders are hype. There is no way holes blocked by the PCB are letting in enough airflow to consider this spreader to keep anything cooler than a plain flat spreader.
     
  6. _JP_

    _JP_

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    No they're not. Those are speed holes, sneeky. Makes the RAM faster/cooler. :rolleyes:
    [​IMG]
     
    sneekypeet and Jizzler say thanks.
  7. WarEagleAU

    WarEagleAU Bird of Prey

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    Like the vented heat spreaders :)
     
  8. LAN_deRf_HA

    LAN_deRf_HA

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    Has there ever been any evidence that ram even needs heatspreaders? Like a spoiler on a cavalier. Seems ram doesn't respond much to minor temp changes. Even major ones like dice only net small overclock percentages, compared to cpus/gpus. If poking holes improves performance maybe airflow is what they needed to begin with, in which case no spreaders would free up some flow room.
     
    Last edited: Jan 2, 2011
    erixx says thanks.
  9. sneekypeet

    sneekypeet Unpaid Babysitter Staff Member

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    I did testing, and with DDR2 and very high speed DDR3 (say 2200+) there is an advantage. Most are just for looks!
     
  10. erixx

    erixx

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    Same here! And then you have watercooled RAMs.... nonsense unless you are taking part in overclocking competitions for money!
     
  11. sneekypeet

    sneekypeet Unpaid Babysitter Staff Member

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    Adding a simple $30 memory fan will drop temperatures considerably. No need to go extreme cooling until near 2600mhz speeds.
     

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