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TechPowerup IC Diamond Results Thread

Discussion in 'Overclocking & Cooling' started by IC Diamond, Aug 18, 2012.

  1. exodusprime1337

    exodusprime1337

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    No you aren't, i'm considering going back to mx4.. my temps are as follows on my computer. i'll grab screens if i need them

    SPECS: i7 2700k @ 4.8Ghz using 1.40v(1.39load), dtek fuzion v2.0 block, swiftech mcr320 rad and mcp655 pump in xspc dual bay res. Brand new cleaning and flushing of system 2 days ago

    Arctic cooling mx-4
    Ambient Temp:21
    Idle Temp:30
    Load Temp:60

    ICD
    Ambient Temp:21
    Idle Temp:34
    Load Temp:66
     
  2. popswala

    popswala New Member

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    It looks good during the test but yea I didn't notice the temps before the tests. That is a big difference.

    I'm sitting at 53 under full load runing BOINC 80%. I mite be switching back on the tim for that few deg differnce.

    - Whats a good prog that gives you your ambient/idle/load temps?
    I'll add that in to my results for better following.
     
  3. hat

    hat Maximum Overclocker

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    I like hwinfo32
     
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  4. Melvis

    Melvis

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    Every time i read the threads heading i think of Briggs and Stratton :laugh:
     
  5. IC Diamond

    IC Diamond Innovation Cooling Rep

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    Must have had misfire on your paper test - round contact area with a square print?

    Should have looked like 24 or 22 from the Table above

    This is 24
    [​IMG]

    This is 22
    [​IMG]

    Ideal paste thickness should look like the centre contact area here just a thin glaze of compound - keep in mind that with proper pressure and flatness the BLT will be only 15 to 20 microns thick. The compound is only thick at room temp @ 40C it will have similar viscosity characteristics to what you see with MX or AS5 at room temp and final mount should have a smooth even distribution.

    [​IMG]


    The C/P impressions mirror the paste contact impressions once you have a few comparisons you can read a paste impression as you would a C/P impression. - Areas of high contact thin glaze - Low contact/ light pressure areas excess compound


    [​IMG][​IMG]


    For comparison 9C would be the highest negative result out of 219 user tests for AS5 on 23 forums which would be unusual as the corsair mount system has proven to be a fairly stable mounting platform

    [​IMG]
     
  6. IC Diamond

    IC Diamond Innovation Cooling Rep

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    I am really interested in the water block disconnect - If you would do a C/P test I will send it out to sensor products for a full lab analysis.

    [​IMG]

    [​IMG]

    [​IMG]
     
  7. popswala

    popswala New Member

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    I might get around to running the test again later. I just happened to look at my case later in the night and noticed my exhaust fan went out on my rad. Thats the 2nd fan in that spot that went out. I swapped it out and my temps dropped 5*deg cel.
     
    stinger608 says thanks.
  8. IC Diamond

    IC Diamond Innovation Cooling Rep

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    My buddy Gilgamesh is a big water cooling fan and is putting together a library of as acquired water block C/P images The first here shows only at best about 25% contact for reference



     
  9. SonDa5

    SonDa5

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    Going to be testing against PK-1.
     
    Last edited: Aug 26, 2012
  10. stinger608

    stinger608 Dedicated TPU Cruncher & Folder

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    Was wondering why the 930 I was running a few weeks ago was running so damn hot. Well into the 80+ running a Corsair H50. Recently I put a different motherboard and a i7 920 in. Same thing, well into the 80+ area. Real Temp is showing the high being 85C:banghead:

    Granted, I am running WCG crunching at 80% but non the less it is way higher than my i7 2600K chip crunching at 90%. I know, I know, the i7 920's do run warmer than the newer generation of Sandy Bridge chips, but none the less.

    Well, this is what I found late last night.

    [​IMG]


    With that, I have to assume that the H50 is concave really badly!

    Zero center contact!!!! I am going to have to attempt to lap that sucker and try it again I guess. Hopefully that will cool things down some.
     
    Crunching for Team TPU More than 25k PPD
  11. IC Diamond

    IC Diamond Innovation Cooling Rep

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    Corsairs tend to be pretty good - Might check the IHS- pressure looks great
     
    Last edited: Aug 24, 2012
  12. erocker

    erocker Super Moderator Staff Member

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    If that imprint on the paper was done directly with the H50 block, it would be a good reason for a RMA. That is really, really bad. :ohwell:
     
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  13. popswala

    popswala New Member

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    Mine was under a H50 also. Its kinda tricky doing that test with the mounting ring in the way and trying to hold the paper from falling lol. I've thought about just lapping it but haven't gotten to getting some sand paper yet.
     
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  14. IC Diamond

    IC Diamond Innovation Cooling Rep

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    A dab of spit on the shiny side will help hold it in place
     
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  15. stinger608

    stinger608 Dedicated TPU Cruncher & Folder

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    Yep, it could be. Although I was getting the same terrible temps with the 930. However I didn't have the pressure paper to test it.

    Good thinking Erocker. However I purchased the cooler second hand. Maybe that is why I got it for a "great" deal. :laugh:

    You got that right man. It was a little tricky keeping it all together while mounting the cooler.
     
    Crunching for Team TPU More than 25k PPD
  16. hat

    hat Maximum Overclocker

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    I didn't have any trouble keeping the paper in place. I just set the paper on the die, put the block on, picked up the mounting ring with my right hand, twisted the block into place, pushed the clamp down on the block and screwed on.
     
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  17. DOM

    DOM

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    OPTIONAL INFO: i7 3770K, 1.3v/4.6GHz, h20, Enzotech SCW-REV.A, mcp655, T line, Black Ice GTX Xtreme 480 Radiator with 3x D12SH-12 fans pull, 7970 ek full wb

    Before Compound:gelid gc extreme
    Ambient Temp:
    Idle Temp:30
    Load Temp:86/87
    Capture.jpg


    ICD
    Ambient Temp:
    Idle Temp:30
    Load Temp:86
    Capture 2.jpg

    Updated

    IMG_2500[1].jpg

    ICD
    Ambient Temp:
    Idle Temp:28
    Load Temp:85/86
    Capture 3.jpg
     
    Last edited: Aug 25, 2012
  18. IC Diamond

    IC Diamond Innovation Cooling Rep

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    DOM, Did you try the contact paper?
     
  19. DOM

    DOM

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    yes i need to redo it user error :eek:

    ill do it again when i let it cure
     
  20. stinger608

    stinger608 Dedicated TPU Cruncher & Folder

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    :toast: yep that is pretty much what needs to be done for sure Hat! :rockout:
     
    Crunching for Team TPU More than 25k PPD
  21. erocker

    erocker Super Moderator Staff Member

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    Thanks for the thermal paste! I'm getting some testing done today between the IC Diamond and some MX-4. I should have results by Monday night as I get my 3770K on Monday. Testing a 2500K right now. :toast:
     
  22. SonDa5

    SonDa5

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    Got my IC diamond but it looks like the exact same tube that I bought last year. Is this a new formula?

    I thought I was going to be comparing an old formula IC Diamond to a new formula.

    Lucky I found some PK-1 laying around.
     
    Last edited: Aug 26, 2012
  23. CrAsHnBuRnXp

    CrAsHnBuRnXp

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    I remember using this stuff when it first came out. I had a B3 Q6600 at the time and it dropped my temps by 10*C. Was all right. I did a very mini review for it on another website a few years back.
     
  24. VulkanBros

    VulkanBros

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    Location:
    The Pico Mundo Grill
    ASUS Chrosshair Formula IV
    Antec KÜHLER H2O 920 with 2 x 120 mm push/pull
    AMD FX 8150 BE (Everything at stock for this test)

    Tomorrow I will conduct a overclocked test.

    Cure times are 2 hours with OCCT LinX pack.

    Will test these three compounds: (Picture one)
    1. Antec Formula 7 Nano Diamond
    2. IC Diamond
    3. Arctic MX-4 (will test this tomorrow)

    Test method:
    1. Heat sink unmounted and cleaned with acetone and at last isopropyl-alcohol.
    2. Take pressure test with pressure paper (Picture one)
    3. Appy TIM (center dot)

    Picture 2
    Antec Formula 7 Nano Diamond
    Ambient Temp:21,8
    Idle Temp:30
    Load Temp:35

    Picture 3
    IC Diamond
    Ambient Temp:21,7
    Idle Temp:31
    Load Temp:34
     

    Attached Files:

    Last edited: Aug 25, 2012
    Crunching for Team TPU
  25. t_ski

    t_ski Former Staff

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    I think the difference is that pops was trying to put in on with the board vertical. I thought it was kinda tricky, too. If the board was horizontal (laying the case on its side), it would be much easier to do.
     
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