alexp999
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| System Name | Gaming Rig | Uni Laptop |
|---|---|
| Processor | Intel Q6600 G0 (2007) @ 3.6Ghz @ 1.45625v (LLC) / 4 GHz Bench @ 1.63v | AMD Turion 64 X2 TL-62 2 GHz |
| Motherboard | ASUS P5Q Deluxe (Intel P45) | HP 6715b |
| Cooling | Xigmatek Dark Knight w/AC MX2 ~ Case Fans: 2 x 180mm + 1 x 120mm Silverstone Fans |
| Memory | 4GB OCZ Platinum PC2-8000 @ 1000Mhz 5-5-5-15 2.1v | 2 x 1GB DDR2 667 MHz |
| Video Card(s) | XFX GTX 285 1GB, Modded FTW BIOS @ 725/1512/1350 w/Accelero Xtreme GTX 280 + Scythe sinks| ATI X1250 |
| Storage | 2x WD6400AAKS 1 TB Raid 0, 140GB Raid 1 & 80GB Maxtor Basics External HDD (storage) | 160GB 2.5" |
| Display(s) | Samsung SyncMaster SM2433BW @ 1920 x 1200 via DVI-D | 15.4" WSXGA+ (1680 x 1050 resolution) |
| Case | Silverstone Fortress FT01B-W ~ Logitech G15 R1 / Microsoft Laser Mouse 6000 |
| Audio Device(s) | Soundmax AD2000BX Onboard Sound, via Logitech X-230 2.1 | ADI SoundMAX HD Audio |
| Power Supply | Corsair TX650W | HP 90W |
| Software | Windows 7 Ultimate Build 7100 x64 | Windows 7 Ultimate Build 7100 x64 |
| Benchmark Scores | 3DM06: 19519, Vantage: P16170 ~ Win7: -CPU 7.5 -MEM 7.5 -AERO 7.9 -GFX 6.0 -HDD 6.0 |
Resisting the cold winter of industry, domestic leading memory-maker Team Group today announced two new DDR module series, Team Elite DDR3 1333/1066 for desktops and laptops in 1GB and 2GB capacities, with rich experience in R&D of DDR3 overclocking modules. Team also introduced the dual-channel kit for the Elite DDR3 LO-DIMM as a total solution for users upgrading their memory modules to avoid incompatibility among chips and with the motherboard. Team emphasized that every module has been tested to comply with all the relevant tests to ensure maximum compatibility and premium quality. Therefore, Team Elite DDR3 1333/1066 are the best choices for upgrading your PC efficiency!
While leading motherboard makers are aggressively promoting dual-core, quad-core and even octa-core CPUs, the market demand of advanced memory modules is escalating. This has urged DDR module makers to upgrade their DDR3 products. In addition to delivering faster speed than the DDR2 modules, new-generation DDR3 modules working at 1.5V save energy about 20% more compared with the DDR2 working at 1.8V; i.e. they are more eco-friendly in terms of energy conservation and carbon reduction. Continuing with the premium quality tradition of all DDR module series, Team insists on using genuine top-quality chips that have passed the longtime burn-in test. Also, all Team DDR3 modules are manufactured strictly according to the specifications specified by the JEDEC (Joint Electronic Device Engineering Council). Therefore, they are the standard feature for advanced PC users to upgrade their platforms.
According to Team President Danny Hsha, "The DDR3 specification has become the mainstream memory standard to cope with the new requirements of multi-core CPUs, emerging operating systems and applications. It is expected that the DDR3 will gradually replace the market dominance of DDR2 after Q3 2009. Team thus launches the new DDR3 series to meet the comprehensive requirements of consumers and to make the product range fuller. Eyeing the market potential of DDR3, we will adjust our operating strategies to deliver consumers the most and best suitable DDR modules."
Optional aluminum heat sinks are available for both Elite DDR3 1333/1066 (with/without heat sink based on products as shipped) to enhance chip cooling efficiency. The Elite DDR3 1333/1066 are high-speed, energy saving and high-efficiency, and come with a lifetime warranty from Team. If you want to learn more about Team DDR modules, please visit out site at teamgroup.com.tw.
View at TechPowerUp Main Site
While leading motherboard makers are aggressively promoting dual-core, quad-core and even octa-core CPUs, the market demand of advanced memory modules is escalating. This has urged DDR module makers to upgrade their DDR3 products. In addition to delivering faster speed than the DDR2 modules, new-generation DDR3 modules working at 1.5V save energy about 20% more compared with the DDR2 working at 1.8V; i.e. they are more eco-friendly in terms of energy conservation and carbon reduction. Continuing with the premium quality tradition of all DDR module series, Team insists on using genuine top-quality chips that have passed the longtime burn-in test. Also, all Team DDR3 modules are manufactured strictly according to the specifications specified by the JEDEC (Joint Electronic Device Engineering Council). Therefore, they are the standard feature for advanced PC users to upgrade their platforms.
According to Team President Danny Hsha, "The DDR3 specification has become the mainstream memory standard to cope with the new requirements of multi-core CPUs, emerging operating systems and applications. It is expected that the DDR3 will gradually replace the market dominance of DDR2 after Q3 2009. Team thus launches the new DDR3 series to meet the comprehensive requirements of consumers and to make the product range fuller. Eyeing the market potential of DDR3, we will adjust our operating strategies to deliver consumers the most and best suitable DDR modules."
Optional aluminum heat sinks are available for both Elite DDR3 1333/1066 (with/without heat sink based on products as shipped) to enhance chip cooling efficiency. The Elite DDR3 1333/1066 are high-speed, energy saving and high-efficiency, and come with a lifetime warranty from Team. If you want to learn more about Team DDR modules, please visit out site at teamgroup.com.tw.
View at TechPowerUp Main Site
