Thermal paste

[Athlon2K15]

on hdt coolers you put two thin lines of paste. on non hdt cooler pea size is acceptable if your using anything with peanut butter consistency ie MX4,GL Extreme. with things with water consistency i use the BB size IE GC2, NH-T1 ,AS5

 

[LAN_deRf_HA]

I wouldn't trust hardware secrets at all. They don't even know how to properly apply paste to a HDT. Used twice as much as they needed. Note the last method http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=5

Comparison of dot and x method spread. http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=4

I'd really avoid a tiny dot or manually spreading it razor thin. The thing is most coolers and chips don't fit together perfectly. The chips tend to be concave to varying degrees and the heatsinks don't always compensate for that, or they do but it just doesn't match the exact curve of the chip. If you've lapped the chip and sink then a razor thing application would probably be the best performing.

 

[Norton]

I wouldn't trust hardware secrets at all. They don't even know how to properly apply paste to a HDT. Used twice as much as they needed. Note the last method http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=5

Comparison of dot and x method spread. http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=4

I'd really avoid a tiny dot or manually spreading it razor thin. The thing is most coolers and chips don't fit together perfectly. The chips tend to be concave to varying degrees and the heatsinks don't always compensate for that, or they do but it just doesn't match the exact curve of the chip. If you've lapped the chip and sink then a razor thing application would probably be the best performing.

If the lapping was perfect, no TIM would be needed at all. The contact area between the 2 materials would match on an atomic level and thermodynamic heat transfer from chip to heatsink would be 100%

Too bad that perfect is only a concept and there are only varying degrees of close enough TIM serves to enhance close enough... too much = insulator and fail, too little= insufficient heat transfer and fail

 

[arnoo1]

It seems that noctua makes good thermal paste, but i still artic silver 5 but is conductive, but i don't care xd i know where to put it and where not xd

 

[specks]

I just put a little bead in the middle of the IHS about the size of a grain of rice or smaller

 

[arnoo1]

I spread a thin later of thermpaste all over my cpu's and than put my heatsink on it, i always have great temps

 

[ThE_MaD_ShOt]

I also use the small bead like a grain of rice and then spread it with a credit card or what ever just happens to be handy at the time. I also have been using as cremique recently due to running out of the "good" stuff and it's been doing great.

 

[fullinfusion]

A BB size in the middle and LET THE HSF-WB FLOW THE COMPOUND ON ITS OWN!
Time to close this thread!

 

[trickson]

One thing is for sure there are many ways to apply thermal past just a dab will do .

 

[fullinfusion]

One thing is for sure there are many ways to apply thermal past just a dab will do .

24 on that big Buddie! less is better