Thermal Compound Application

[KuyaArnold]

So I did the pea method on my FX6300..

But then I had to fiddle with the Hyper212x around to secure it.. Will that be a problem on the integrity of the thermal compound since I moved, removed and placed the heatsink back multiple times?

 

[Sasqui]

My opinion... you should replace TIM everytime you remove a HS. Though moving it around on first application and pulling off is inevitable to get it seated right.

The answer is... check your temps. If you think you really squished it around unevenly, better to take it off and check to be sure.

I've always used the razorblade spread method, on both the chip and the heatsink. I've done the pea method before and it usually works, but occasionally I've seen some edges missed when the compound is squeezed.

 

[LaytonJnr]

I noticed a similar problem when I was installing my 212 EVO, but my temps are perfectly fine. But definitely check how your temps are doing - I never removed the heatsink, but it definitely moved about a lot during installation. Need to be careful of air bubbles, as they can cause problems with heat transfer efficiency.

Layton

 

[MxPhenom 216]

Every time you remove the cooler you should replace the TIM.

Also with a Direct Heatpipe cooler like the 212, you should put some on the heatsink base make sure it gets into the cracks of the heatpipes like grouting a floor, then do the pea size in the middle of the chip.

 

[KuyaArnold]

So all in all.. I should be fine? Just need to check the temps and re apply if need be?

I mean I looked at it when removed it and found no bubbles..

 

[BarbaricSoul]

yes

 

[Shambles1980]

with my direct heat pipe contact cpu cooler. i add some paste to the heat sink and make sure it gets in to the gaps. then i use the spread method on the cpu.
i find the small blob, small line, and the make an x method all fail to work properly with a direct contact heat pipe cpu.
i find drawing an x with small amount of thermal paste works best on a square based heat sink though, and the small blob/grain method works best with circular based heat sinks.
the single line method seems rather hit and miss though.

 

[Jetster]

If you moved the heat sink around during the instillation to line it up it will be fine. As long as you didn't take it completely off or let it sit for awhile then move it around

But when in doubt just replace the tim

 

[Trompochi]

Like others have said, its always good to replace tim after removing the cooler. I always use the spread method on the cpu and it always gives me the best results (I tried line, pea, X and I always had slightly higher temps). Now that my cooler has direct contact heatpipes (sadly, base finish not as nice as the 212 evo, but mounting system MUCH better) I also add a bit on the base as well.

 

[newtekie1]

My opinion... you should replace TIM everytime you remove a HS. Though moving it around on first application and pulling off is inevitable to get it seated right.

I agree, if you just have to wiggle it around a little it is fine to leave the old paste. But the moment you lift the cooler and "break the seal" you should replace the TIM.

This is why I usually mount the cooler dry first if it is a mounting system I'm not familiar with. I mount it dry to figure out how to mount it, then remove it and apply the TIM.

 

[Vario]

Check the temps, I have had some horrendous looking thermal paste applications that tested better than some of my better looking "internet approved" ones. It can be hit or miss.